The responses in this thread, quite appropriately, have focused on standard 
printed-circuit board technology. However, that is not the universe. I'm 
working now with a co-fired ceramic module technology that has only one 
restriction on vias:

(1) a via stack should not be more than 20 layers (the process supports 50 
layers....), or it may create a bump on the surface. If one wants to cross 
more layers, the via should be dog-legged.

Other than that, a via may go from any layer to any layer, providing, of 
course, that it exists in the layers in between!!!

[EMAIL PROTECTED]
Abdulrahman Lomax
Easthampton, Massachusetts USA

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