At 03:53 PM 11/29/2001 -0600, Jeff Stout wrote: >1. Can I use a hole pair that goes through the prepreg, but >does not go through the core material above or below that >level? I just don't see how it can be manufactured.
No. At least not to my knowledge. My understanding of the process is that basically you can only use blind vias on cores. You may not connect cores to one another except with full through-hole vias. Exception: If you have 2 internal cores you can prepreg these together and then drill through them... plate to connect these cores together, and then prepreg more cores to the outside of that unit, through-hole drill the whole thing and plate again, etc, etc, etc. >2. Does anyone have an opinion on using B&B vias in a >PCB for hi temperature hi vibration environment? We have not had any problem with high shock & vibration or temperatures to 85C. However, we do not extensively temp-cycle, and we were not using military standards. Frank Gilley Dell-Star Technologies (918) 838-1973 Phone (918) 838-8814 Fax [EMAIL PROTECTED] http://www.dellstar.com * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/proteledaforum@techservinc.com * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
