I am doing some via-in-pad BGAs and need to figure out if there is a
"good" way to provide the top solder and top paste masks while keeping
the bottom solder mask and bottom paste masks off.
I defined the BGA pads as multilayer since I am doing via-in-pad (sort
of like it was a PGA) except I do not want holes in solder mask on the
bottom and I do want holes in the paste mask on the top.
I have tried several rules combinations without success, and so far the
only way I can see to do it is to:
1) set the solder mask for tenting (no openings top or bottom) in
pad specification (advanced tab). This makes sure I have no
openings in the bottom solder mask.
2) draw arcs (donuts) on the top solder and top paste layers for
each pad where the trace width of the arc is such that there is
no hole in the donut and the outer edge matches the opening
required in the masks.
Does anyone have a better solution?
David W. Gulley
Destiny Designs
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
* To post a message: mailto:[EMAIL PROTECTED]
*
* To leave this list visit:
* http://www.techservinc.com/protelusers/leave.html
*
* Contact the list manager:
* mailto:[EMAIL PROTECTED]
*
* Forum Guidelines Rules:
* http://www.techservinc.com/protelusers/forumrules.html
*
* Browse or Search previous postings:
* http://www.mail-archive.com/[email protected]
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
