On 08:48 AM 4/06/2001 -0700, Dennis Saputelli said:
>make the expansion the most negative amount you want and place
>primitives on the mask layer for the expansion amount
>Dennis Saputelli
>
>Ian Rozowsky wrote:
> >
> > Hi all
> >
> > I'd like to create a rule which ensures the following:
> >
> > On a particular compnent, the solder side solder mask must be +0.1mm,
> and the component side solder mask must be -1.0mm.
> > Specifying the component in the rule is simple, but how do I create an
> AND condition with the solder side soldermask layer? The layer options
> only include copper layers!!
> >
> > TIA
> >
This has been an issue that has been discussed in the past - so I hope
Protel take note. Through-hole pads do not "exist" on the top, bottom and
internal copper layers as far as the various expansion rules are
concerned. So creating an expansion rule that sets expansion to -1.0mm AND
layer=bottom has no effect upon through-hole pads. If will affect bottom
layer surface pads.
Dennis's idea is, fundamentally, the only way I know of doing what you
want. I face this issue when I am exposing all bottom side pads and vias
to support test requirements but tenting top side pads and vias to enable
high packing density.
Allowing the rules system to recognise that multi-layer (through-hole) pads
exist on the various copper layers would be a great help and, I think, a
small but great new feature. There may need to be an option for the layer
scope to "apply this rule to multi-layer entities".
(The multi-layer layer cannot be specified in the layer-scope - I would
think it would be a useful further extension to the rules system to allow
rules to be applied to the multi-layer layer. In this case the rules
system would need to apply that rule to all the layers of a pad or
via. This is the opposite to what I am requesting above, where I want the
rules system to be able split out the multi-layer entities into their
component layers.)
Ian Wilson
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