I've used a heat gun to remove surface mount parts, but never to install one. I removed a device that looks like the aforementioned QFN, and the metal die-paddle on the bottom took a lot of heat to remove the part. I toasted the PCB because there was no heat-control; the PCB delaminated and had small bubbles but nothing actually 'burned'.
If you are going to assemble with these, use a reflow oven. I've seen several articles online about using a modified toaster oven. I only use SMT devices with visible pins or nubs, and only by hand-soldering. Perhaps electrically-conductive epoxy could be used for die-paddle on the bottom of the device, and hand-soldering for everything else ? -- You received this message because you are subscribed to the Google Groups "neonixie-l" group. To unsubscribe from this group and stop receiving emails from it, send an email to neonixie-l+unsubscr...@googlegroups.com. To post to this group, send an email to neonixie-l@googlegroups.com. To view this discussion on the web, visit https://groups.google.com/d/msgid/neonixie-l/97ef3c1f-32e9-4fd2-9465-10a37a7620e1%40googlegroups.com. For more options, visit https://groups.google.com/d/optout.
