Carlos You also need to consider your thermal releifs in the inner planes as this can play havoc with your solderability.
Ian ----- Original Message ----- From: "Carlos Claveria" <[EMAIL PROTECTED]> To: <[EMAIL PROTECTED]> Sent: Thursday, February 27, 2003 8:08 AM Subject: [PEDA] Through hole IPC recommendations > Hello everyone, > > I was wondering if anyone could help me with this question. I built a 8 > layer pcb with through hole components. I used 0.032" hole diameter and > 0.050" gold plating. I have to use HMP (high melting point) solder and > found that is really hard to get a good solder flow. I was wondering if > anybody has done anything like this and what the recommended hole size > would be under these conditions. > > Thanks for your help, > > > Carlos > > * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[EMAIL PROTECTED] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
