Hello everyone, I was wondering if anyone could help me with this question. I built a 8 layer pcb with through hole components. I used 0.032" hole diameter and 0.050" gold plating. I have to use HMP (high melting point) solder and found that is really hard to get a good solder flow. I was wondering if anybody has done anything like this and what the recommended hole size would be under these conditions. Thanks for your help,
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