in a small effort to repay some the great help i have gotten here
following is some info i have gathered re silver through hole:
silver via pitch 1.5mm
silver via hole size 0.45mm (0.5 recommended)
silver via land 1.05mm
(don't make vias >0.6mm hole, the goop is costly)
lines 0.15mm
line spaces 0.15mm
solder mask clearance 0.1mm
silver thickness top 0.40mm
silver thickness bott 0.75mm
bd thickness 1.2mm or 1.6mm
this is 2002 tech from a korean shop
road map tightens up in 2003 but only a little
Dennis Saputelli
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