Dennis, Andrew or others,
here is my best reference for the issue of Gold/Solder intermetallic
embrittlement. This was a published article, sorry no IDSN. It is my best
reference on this issue, many others mention the issue or problem but don't
delve into it deeply.
Title: Effect of AU on the Reliability of Fine Pitch Surface Mount Solder
Joints.
Authors: Judith Glazer, HP, Palo Alto, CA and Pamela A. Kramer &
J.W.Morris Jr., Dept. Materials Science and Mineral Engineering, USC and
Materials Sciences Division, Lawrence Berkely Laboratory, Berkely
California.
From: Proceedings, Surface Mount International Conference, Aug. 25 - 29,
1991, San Jose, CA, (Surface Mount International, Edina, MN) pp. 629-639
(1991). Republished in Circuit Wolrd 18, 41-46 (1992); J. Surface Mount
Technology 4, 15 - 28 (1992).
I got my hands on this article through a kind sole in HP whom I have
long since forgotten her name, although she is probably no longer there
anyways.
Another skirting reference can be found at the following URL:
http://www.filtranmicro.com/
Click on "What's New" and select the "Gold Plating Considerations for
Microwave Circuits".
I did have another good source but I can't find it at the moment. All my
sources were from magazine articles proceedings and technical papers thus
they do not have any ISDN numbers, many have also liberated themselves
(read: they've been kidnapped) over the years and have not found their way
back. These recent inquiries pointed that out poignantly when I went looking
for all my articles. The cited HP paper above is by far the best research
paper I have ever found on the issue.
Another author who has published a number of articles or books which
touch on this issue is J. Lau (or J.H. Lau).
Brad Velander,
Lead PCB Designer,
Norsat International Inc.,
#300 - 4401 Still Creek Dr.,
Burnaby, B.C., V5C 6G9.
Tel. (604) 292-9089 direct
Fax (604) 292-9010
website www.norsat.com
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