On 6/20/06, Hamish <[EMAIL PROTECTED]> wrote:
On Tuesday 20 June 2006 16:20, Timothy Miller wrote:
> Perhaps I made my announcement prematurely, so I'd like to go into
> some more detail about what we did, with our assumptions, and see what
> everyone else thinks.
>
> First of all, we do not want to switch parts if we can avoid it.
> Using the ECP2-50 has advantages in price, saves us two weeks on OGD1,
> and if we can cram a good 3D design into it, that saves us on die area
> an
[deleted]
Two questions...
How much more expensive?
OK. It's one... But money talks, so I'll give it a weighting of 2x... If it
isn't too expensive, I say take the 2 weeks and doit.
The actual price difference depends on volume. Suffice it to say that
I think we can still hit our original developer price point and be
okay.
Why couldn't we do the ecp2-70 now? (Rather than switch to the Xilinx).
Not available until Q1 or Q2 2007.
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