Dom,

I did something similar on a board a while ago. I wanted Multilayer pads
with one side covered with soldermask and the other side tinned.

The way I did it was to make the pads tented (or alternatively you could
define a negative soldermask setting) and on the side I wanted tinned, I
placed full, thick circles on the soldermask layer right over the pads with
the correct expansion setting. In your case, you could do it with fills. Or
even one big fill right across the whole connector where you want the pads
tinned (providing the pitch is fairly small, that is...).

My $0.02

TC


----- Original Message ----- 
From: "Dom Bragge" <[EMAIL PROTECTED]>
To: "Protel EDA forum" <[EMAIL PROTECTED]>
Sent: Monday, April 05, 2004 3:32 PM
Subject: [PEDA] soldermask defined pad (not BGA)


> I have an SMT connector with skinny pads.
>
> I wish to change my footprint so that the pads are 3 times as long BUT
> the soldermask still defines the physical pad as in the original i.e.
> only a third of the new length of the pad.
>
> Can you think of any 99SE tricky ways of doing this?
>
> It seems to me that I might need to bluff protel with multiple co-sited
> pads or something, so that I get the extra large pad without an SM
> being generated for it & then maybe a smaller pad (directly on top)
> which will be used to define the SM opening.
>
> ??
>
>
> =====
> --        (99SEsp6)
> Dom Bragge CID
> Snr PCB Designer
> Sydney, Australia
>
> Find local movie times and trailers on Yahoo! Movies.
> http://au.movies.yahoo.com
>



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