David Cary wrote:
> Would you mind sharing with us why one would ever use +0.1 mm and -0.1 mm
> (rather than, say, completely tenting over that pad) ?
>

Dave,

I was visiting TI's website the other day and this method was listed as an
alternative  for BGA pads.  They had published  related data for reliability
but did not point out any advantages/ disadvantages to using  this method.
I am forwarding the question to our manufacturing engineer to see if he has
any comments.


Mike Reagan
EDSI
Frederick MD

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