I was surprised that the data sheet didn't give more thermal information relating to the pad - the chip, under load, dissipates up to 3.4W in a very small package, so the pad is important.
It'd have to be reflow for it to work - that along with appropriate board design to carry the heat away... Nick -- You received this message because you are subscribed to the Google Groups "neonixie-l" group. To unsubscribe from this group and stop receiving emails from it, send an email to [email protected]. To post to this group, send an email to [email protected]. To view this discussion on the web, visit https://groups.google.com/d/msgid/neonixie-l/73b12739-b3d5-4c36-9853-8f21d0607c19%40googlegroups.com. For more options, visit https://groups.google.com/d/optout.
