David Carey wrote:
> Would you mind sharing with us why one would ever use +0.1 mm and -0.1 mm
> (rather than, say, completely tenting over that pad) ?
Sorry chaps, nothing as exotic as BGAs. I have a PCB which holds 2 x 25A
diode bridges. The lugs go through routed slots in the PCB, which are THP to
ease the soldering process. I have a problem in that the pads on the
component side come very close to the external case of the bridge, with the
result that excess solder flowing thorugh the slots under the part sometimes
shorts to the case. I hope that by bringing the solder mask onto the
component side pads will prevent this "leakage" of solder from occurring. By
the way, the proposed shrinking of the mask is -1mm, not -0.1 as quoted
above. As regards compete tenting of the slot - would this still give a good
mechanical joint, or is it not desirable for SOME solder to flow onto the
component side pad to ensure strength?
Regards
Ian Rozowsky
Engineering Manager
Centurion Systems
P.O. Box 506
Cramerview 2060
South Africa
Tel : +27-11-462-4499
Fax : +27-11-704-3412
e-mail: [EMAIL PROTECTED]
web: http://www.centsys.co.za
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