The responses in this thread, quite appropriately, have focused on standard printed-circuit board technology. However, that is not the universe. I'm working now with a co-fired ceramic module technology that has only one restriction on vias:
(1) a via stack should not be more than 20 layers (the process supports 50 layers....), or it may create a bump on the surface. If one wants to cross more layers, the via should be dog-legged. Other than that, a via may go from any layer to any layer, providing, of course, that it exists in the layers in between!!! [EMAIL PROTECTED] Abdulrahman Lomax Easthampton, Massachusetts USA * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
