I would forsee no technical problems in plating a countersunk hole, assuming that the boring is done before copper plating. As long as that hole processing comes before electroless copper, it *will* be plated. I suppose some processes might take the copper back if the bore wall was not protected during etch, but assuming that pad area in the artwork covered the bore area, I'd expect it to work. If you *don't* have pad there, then there might be problems.
I would suggest, for fabricator convenience, using a unique hole size for the countersunk holes; a fab note can then refer to that nominal hole size and give special instructions. I'd make the hole size (what PRotel thinks is the hole) as large as the bore max diameter and the pad larger than that, this will ensure clearance on all layers including negative planes; I would not go below this in hole or pad size unless it was absolutely necessary, in which case one would have to be more careful when checking the design. [EMAIL PROTECTED] Abdulrahman Lomax Easthampton, Massachusetts USA * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/proteledaforum@techservinc.com * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
