boy that's some tight stuff, good luck! and keep us posted
Dennis Saputelli
"David W. Gulley" wrote:
>
> Dennis Saputelli wrote:
>
> > are you sure you don't want the bottom pads untented?
>
> > a recent customer specifically wanted the bottom via fanouts to be
> > untented for test probing
>
> > (i realize yours are in pad)
> > your via in pad only goes to the layer below, right?
> >
> > in my understanding this is the only way it can be small enough to not
> > louse up the paste reflow
>
> The Fab/Assembly shop (picked by client) gave me these specifications.
> The holes are through the board, but plugged in the Fab process.
>
> > what is the ball count and pitch of your chip and why exactly are you
> > doing via in pad?
>
> Multiple BGAs including 957 (31x31), 680 (34x34) and 432 (31x31) pitches
> vary from 50 mil to 0.8mm
>
> Via in pad is a customer request ... er, ehh, demand. I have done
> "dogbones" in the past but this is the first VIP design.
>
> > what are the various dimensions you are using?
> > (just curious)
>
> Depending on the BGA, 30 mil pad, 9mil hole (finished, plugged)
> 25 mil pad, 9mil hole (finished, plugged)
> 23 mil pad, 9mil hole (finished, plugged)
> 16 mil pad, 6mil hole (finished, plugged)
>
> David W. Gulley
> Destiny Designs
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