Hello everyone,

I was wondering if anyone could help me with this question. I built a 8
layer pcb with through hole components. I used 0.032" hole diameter and
0.050" gold plating. I have to use HMP (high melting point) solder and
found that is really hard to get a good solder flow. I was wondering if
anybody has done anything like this and what the recommended hole size
would be under these conditions.
 
Thanks for your help,
 

Carlos



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