At 10:57 AM 6/1/2002 -0500, David W. Gulley wrote: >I am doing some via-in-pad BGAs and need to figure out if there is a >"good" way to provide the top solder and top paste masks while keeping the >bottom solder mask and bottom paste masks off. > >I defined the BGA pads as multilayer since I am doing via-in-pad (sort of >like it was a PGA) except I do not want holes in solder mask on the bottom >and I do want holes in the paste mask on the top.
I don't think it is a good idea to define any SMT pads as "multilayer." There are several reasons, among them the possible buginess of the implementation (which is not unusual when a procedure is not the way people normally do things....) Instead, as another suggested, use a surface pad plus via. I haven't tried it just now, but I have no reason to expect that this would be at all complicated..., beyond the known issue of providing netlist connectivity to the via through Update Free Primitives (if the vias are part of the footprint). * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/proteledaforum@techservinc.com * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
