I'm sure we all agree that NO failures is the goal, but to John's point, I think it would be instructive for some to know what types of failures are generally found. (e.g. marking, ventilation openings, temperature limits, dielectric strength, ground bonding, critical components, clause misinterpretation, etc)
I remember a ground test failure of a printed wiring board. I examined the failed board, and found that the current path that was tested was not where ground current would flow. I pointed this out and the correct path. They repeated the test on the correct path and the construction passed. There was a delay, but we were able to recover. Rich - ---------------------------------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. To post a message to the list, send your e-mail to <[email protected]> All emc-pstc postings are archived and searchable on the web at: http://www.ieee-pses.org/emc-pstc.html Attachments are not permitted but the IEEE PSES Online Communities site at http://product-compliance.oc.ieee.org/ can be used for graphics (in well-used formats), large files, etc. Website: http://www.ieee-pses.org/ Instructions: http://www.ieee-pses.org/list.html (including how to unsubscribe) List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas <[email protected]> Mike Cantwell <[email protected]> For policy questions, send mail to: Jim Bacher: <[email protected]> David Heald: <[email protected]>
