On 03:31 PM 21/02/2001 -0800, Dennis Saputelli said:
>I'm sure that filling vias with solder will enhance via reliability, but
>wave soldering seems to be going by the wayside (albeit slowly).
>for thru hole stuff people are going to intrusive (or invasive)
>soldering which is squirting a bit paste in the hole and then putting
>thru the oven with the rest of the reflow
>bye bye wave
>for the remaining cases where that doesn't work people are often using
>selective fountain spray soldering
>so this means that in the long those vias aren't going to get filled and
>will have to posses adequate quality without being filled (IMHO)
>
>Dennis Saputelli
Couldn't you specify that the vias be filled by these new elaborate means
just like a thru-hole component pin.
We are really only talking about boards suffering temperature extremes here
and so the additional cost would (normally) be acceptable.
Ian Wilson
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