RE: Added paragraph

1998-10-09 Thread Peter Tarver
Better yet, how about the subscribers taking the additional two or three
seconds it takes to do the responsible thing and delete it themselves?

Peter L. Tarver
Nortel
ptar...@nt.com
 -Original Message-
 From: Robert Macy [SMTP:m...@california.com]
 Sent: Thursday, October 08, 1998 12:05 PM
 
 Is there anyway to remove the paragraph emc-pstc adds to the msgs?
 
 I archive all the msgs and it's starting to look like 30-40% of the text
 are those paragraphs!  It's really noticeable when a quoted msg has a
 quoted msg with a quoted msg.
 
 Don't get me wrong.  That paragraph is really handy.
 
 There must be a way to add that paragraph without it automatically
 transferring.  I know because when I shot back some spam, the 10 pages
 disappeared into only the introducing paragraph (which was very
 innocuous).
 
 If you guys can figure out how to add the paragraph but not have it
 requoted when we quote the msg, I'd really appreciate it....or make it
 much smaller?
 
   - Robert -
 

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Re: Shield Room Grounding

1998-10-09 Thread ed . price



  From: Scott Roleson sc...@hpsdde.sdd.hp.com
  Subject: Re: Shield Room Grounding
  Date: Thu, 8 Oct 1998 14:17:56 -0700 
  To: emc-p...@ieee.org
  Cc: sc...@hpsdde.sdd.hp.com


 
 Barry Ma forwarded to me a message from Peter Hays that said:
  
  Can someone tell me what is the best method to find out and ensure 
  that a screen room is adequately grounded?

(SNIP)
 
 There is some debate on this single-point ground approach.  I know
 some people who think it doesn't matter, so long as the room doesn't
 have any gaps so that ALL potentially interfering currents stay on 
 the outside surface of the room.  This may be true, but in practice
 it's not always possible to have a room without any holes or gaps.
 
   -- Scott Roleson
 

Scott:

Grounding for safety is a must, since a shielded enclosure will almost always 
have a set of low-pass powerline filters which bring the 60Hz power into the 
equipment within the room. These filters usually have a few large (15uF or so) 
capacitors from line to filter case to bypass RF currents. Since the capacitors 
also have a modest Xc at 60 Hz, there will also be a 60 Hz current component to 
the filter case. If the room isn't grounded, a hazardous voltage potential can 
exist on the room wall. A person standing on the concrete floor of the parent 
structure can get a very serious shock just by reaching out to open the door 
handle or to connect a coax cable to a port. So, for almost every situation, we 
have to ground the room to protect the people around it.

But grounding for RF shielding effectiveness isn't needed. A copper spherical 
Faraday cage floating in mid air (what a sight!) would make an fine RF shield. 
The shielding would be limited primarily by the gaps, intentional seams and 
accidental cracks and gaps. But... it's not very useful. Let's land that baby 
and now think of it as a shielded room.

To be of any use, this room has to be big, say 10 feet tall. And maybe 30 feet 
wide. Now, let's get very simplistic. To an RF wave, propagating along happily 
in air, your room looks like a little old antenna. I mean, it's conductive, and 
it has a height above ground. An effective height. Right, it looks like a 
stubby, broadband vertical monopole above a ground plane. And that RF wave 
gives that antenna a present; it induces some RF current into the conductive 
structure.

Now, that RF current would like to flow, along the outer surface of the 
conductor (skin depth effect), somewhere. By providing a single, well defined 
ground path, you prevent that current from flowing along paths which would 
create problems. What problems? Well, imagine the current flowing to ground 
through the outer jacket of a coax cable connected to a grounded spectrum 
analyzer. The noise currents would sum with the valid RF currents on the 
analyzer coax.

Now, with all that said, let me tell you a story. At both General Dynamics and 
Cubic in San Diego, I needed a large shielded room (for the EUT) and a smaller 
shielded room or antechamber (for the program support equipment. (Support 
equipment is notorious for being built just barely able to work, with a rat's 
nest construction and no thought to EMC.)

At GD, I had a solid, welded main room and a modular, 8' cube antechamber. At 
Cubic, I have a modular main room and a modular, screen antechamber. Both 
locations used the same technique to join the large and small rooms; a 
penetration port was located in each facing wall, and a steel tunnel was 
fabricated to bolt onto each room's penetration port bolt pattern. In effect, 
the shielded volume turned into a dumbbell shape, with the tunnel at the 
waist of the dumbbell. Then, a penetration port cover plate, equipped with 
multiple signal line filters, is bolted across the tunnel throat at one end. 
(This isolates the two test chambers from each other.)

Each shielded room has it's own set of powerline filters (400Hz three phase, 
60Hz three phase and two DC lines). The modular panel (on each room) that 
carries the filter sets has it's own ground well. The two powerline filter sets 
were over fifty feet apart in both examples.

I can't remember when anybody would have recommended a design like this. I know 
I wouldn't. But the GD example grew from merging existing facilities, and it 
worked. It worked good enough that we NEVER had a trace of any ambient signals 
in the many emission tests that were performed there over about 15 years (using 
Eaton receivers and HP spectrum analyzers, often with active antennas). It was 
good enough to do TEMPEST testing at the facility. It worked good enough that I 
decided to deliberately emulate the design here at Cubic. And it's working 
again, good enough that my fancy HP-8571A Receiver (a re-worked 8566B), even 
operating with external pre-amps in some bands, doesn't see any ambient 
distractions.

So what's the lesson in all of this? Well, I was scrupulous about seam quality 
and using very good powerline 

RE: New CISPR22 requirement

1998-10-09 Thread Gary McInturff
Yea, I do. This is going to add time and cost to the test procedure in
place and I don't see it fixing any problems. I might concede that it
may be a more repeatable reading on cables, but that is secondary to the
real issue. 
The real issue is this. Is the lack of this testing causing a
proliferation of many non-compliant systems? I believe the answer is
no.(But I certainly agree that I don't have any real data to back this
statement up.). Conversely, I haven't seen a proliferation of data
coming from the controlling agencies that they have identified a problem
either.
There are some non-compliant systems but not because of the
measurement techniques are inadequate.
The job of standards committees is not to invent new crap until
they determine the old stuff isn't sufficient. So prove the problem
first and if you can't then go away.
Snort! - Gary
-Original Message-
From:   grant.pi...@adn.alcatel.com
[SMTP:grant.pi...@adn.alcatel.com]
Sent:   Thursday, October 08, 1998 10:38 AM
To: emc-p...@majordomo.ieee.org
Subject:New CISPR22 requirement

The most recent issue of CISPR22 (Third edition, Nov. 1997)
requires
conducted emissions testing on signal cables (section 5.1).
Section 9.5
provides the procedures for making such measurements.
Alternative methods
are suggested involving Impedance Stabilization Networks and
Current Probes.
All types of cables are covered (e.g. balanced/unbalanced,
screened/unscreened, single pair/multiconductor, etc.).

Has a CENELEC version of CISPR22-1997 been released or drafted?
If not
released yet, when is it expected?  When would it be expected to
be
communicated by the Commission, and when would it become
mandatory?  Does it
contain a requirement for conducted emissions on signal lines?

Does anyone have any particular concerns regarding compliance
with this
standard?

Thanks in advance.

R. Grant Pinto
Alcatel USA
Ashburn, VA
grant.pi...@adn.alcatel.com
1-703-724-2759
1-703-724-2132-fax


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RE: Crepage/Clearance On Telecom Modem design

1998-10-09 Thread Mel Pedersen
I believe that your experts are wrong...4.2 is a rather odd number to come up 
with.  The most common requirement here is SUPPLEMENTARY INSULATION for a 
PRIMARY CIRCUIT at 250Vrms (as defined by EN 60950) between the TIP/RING (line 
side, or TNV-3 side) and the modem or device side. 2.5mm of surface creepage 
and 2.0mm of air clearance is required here.  This assumes that your modem or 
device side already has sufficient isolation from Mains, which is almost always 
the case.

Many countries in Europe require only BASIC INSULATION at a working voltage of 
150VDC, which equates to a 1.6mm creepage spacing requirement.  This also 
assumes that you have sufficient isolation from Mains to you modem.

If you don't have sufficient isolation from Mains, your requirement will be 
5.0mm.  This would be consistent with the REINFORCED INSULATION requirement 
between Mains and the Tip/Ring side.

It is possible that your consultants are correct for your particular 
case...however, it would be a very unusual case...

They are correct about one thing...EN 60950 is the correct standard.

feel free to call if you have any further questions,

Mel PedersenMidcom, Inc.
Homologations Engineer Phone:  (605) 882-8535
mpeder...@midcom-inc.com Fax:  (605) 882-8633

I disclaim anything that may be wrong.

--
From:   Diaco Davari[SMTP:dav...@pmc.philips.com]
Sent:   Thursday, October 08, 1998 2:29 PM
To: emc-p...@majordomo.ieee.org
Subject:Crepage/Clearance On Telecom Modem design

Hello Folks,

Does anyone know what the crepage distance shall be across the isolation
from the line side to modem side within the DAA of Modems? 

Which document/standard refers to this specific spacing in detail ?

I have been told by local experts on EN60950 that I need 4.2 mm spacing
across the isolation. Apparently I do not need to have the spacing on the
top of the board in alignment (or registration) with the spacing on the
bottom of the board. 

Regards,

Diaco

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Re: Crepage/Clearance On Telecom Modem design

1998-10-09 Thread Rich Nute



Hello Diaco:


My reading of Clause 6 of IEC 950/EN 60950 is:

between TNV circuit and primary circuit:

double or reinforced insulation, including applicable
creepage distance and clearance, or

basic insulation and a grounded conductive barrier,
including applicable creepage distance and clearance
from the primary circuit to the conductive barrier.

between TNV circuit and hazardous voltage secondary circuit:

double or reinforced insulation, including applicable
creepage distance and clearance, or

basic insulation and a grounded conductive barrier,
including applicable creepage distance and clearance
from the hazardous voltage circuit to the conductive 
barrier.

between TNV circuit and SELV circuit:

no creepage distance or clearance requirement 
(but, it must pass the hi-pot test)

between TNV circuit and ground:

no creepage distance or clearance requirement 
(but, it must pass the hi-pot test)

Creepage distances are measured along the shortest path between 
the two conductors across the surface of the insulator.  There
is no correspondence to traces on opposite sides of printed
wiring boards (because such insulation is interposed solid 
insulation, and MAY be subject to insulation thickness 
requirements).


Best regards,
Rich





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RE: Crepage/Clearance On Telecom Modem design

1998-10-09 Thread Lesmeister, Glenn
In most cases, Norway, Sweden and Finland? require supplementary insulation
for a primary circuit between TNV and Ground\/SELV.  Assuming a primary
circuit of 250VAC, I believe this works out to 2.5mm creepage and 2.0mm for
clearance (I don't have my standard handy).  In addition, you need 0.4mm
thickness through the board, or sufficient multi layers per 2.9.4.

Diaco,  you didn't mention whether or not the product is intended for world
wide distribution, so be careful not to disregard these additional
requirements for these regions.  I've heard that Sweden is considering a
compromise that might remove the distance through insulation requirement,
but still hold the line creepage and clearance, however, I don't know if and
when this will take effect.

Glenn



-Original Message-
From:   Rich Nute [SMTP:ri...@sdd.hp.com]
Sent:   Thursday, October 08, 1998 8:54 PM
To: dav...@pmc.philips.com
Cc: emc-p...@majordomo.ieee.org
Subject:Re: Crepage/Clearance On Telecom Modem design




Hello Diaco:


My reading of Clause 6 of IEC 950/EN 60950 is:

between TNV circuit and primary circuit:

double or reinforced insulation, including applicable
creepage distance and clearance, or

basic insulation and a grounded conductive barrier,
including applicable creepage distance and clearance
from the primary circuit to the conductive barrier.

between TNV circuit and hazardous voltage secondary circuit:

double or reinforced insulation, including applicable
creepage distance and clearance, or

basic insulation and a grounded conductive barrier,
including applicable creepage distance and clearance
from the hazardous voltage circuit to the conductive 
barrier.

between TNV circuit and SELV circuit:

no creepage distance or clearance requirement 
(but, it must pass the hi-pot test)

between TNV circuit and ground:

no creepage distance or clearance requirement 
(but, it must pass the hi-pot test)

Creepage distances are measured along the shortest path between 
the two conductors across the surface of the insulator.  There
is no correspondence to traces on opposite sides of printed
wiring boards (because such insulation is interposed solid 
insulation, and MAY be subject to insulation thickness 
requirements).


Best regards,
Rich





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RE: Crepage/Clearance On Telecom Modem design

1998-10-09 Thread Mel Pedersen
Glen,

Norway, Sweden and Finland are correct.  The Finish deviation for this is 
somewhat hidden, it is in clause 6.2.1.4, where it states that Earth Ground is 
not permitted as a level of protection between Mains and TNV.  Double (BASIC + 
SUPPLEMENTARY) or REINFORCED INSULATION between is all that can be relied upon. 
 You can only rely on Earth Ground if your equipment has a permanent connection 
to Earth Ground, or if it is plugable equipment type B (Industrial).
 
The Swedish Deviation is in clause 6.3.3.1, and the Norwegian deviation is in 
clause 6.2.1.2.

I wonder...why couldn't they all make life a little easier and address this 
issue in the same location?  Oh well...

Mel PedersenMidcom, Inc.
Homologations Engineer Phone:  (605) 882-8535
mpeder...@midcom-inc.com Fax:  (605) 882-8633


--
From:   Lesmeister, Glenn[SMTP:glenn.lesmeis...@compaq.com]
Sent:   Friday, October 09, 1998 12:14 AM
To: 'Rich Nute'; dav...@pmc.philips.com
Cc: emc-p...@majordomo.ieee.org
Subject:RE: Crepage/Clearance On Telecom Modem design

In most cases, Norway, Sweden and Finland? require supplementary insulation
for a primary circuit between TNV and Ground\/SELV.  Assuming a primary
circuit of 250VAC, I believe this works out to 2.5mm creepage and 2.0mm for
clearance (I don't have my standard handy).  In addition, you need 0.4mm
thickness through the board, or sufficient multi layers per 2.9.4.

Diaco,  you didn't mention whether or not the product is intended for world
wide distribution, so be careful not to disregard these additional
requirements for these regions.  I've heard that Sweden is considering a
compromise that might remove the distance through insulation requirement,
but still hold the line creepage and clearance, however, I don't know if and
when this will take effect.

Glenn



-Original Message-
From:   Rich Nute [SMTP:ri...@sdd.hp.com]
Sent:   Thursday, October 08, 1998 8:54 PM
To: dav...@pmc.philips.com
Cc: emc-p...@majordomo.ieee.org
Subject:Re: Crepage/Clearance On Telecom Modem design




Hello Diaco:


My reading of Clause 6 of IEC 950/EN 60950 is:

between TNV circuit and primary circuit:

double or reinforced insulation, including applicable
creepage distance and clearance, or

basic insulation and a grounded conductive barrier,
including applicable creepage distance and clearance
from the primary circuit to the conductive barrier.

between TNV circuit and hazardous voltage secondary circuit:

double or reinforced insulation, including applicable
creepage distance and clearance, or

basic insulation and a grounded conductive barrier,
including applicable creepage distance and clearance
from the hazardous voltage circuit to the conductive 
barrier.

between TNV circuit and SELV circuit:

no creepage distance or clearance requirement 
(but, it must pass the hi-pot test)

between TNV circuit and ground:

no creepage distance or clearance requirement 
(but, it must pass the hi-pot test)

Creepage distances are measured along the shortest path between 
the two conductors across the surface of the insulator.  There
is no correspondence to traces on opposite sides of printed
wiring boards (because such insulation is interposed solid 
insulation, and MAY be subject to insulation thickness 
requirements).


Best regards,
Rich





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Feeding 2 phases into one telco rack

1998-10-09 Thread Jerry Roberton
Members,

Can anyone enlighten me  whether  reugulations exist  in EU  countries (
Excepting the UK)  which  advise against or prohibit the practice of
feeding  duplicated  powere supplies from different  230 V phases  into
the same shelf  or rack of   telco TDM ( or any)  equipment.   The UK
regs  say no.

Any guidance whether by proprietary  standards or  ETSI  work would be
welcome.

Jerry Roberton
EMEA Homologation   NET Europe


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SLIM

1998-10-09 Thread Nicholas, Keith L
I have an electronic (WORD) copy of the SLIM document.

REPORT OF THE SLIM III TEAM ON THE
ELECTROMAGNETIC COMPATIBILITY DIRECTIVE
(89/336/EEC as amended)

Please email me if you would like a copy.

Keith L. Nicholas
Manager, Electrical Controls
AMP Incorporated,   Automachine Systems Group
Mail Stop: 161-39
*  (717) 810-2601
*  (717) 810-2443
* keith.nicho...@amp.com




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RE: Lab qualification

1998-10-09 Thread Matejic, Mirko
ISO/DIS is available at:


http://web.ansi.org/reports/master.asp?room=22
http://web.ansi.org/reports/master.asp?room=22 

-Original Message-
From:   Matejic, Mirko [SMTP:mmate...@foxboro.com]
Sent:   Wednesday, October 07, 1998 7:07 AM
To: 'emc-pstc'
Subject:RE: Lab qualification

ISO/DIS 17025 is DRAFT industry standard which has been
produced as the
result of extensive experience of the implementation of
ISO/IEC Guide
25: 1990 and EN 4500l :1989 both of which it will
replace. It contains
all of the requirements that testing and calibration
laboratories have
to meet if they wish to demonstrate that they operate a
quality system,
are technically competent, and are able to generate
technically valid
results. It is likely that it would be adopted with some
modifications.
Voting on this document terminates on 1998-12-09. If you
have
suggestions or comments on this document, please let me
know. File will
be posted soon on http://www.rcic.com
http://www.rcic.com  IEC
standards. 

My suggestions are along the line of already posted
responses. Consider
only test laboratories accredited by NVLAP, A2LA or any
other accreditor
having MRA with either of them. Let them assess test
laboratories for
you. Personal visit to the laboratory could be valuable.

Regards,

Mirko Matejic


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RE: Room grounding

1998-10-09 Thread Robert F. Martin ITS/QS-Box
'Single point ground' in this situation is used for the same purpose 
as we would in electronics design. When using a shielded room for 
making low frequency measurements (particularly MIL-STD), multiple 
ground connections can make significant power frequency and harmonic 
noise. Generally this is not so much of a problem for commercial 
operations because emission measurements are not as restrictive 
(either in frequency or in limit). Because,as Jon says, the conduit, 
etc. is not always reliable (particularly at the higher frequencies 
which filters are designed to shunt) an effort is made to provide 
ground through an independent means. I have used enclosures where 
great care has been taken (multiple 12' ground rods in close 
proximity, with Cu Sulfate 'salting') to provide a very 'robust' 
ground. This is then connected to both the enclosure and the building 
ground.

In some cases, you have to convince the electrician and/or the 
inspector that your room provides at least as good a ground as the 
conduit in order to be able to take advantage of the isolation 
provided by the PVC. It goes against their grain to connect a metal 
box without using metal conduit.

Bob Martin
Sr. Technical Manager
Intertek Testing Services
(978)263-2662
fax(978)263-7086
r...@itsqs.com

The opinions expressed are my own and not necessarily those of my 
employer.


-Original Message-
From:   Jon D. Curtis [SMTP:j...@curtis-straus.com]
Sent:   Thursday, October 08, 1998 11:52 AM
To: lfresea...@aol.com
Cc: mhopk...@keytek.com; emc-p...@ieee.org
Subject:Re: Room grounding

As I understand it, Lingren connects the shielded rooms they build 
back to the
main building ground point by a separate ground wire.  The conduit is
disconnected by use of a plastic sleave.  I assume they do this 
because the AC
filters incorporated in the shielded room include LARGE capacitors to 
the
shielded room walls.  Effectively the leakage through these capacitors 
turns the
ENTIRE room surface into an AC electrode with respect to building 
ground.  This
leakage current is potentially leathal unless returned back to the 
source where
the neutrals of the building are tied to ground at the circuit panel.

Not grounding the room (if it incorporates standard room filters) 
should not be
considered acceptable.  If there is an regular outlet on an adjacent 
building
wall, then a lethal hazard will exist between a metal test instrument 
pluged into
that outlet and the room surface.  I would hazard a bet that most 
room
installations are not well enough controlled to insure that building 
ground and a
separate room ground are NEVER allowed to meet.  Consider that no 
sparks will fly
if it happens, but hearts may stop.  People automatically consider 
dead metal as
ground.

I would also caution against those in this thread who rely on conduit. 
 Conduit
breaks, is removed, etc.  For high leakage threats only a dedicated 
ground wire
of suitable gage to carry the total fault current of the supply should 
be
employed.

This is not about a single fault problem.  You have a hazardous 
condition with NO
fault because of filter leakage if you do not ground the room to the 
building
ground at the circuit panel.

Watch out for LISNs Also.  The design of all lisns incorporate LARGE 
capacitors
to ground for filtering.  Without a ground connection on the LISN 
case, high
leakage threats exist.  Most use LISNs bonded to the ground plane 
which addresses
this threat as long as the ground plane is connected to the building 
ground.

The debate on reduction of noise and effects on EMC results should 
continue, BUT
personel safety comes FIRST and should not be compromised.

lfresea...@aol.com wrote:

 Mike,

 sorry you disagree.

 Inside the room, all equipment is referenced to the room itself, 
there is no
 new safety risk introduced by the room being grounded differently.

 Outside the room, again, all equipment is referenced tightly to the 
room, so
 the operator does not see any differential.

 Should lightning strike the building, then true, the building earth 
potential
 may lift, but the operator is protected because he is referenced to 
the room
 which will not move much because the energy has been dissipated by 
the
 building earthing system.

 I state again this is for performance reasons, and is accepted 
practice. In a
 true Faraday shielded room, earthing the room is not even 
neccessary. Mind
 you, since these don't exist off the shelf, I'll stick to grounding 
using my
 original guidlines. NEC inspectors, when the rationale is explained 
to them
 have little problem. However, I have come across situations were the 
two
 unique earths were tied by a very heavy inductor

 Best regards,

 Derek N. Walton

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RE: Ozone...

1998-10-09 Thread Matejic, Mirko
Can somebody confirm information I picked on the radio that each Shuttle
launch causes a major damage in the Ozone layer?

Mirko Matejic

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RE: SLIM

1998-10-09 Thread Griffith, Monty
You should post it in the contributed document section of the RCIC.

Monty Griffith
Senior Product Safety Engineer
Intergraph Computer System
Huntsville, AL 35894-0001
PH: (256) 730-6017
FX: (256) 730-6239
http://mecsrv.b29.ingr.com

 -Original Message-
 From: Nicholas, Keith L [SMTP:keith.nicho...@amp.com]
 Sent: Friday, October 09, 1998 6:56 AM
 To:   'emc-p...@majordomo.ieee.org'
 Subject:  SLIM
 
 I have an electronic (WORD) copy of the SLIM document.
 
 REPORT OF THE SLIM III TEAM ON THE
 ELECTROMAGNETIC COMPATIBILITY DIRECTIVE
 (89/336/EEC as amended)
 
 Please email me if you would like a copy.
 
   Keith L. Nicholas
   Manager, Electrical Controls
   AMP Incorporated,   Automachine Systems Group
   Mail Stop: 161-39
   *  (717) 810-2601
   *  (717) 810-2443
   * keith.nicho...@amp.com
 
 
 
 
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ThanX from The Safety Link (A Milestone!)

1998-10-09 Thread Art Michael
Hello PSTCers,

Last night the 100,000th visitor entered the Safety Link (the web's most
comprehensive collection of electrical product safety and standards
resources.)  Our counter was started towards the end of 1995.  40,000+
have visited in the past year and the rate continues to climb. 

ThanX to all who have visited (from 50+ Countries), contributed the
location of useful sites (now in excess of 400) or provided indications
that a link no longer functions (fortunately, a limited occurrance). 

AND, THANX to our corporate sponsors, (who provide financial support).

100,000 Product Safety Professionals can't be wrong. If you are not
familiar with our offerings, please visit www.safetylink.com

With appreciation, Art Michael, Webmaster - the Safety Link

Int'l Product Safety News
A.E. Michael, Editor
P.O. Box 1561 INT
Middletown CT 06457-8061 U.S.A.

Phone  :  (860) 344-1651
Fax:  (860) 346-9066
Email  :  i...@connix.com
Website:  http://www.safetylink.com
ISSN   :  1040-7529






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IEC 1000-X-X vs EN 61000-X-X

1998-10-09 Thread Bailey, Jeff

Hello group,

I currently have a number of the IEC 1000-X-X standards and test in
accordance with them,  EN 50082-1:1997 references the EN 61000-X-X
standards. Can I safely continue to use my IEC 1000-X-X set or do I have
to buy the EN 61000 series.

any comments appreciated 

Thanks

Jeff Bailey
SST

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Re: Shield Room Grounding

1998-10-09 Thread bma
Hi Ed,

I appreciate your kindness to share your experience with us about 
constructing equivalent load: I constructed a load bank consisting of 16 
surface mount light bulb sockets, all wired in parallel. I just screw in an 
array of 25/60/75/100 Watt rated lamps until I get the necessary current. 
Sure, there's some unknown slight lead inductance and capacitance. But all 
I want to do is draw a few amps DC

I have two questions: (1)What is the impedance of your bulb array at 30 
MHz?   i.e.,  Zb=? @30 MHz.  (2)What is the impedance of EUT at 30 MHz?
i.e.,  Ze=? @30 MHz

If we are not sure Zb=Ze @30 MHz, I am afraid, it's hard to say the 
spectrum analyzer would receive the same RF emission at 30 MHz from noise 
sources other than EUT, although the bulb array draws the same current at 
60 Hz as EUT does.  In other words, Zb=Ze @60 Hz is one thing, and  Zb=Ze 
@30 MHz would be another.

Let's see an example, assuming
Ze=Re+jXe, where Xe=Omega*Le, and Omega=2*Pi*F.
Re=20 Ohm, Xe=0.1 Ohm @60 Hz,   Ze=20+j*0.1=20 Ohm
Be=20 Ohm, Xe=5 Ohm @30 MHz,Ze=j*5 Ohm

Conclusion: As far as the equivalent load is concerned, we can only pay 
attention to the equivalence of resistance part of Zb and Ze @60 Hz.  At 30 
MHz, however, we should pay more attention to the equivalence of reactance 
part of Ze and Zb instead.

Suggestion: We might need to check the equivalence of Zb and Ze @30 MHz by 
using an Impedance Analyzer, e. g., HP4191A(?).


Thank you.
Please correct me.
Best Regards,
Barry Ma



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Re: Crepage/Clearance On Telecom Modem design

1998-10-09 Thread Peter Merguerian
Hello Diaco,

As you can see from all the responses to your question, you have 
received many contradictory answers! As the Israeli member of the 
IEC 950 WG7 Committe, I would like to provide you with the 
correct answer. However, I would first need you to provide me with 
details of what a DAA modem is. 

Best Regards,



Date sent:  Thu, 08 Oct 1998 12:29:28 -0700
To: emc-p...@majordomo.ieee.org
From:   Diaco Davari dav...@pmc.philips.com
Subject:Crepage/Clearance On Telecom Modem design
Send reply to:  Diaco Davari dav...@pmc.philips.com

 Hello Folks,
 
 Does anyone know what the crepage distance shall be across the isolation
 from the line side to modem side within the DAA of Modems? 
 
 Which document/standard refers to this specific spacing in detail ?
 
 I have been told by local experts on EN60950 that I need 4.2 mm spacing
 across the isolation. Apparently I do not need to have the spacing on the
 top of the board in alignment (or registration) with the spacing on the
 bottom of the board. 
 
 Regards,
 
 Diaco
 
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 roger.volgst...@compaq.com (the list administrators).
 



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Two diverse questions

1998-10-09 Thread georgea
To my knowledge, Germany is the only country that has an
acoustics law that affects routine ITE.  The German Workplace
Law sets limits in the 60+dBA? range for workplaces.  OSHA also
sets limits, but they begin (as I recall) around 85dBA, and well
above routine ITE noise.

Where acoustic levels are claimed they are usually measured
in accord with ISO 7779 and reported in accord with ISO 9296.

George Alspaugh
Lexmark International

-- Forwarded by George Alspaugh/Lex/Lexmark on 10/09/98
03:34 PM ---

Gary McInturff gmcinturff%packetengines@interlock.lexmark.com on 10/09/98
02:05:11 PM

Please respond to Gary McInturff
  gmcinturff%packetengines@interlock.lexmark.com

To:   'emc-pstc list server' emc-pstc%ieee@interlock.lexmark.com
cc:(bcc: George Alspaugh/Lex/Lexmark)
bcc:  George Alspaugh/Lex/Lexmark
Subject:  Two diverse questions




*Sound pressure measurements - What standard drives those
  requirements?

*TNV3 connectors are BNC types - are their connectors that can
  provide higher density connections than 1? - given the nature
  of coax this seems counter-intuitive but I am passing the request
  for information.



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Two diverse questions

1998-10-09 Thread georgea
[Correction to prior note below.  German limits are for imission
as opposed to emission.  It is the total sound pressure as
measured at the worker's location.  Therefore, it is the employer
who is held accountable to provide equipment, drapes, carpet,
or whatever that helps meet the limits.]

To my knowledge, Germany is the only country that has an
acoustics law that affects routine ITE.  The German Workplace
Law sets limits in the 60+dBA? range for workplaces.  OSHA also
sets limits, but they begin (as I recall) around 85dBA, and well
above routine ITE noise.

Where acoustic levels are claimed they are usually measured
in accord with ISO 7779 and reported in accord with ISO 9296.

George Alspaugh
Lexmark International

-- Forwarded by George Alspaugh/Lex/Lexmark on 10/09/98
03:34 PM ---

Gary McInturff gmcinturff%packetengines@interlock.lexmark.com on 10/09/98
02:05:11 PM

Please respond to Gary McInturff
  gmcinturff%packetengines@interlock.lexmark.com

To:   'emc-pstc list server' emc-pstc%ieee@interlock.lexmark.com
cc:(bcc: George Alspaugh/Lex/Lexmark)
bcc:  George Alspaugh/Lex/Lexmark
Subject:  Two diverse questions




*Sound pressure measurements - What standard drives those
  requirements?

*TNV3 connectors are BNC types - are their connectors that can
  provide higher density connections than 1? - given the nature
  of coax this seems counter-intuitive but I am passing the request
  for information.



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RE: IEC 1000-X-X vs EN 61000-X-X

1998-10-09 Thread Mike Hopkins
The IEC is simply renumbering the 1-x-X series to become the 61000-x-x
series. Any new standard in that series will be numbered 61000-x-x.

Existing standards are not going to be re-issued just to change the number,
but when they are re-issued for whatever reason, the numbers will be
changed.

Hope this helps.

Mike Hopkins
mhopk...@keytek.com


 -Original Message-
 From: Bailey, Jeff [SMTP:jbai...@sstech.on.ca]
 Sent: Friday, October 09, 1998 12:53 PM
 To:   'EMC-PSTC'
 Subject:  IEC 1000-X-X vs EN 61000-X-X
 
 
 Hello group,
 
 I currently have a number of the IEC 1000-X-X standards and test in
 accordance with them,  EN 50082-1:1997 references the EN 61000-X-X
 standards. Can I safely continue to use my IEC 1000-X-X set or do I have
 to buy the EN 61000 series.
 
 any comments appreciated 
 
 Thanks
 
 Jeff Bailey
 SST
 
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RE: Shield Room Grounding

1998-10-09 Thread Kevin Harris
Hi Barry et al,

I'm I missing something here? Is this exercise worth the trouble? If one
doesn't have a clear margin to any commercial limit line with any kind
of resistive dummy load attached to your LISN shouldn't you examine the
your system setup? Accurate determination of your measurement system
noise floor with a known impedance through the frequency range is really
only of academic use in this case, isn't it? This should have no bearing
on pass/fail of an EUT as the measurement system noise floor and the
limit line should be well separated for conducted emissions in a
shielded room.


Regards,


Kevin Harris



 -Original Message-
 From: b...@namg.us.anritsu.com [SMTP:b...@namg.us.anritsu.com]
 Sent: Friday, October 09, 1998 1:33 PM
 To:   emc-p...@ieee.org
 Subject:  Re: Shield Room Grounding
 
 Hi Ed,
 
 I appreciate your kindness to share your experience with us about 
 constructing equivalent load: I constructed a load bank consisting of
 16 
 surface mount light bulb sockets, all wired in parallel. I just screw
 in an 
 array of 25/60/75/100 Watt rated lamps until I get the necessary
 current. 
 Sure, there's some unknown slight lead inductance and capacitance. But
 all 
 I want to do is draw a few amps DC
 
 I have two questions: (1)What is the impedance of your bulb array at
 30 
 MHz?   i.e.,  Zb=? @30 MHz.  (2)What is the impedance of EUT at 30
 MHz?
 i.e.,  Ze=? @30 MHz
 
 If we are not sure Zb=Ze @30 MHz, I am afraid, it's hard to say the 
 spectrum analyzer would receive the same RF emission at 30 MHz from
 noise 
 sources other than EUT, although the bulb array draws the same current
 at 
 60 Hz as EUT does.  In other words, Zb=Ze @60 Hz is one thing, and
 Zb=Ze 
 @30 MHz would be another.
 
 Let's see an example, assuming
   Ze=Re+jXe, where Xe=Omega*Le, and Omega=2*Pi*F.
   Re=20 Ohm, Xe=0.1 Ohm @60 Hz,   Ze=20+j*0.1=20 Ohm
   Be=20 Ohm, Xe=5 Ohm @30 MHz,Ze=j*5 Ohm
 
 Conclusion: As far as the equivalent load is concerned, we can only
 pay 
 attention to the equivalence of resistance part of Zb and Ze @60 Hz.
 At 30 
 MHz, however, we should pay more attention to the equivalence of
 reactance 
 part of Ze and Zb instead.
 
 Suggestion: We might need to check the equivalence of Zb and Ze @30
 MHz by 
 using an Impedance Analyzer, e. g., HP4191A(?).
 
 
 Thank you.
 Please correct me.
 Best Regards,
 Barry Ma
 
 

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RE: Ozone...

1998-10-09 Thread Douglas McKean
All I found was the following from 1996 ... 

http://www.ssnewslink.com/html/governme.html 

At 09:44 AM 10/9/98 -0400, Matejic, Mirko wrote:
Can somebody confirm information I picked on the radio that each Shuttle
launch causes a major damage in the Ozone layer?

Mirko Matejic


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Re: Two diverse questions

1998-10-09 Thread ed . price



  From: Gary McInturff gmcintu...@packetengines.com
  Subject: Two diverse questions
  Date: Fri, 9 Oct 1998 11:05:11 -0700 
  To: 'emc-pstc list server' emc-p...@ieee.org


 * TNV3 connectors are BNC types - are their connectors that can
 provide higher density connections than 1? - given the nature of coax

Gary:

Not sure what I'm answering, but higher density could be defined by a 
triaxial connector or a twin-ax connector. Twin-ax is seen in a BNC type 
connector, while I think I have only ever seen triax in a TNC body.

Ed

--
Ed Price
ed.pr...@cubic.com
Electromagnetic Compatibility Lab
Cubic Defense Systems
San Diego, CA.  USA
619-505-2780
List-Post: emc-pstc@listserv.ieee.org
Date: 10/09/1998
Time: 13:19:19
--



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RE: Added paragraph

1998-10-09 Thread bma
Unfortunately, my Email system does not allow me to edit any Email I am 
replying. For example, Peter, I am not able to change anything of you 
message.--Barry Ma
-
Original Text
From: Peter Tarver peter.tarver.ptar...@nt.com, on 10/8/98 2:57 PM:
Better yet, how about the subscribers taking the additional two or three
seconds it takes to do the responsible thing and delete it themselves?

Peter L. Tarver
Nortel
ptar...@nt.com
 -Original Message-
 From: Robert Macy [SMTP:m...@california.com]
 Sent: Thursday, October 08, 1998 12:05 PM
 
 Is there anyway to remove the paragraph emc-pstc adds to the msgs?
 
 I archive all the msgs and it's starting to look like 30-40% of the text
 are those paragraphs!  It's really noticeable when a quoted msg has a
 quoted msg with a quoted msg.
 
 Don't get me wrong.  That paragraph is really handy.
 
 There must be a way to add that paragraph without it automatically
 transferring.  I know because when I shot back some spam, the 10 pages
 disappeared into only the introducing paragraph (which was very
 innocuous).
 
 If you guys can figure out how to add the paragraph but not have it
 requoted when we quote the msg, I'd really appreciate it....or make 
it
 much smaller?
 
   - Robert -
 

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UL1950 vs UL508 for Switching Power Supplies

1998-10-09 Thread Peter Merguerian

Dear PSTC Members,

Assuming a manufacturer had UL1950 Third Edition Recognized 
Component Class I (earthed) ITE Power Supplies and  they wanted 
to have a Listing (as an open-end device) to the Standard for 
Industrial Control Equipment, UL508. 

1) What additional requirements must be met? I am already aware 
that the input/output terminal blocks must be suitable for field 
wiring. 

2) What about spacings? 

3) What about if the input terminal block design is such that the 
earth goes directly to the PCB trace? Under UL1950 Recognition 
this was OK since the manufacturer decided to add a Condition of 
Acceptability (instead of meeting a 1000 Amp short-circuit test) 
that states that the power supply earthing terminal is not the 
protective earthing terminal and that this terminal should be reliably 
bonded to the end-product protective earthing terminal. Since 
manufacturer intends to also List his power supplies to UL508, this 
Condition of Acceptability must be removed and I wonder if the 
UL508 standard has a similar 1000A test as applied to to ITE 
equipment where the trace is relied upon for protective earthing!

3) Any other considerations for Listing to UL508?

Thank you all,

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Capacitors Between TNV and SELV for ITE Equipment

1998-10-09 Thread Peter Merguerian
Dear Fellow Members,

Per UL1950 and EN60950:

1) Can you tell me what type of capacitors will be suitable to bridge 
basic insulation between TNV-3 circuits and SELV circuits? 

2) Assuming that the body of above TNV-3 to SELV capacitors can 
touch SELV components, can the body be considered suitable for 
basic insulation or should there be an additional sleeving or tubing 
over the capacitor that meets the requirements for basic insulation?



Thanks and Best Regards, 

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(Fwd) UL1950/CSA C22.2 950 Third Edition; Telco Overvoltage Te

1998-10-09 Thread Peter Merguerian
Forwarded message:
From: Self Single-user mode
To: pstc-...@ieee.org
Subject: UL1950/CSA C22.2 950 Third Edition; Telco Overvoltage Tests
List-Post: emc-pstc@listserv.ieee.org
Date: Fri, 9 Oct 1998 23:50:09 +0200


Dear Fellow members,

After the application of the Overvoltage Tests to telecom interfaces 
subjected to exposed plant, one of criteria for passing to the above 
specified standards is the application of a Dielectric Voltage 
Withstand Test or the Leakage Current Test. As such, if the 
manufacturer failed the Dielectric Voltage Withstand Test, 
manufacturer can choose to comply with the Leakage Current Test.

As the standard is written today, it is not necessary to apply a 600 
V to the telephone interface (to simulate a power line coming 
across the telephone interface) when conducting the Leakage 
Current Test. Application of the 600 V to the telephone interface 
when measuring Leakage per the Standards for Telephone 
Equipment UL1459 and CSA C22.2 225 was a common practice 
and makes sense. 

I believe there was a big mistake in overlooking this point when the 
UL1950/CSA C22.2 950 standard was developed. I know one 
manufacturer with a piece of equipment which was submitted to 
one NRTL and received Listing (because after failing Dielectric 
Strength Test, they passed the Leakage Current Test- obviously he 
passed since 600 V was not applied to the telco interface). When 
OEM submitted the same piece of equipment to another NRTL, 
they couldn't get Listing since engineer evaluating product applied  
600 V to the telco interface when measuring Leakage (even though 
standard does not require it) and the product failed the test.

Any comments, especially from pstc members who are also in the 
North American Standardization Committe for UL1950/CSA C22.2 
950?

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RATED VOLTAGE UL1950

1998-10-09 Thread Larry Barnette
Dear group,

I have a question on defining the RATED VOLTAGE that should be applied to
TNV in UL1950 Clause 6.3.3.1 Additional Test for separation between
telecommunication network and earth (Figure 17) for a Class III device that
operates from an external nominal 12VDC (SELV) Listed Class II Level 3
adapter. I know by definition RATED VOLTAGE 1.2.1.1 is the primary voltage
as declared by the manufacturer.  I see that this is obviously the case if
the power supply is physically part of the equipment and directly mains
powered.   In this case it is a seperate module.

Should I use as the the RATED VOLTAGE for this test the upper limit of the
mains voltage to the adapter (125VAC) or can the test be done at the rated
voltage of the EUT (e.g. 16VDC)?

If it's the mains voltage to the adapter, then in reality its seems we are
re-testing an already Listed and proven adapter where there should be no
more than 0.25ma leakage.

Your responses are greatly appreciated.
---
Larry Barnette
Compliance Engineer
GAI-Tronics Corp.  
Memphis Facility
Instrument Associates Division
2455 Harbor Ave.
Memphis, Tenn. USA 38113 larry_barne...@instrumentassociates.com
Phone: 901-947-4000 Ext. 176Fax: 901-948-0471