I used HMP solder once and it seemed to have either no flux in it or the flux burnt off very fast due to the high temps. You could try using extra flux. The other problem is soldering to gold plating. The solder reacts to the gold and will cause embrittlement of the joint. Im not sure the solution to that, maybe scrap off the gold plating with a sharp blade?
BR Clive "Carlos Claveria" <[EMAIL PROTECTED]> on 27/02/2003 09:08:34 AM Please respond to "Protel EDA Forum" <[EMAIL PROTECTED]> To: [EMAIL PROTECTED] cc: (bcc: Clive Broome/sdc) Subject: [PEDA] Through hole IPC recommendations Hello everyone, I was wondering if anyone could help me with this question. I built a 8 layer pcb with through hole components. I used 0.032" hole diameter and 0.050" gold plating. I have to use HMP (high melting point) solder and found that is really hard to get a good solder flow. I was wondering if anybody has done anything like this and what the recommended hole size would be under these conditions. Thanks for your help, Carlos * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[EMAIL PROTECTED] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
