RE: Breakdown voltage between pcb layers

2000-05-23 Thread JENKINS, JEFF

Hi David,

We have some experience with this at my company, although not involving TNV
circuits.  My company produces high voltage, high frequency power conversion
equipment mainly for the semiconductor manufacturing industry.  We are
constantly challenging the voltage withstand capabilities of materials, and
pcb's are no exception.

We use FR-4 pcb material, and for years we have used a voltage withstand
guideline of 1000 V/mil for the base material and 500 V/mil for the
pre-preg.  As another responder has already noted, you should be able to get
numbers for your specific material from your supplier.

Once you have these numbers, you get to make some easy calculations.  The
way we do it is to take the required transient withstand voltage (based on
the operating voltage and the installation category) and divide it by the
voltage withstand guideline for the material in question.  This will give
you two numbers: one for base material and one for pre-preg.  Since you are
dividing V by V/mil, the results will be in mils.  Now you know how thick
the base and pre-preg layers must be.

If you have just a two-layer board, the pre-preg number doesn't matter and
you can stop reading here.  If you have a multi-layer board, read on. . . .

You must account for the copper on inner layers, since this subtracts from
your insulating material in the z axis (vertical dimension).  The guideline
we use is 1.4 mils per ounce of copper.  So if you're using 2 oz. copper,
your trace will be about 2.8 mils high.  This gets subtracted from the
thickness of the pcb layer.  If you calculated that you needed an 18 mil
thick pre-preg layer, and you're using 2 oz. copper, you actually need a 21
mil thick pre-preg layer because of the copper thickness.  Something to
consider: To what tolerance can your pcb manufacturer hold layer
thicknesses, especially pre-preg layers?  Obviously this affects voltage
withstand capability and should be taken into account when making your
calculations.

If you have through-hole parts or vias in the area of an inner layer ground
plane, of course you need to think about inner layer x,y plane (lateral)
creepage requirements.  Generally speaking, inner layer creepage distances
must be the same as outer layers -- but, there is a way around this that
allows for reduced inner layer spacings.  The trick is to classify the inner
layer x,y plane dimensions as through-thickness insulation, owing to epoxy
bonding.  Then you can reduce the dimension to 0.4 mm in accordance with UL
1950.  You may choose not to reduce to this level; we don't.  We use 1 mm
minimum.  The gotcha is that your agency might insist that your pcb
manufacturer be certified to UL 796 in order to allow this.  (Ours did.)

We have used these methods for several years now with great success and
acceptance from various agencies.

Jeff Jenkins
Regulatory Compliance
Advanced Energy Industries, Inc.
Fort Collins, CO USA


-Original Message-
From: David Gelfand [mailto:gelf...@memotec.com]
Sent: Tuesday, May 23, 2000 9:33 AM
To: 'EMC-PSTC Internet Forum'
Subject: Breakdown voltage between pcb layers



Hello group,

We have an emissions problem on a board and I would like to suggest a ground
plane in the area of an RJ-45 jack (TNV-1).  But we have always asked our
PCB
designers to leave TNV traces free of ground and power planes to avoid
arcing
during surge and dialectric strength tests.

Does anyone know where to find specs on breakdown voltages between PCB
layers?
Has anyone successfully used  ground planes above or below TNV traces?  We
are
testing to UL1950 and Part 68.

Any input would be much appreciated.

Thank you,

David.

David Gelfand
Regulatory Approvals Group Leader
Memotec Communications Inc.
Montreal Canada



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RE: Fwd:RTTE directive

2000-05-23 Thread Kazimier Gawrzyjal
Hi Jim,

Try the following link.

http://www.tsacc.ic.gc.ca/MRA/BlueGuide.pdf

My 2 Cents and not that of my current employer.

Regards,
Kaz Gawrzyjal, P. Eng.
Product Safety Engineer
--
Nortel Networks-Wireless Solutions
Wireless Development Centre
2924 11 Street NE   
Calgary, Alberta
Canada, T2E 7L7 
tel:403-232-4805 (ESN 765)
fax:403-232-4813 (ESN 765)
e-mail:  k...@nortelnetworks.com


-Original Message-
From: Allan, James [mailto:james_al...@milgo.com]
Sent: Tuesday, May 23, 2000 1:01 PM
To: emc-p...@majordomo.ieee.org
Subject: RE: Fwd:RTTE directive



Does anyone have a link to a copy of the Blue Guide mentioned by Tony
below? 

Jim Allan
Senior Compliance Engineer
Milgo Solutions Inc.
E-mail james_al...@milgo.com

 -Original Message-
 From: Tony Reynolds [SMTP:reyno...@pb.com]
 Sent: Tuesday, May 23, 2000 10:56 AM
 To:   k...@i-data.com; emc-p...@majordomo.ieee.org;
 jim_bac...@mail.monarch.com
 Subject:  Re: Fwd:RTTE directive
 
 
  Kim,
  
  According to the information I have on the RTTE Directive (99/5/EC) 
  the following applies to the Declaration of Conformity.
  
  'There is ONE Declaration of Conformity.  It is held by the 
  manufacturer with the technical file for the product.  The standard 
  EN45014 is an accepted model for the DoC, referred to in the Blue 
  Guide*, therefore manufacturers would seem to have no good reason not
 
  to use this model.  The DoC is signed by the manufacturer, and is 
  expected to be in the language used by the manufacturer (and 
  understood by the signatory). A COPY of the DoC (in its original 
  language) must accompany every product.'
  
  *This is a guide to the implementation of Directives based on the New
 
  Approach and Global Approach (EC Doc Certif 98/1) also known as the 
  'Blue Guide'.
  
  This information was on a DTI FAQ paper recently distributed at a
 TAPC 
  meeting.
  
  I hope this helps.
  
  Kind Regards
  
  Tony Reynolds
  Principal Compliance Engineer
  Pitney Bowes Ltd
  The Pinnacles
  Harlow
  Essex.  CM19 5BD
  UK
  
  Tel +44 (0) 1279 449479
  Fax +44 (0) 1279 449118
  e-mail: reyno...@pb.com
  
  
 

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RE: Fwd:RTTE directive

2000-05-23 Thread Art Michael

Hello Jim, 

Just visit the Safety Link www.safetylink.com, drop down to the Safety
Articles, FAQs, MRAs, etc subsection and the third link there, titled,
Guide to the Implementation of Directives Based On A New Approach and
Global Approach  will take you to a website with this document in a
variety of formats.  Or, to shorten the process, once at the Safety Link,
just search on the term Implementation 

Note that the above document, issued in 1999, replaces Certif 98/1 Draft
also known as the Blue Guide.

Regards, Art Michael, Editor - Int'l Product Safety News

 * * * * * * * * * * * * * * * * * * * * * * 
*   International Product Safety Bookshop   *
*  Check out our current offerings! *
* http://www.safetylink.com/bookshop.html *   
*   *
* Now offering BSI's Books  Reports*
*  including, World Electricity Supplies  * 
*   *
* Another service of the Safety Link*
*  www.safetylink.com *
 * * * * * * * * * * * * * * * * * * * * * * 



On Tue, 23 May 2000, Allan, James wrote:

 
 Does anyone have a link to a copy of the Blue Guide mentioned by Tony
 below? 
 
 Jim Allan
 Senior Compliance Engineer
 Milgo Solutions Inc.
 E-mail james_al...@milgo.com
 
  -Original Message-
  From:   Tony Reynolds [SMTP:reyno...@pb.com]
  Sent:   Tuesday, May 23, 2000 10:56 AM
  To: k...@i-data.com; emc-p...@majordomo.ieee.org;
  jim_bac...@mail.monarch.com
  Subject:Re: Fwd:RTTE directive
  
  
   Kim,
   
   According to the information I have on the RTTE Directive (99/5/EC) 
   the following applies to the Declaration of Conformity.
   
   'There is ONE Declaration of Conformity.  It is held by the 
   manufacturer with the technical file for the product.  The standard 
   EN45014 is an accepted model for the DoC, referred to in the Blue 
   Guide*, therefore manufacturers would seem to have no good reason not
  
   to use this model.  The DoC is signed by the manufacturer, and is 
   expected to be in the language used by the manufacturer (and 
   understood by the signatory). A COPY of the DoC (in its original 
   language) must accompany every product.'
   
   *This is a guide to the implementation of Directives based on the New
  
   Approach and Global Approach (EC Doc Certif 98/1) also known as the 
   'Blue Guide'.
   
   This information was on a DTI FAQ paper recently distributed at a
  TAPC 
   meeting.
   
   I hope this helps.
   
   Kind Regards
   
   Tony Reynolds
   Principal Compliance Engineer
   Pitney Bowes Ltd
   The Pinnacles
   Harlow
   Essex.  CM19 5BD
   UK
   
   Tel +44 (0) 1279 449479
   Fax +44 (0) 1279 449118
   e-mail: reyno...@pb.com
   
   
  
 
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interference to Comm devices due to overhead catenaries

2000-05-23 Thread Beard, Susan

Could anyone provide any information relative to overhead catenary noise and
its affects on locomotive roof top comm systems (e.g., GPS)?

Susan Beard

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[SI-LIST] : RE: Charge moving from decoupling capacitors

2000-05-23 Thread George_Tang
Barry, 

The current can flow from the cap, but it will get to the IC at the wrong
time.  

Regards,
George
george_t...@dell.com

-Original Message-
From: Barry Ma [mailto:barry...@altavista.com]
Sent: Tuesday, May 23, 2000 10:22 AM
To: george_t...@exchange.dell.com
Cc: si-l...@silab.eng.sun.com; emc-p...@ieee.org
Subject: RE: Charge moving from decoupling capacitors



George,

I am impressed by your attitude to pursue the correctness, and glad to
discuss with you further on “How does a decoupling capacitor support an IC?”

Here is my two cents worth. The decap supplies necessary charge to the IC
during Tr through a transmission line. As you mentioned before: “The current
is an impulse function, although the voltage waveform is a step function.”
This impulse function, actually a bell-like function on Tr, happens every
time period T when the IC gate switches from low to high. The corresponding
frequency spectrum contains lots of frequencies. There must be some
frequencies making the transmission line a 1/4, 3/4, ... wavelength. It is
hard for me to be convinced that currents of those frequencies cannot flow
from the decap to the IC. ... Pleas correct me if misunderstood. Thanks.

Regards,
Barry Ma
b...@anritsu.com


On Mon, 22 May 2000, george_t...@dell.com wrote:

 
 Barry, 
 
 I need to make a correction.  I was rushing to lunch on Thursday, so I did
 not read over what I wrote.  Here is the correction for the 2nd comment
 below: 
 
 At 1/4 wavelength, the charges are 180 degrees out of phase, so they are
 working against the IC current draw.  1/8 wavelength (90 degrees out of
 phase) is what I consider to be acceptable.  
 
 Regards, 
 
 George Tang
 george_t...@dell.com


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RE: Fwd:RTTE directive

2000-05-23 Thread Allan, James

Does anyone have a link to a copy of the Blue Guide mentioned by Tony
below? 

Jim Allan
Senior Compliance Engineer
Milgo Solutions Inc.
E-mail james_al...@milgo.com

 -Original Message-
 From: Tony Reynolds [SMTP:reyno...@pb.com]
 Sent: Tuesday, May 23, 2000 10:56 AM
 To:   k...@i-data.com; emc-p...@majordomo.ieee.org;
 jim_bac...@mail.monarch.com
 Subject:  Re: Fwd:RTTE directive
 
 
  Kim,
  
  According to the information I have on the RTTE Directive (99/5/EC) 
  the following applies to the Declaration of Conformity.
  
  'There is ONE Declaration of Conformity.  It is held by the 
  manufacturer with the technical file for the product.  The standard 
  EN45014 is an accepted model for the DoC, referred to in the Blue 
  Guide*, therefore manufacturers would seem to have no good reason not
 
  to use this model.  The DoC is signed by the manufacturer, and is 
  expected to be in the language used by the manufacturer (and 
  understood by the signatory). A COPY of the DoC (in its original 
  language) must accompany every product.'
  
  *This is a guide to the implementation of Directives based on the New
 
  Approach and Global Approach (EC Doc Certif 98/1) also known as the 
  'Blue Guide'.
  
  This information was on a DTI FAQ paper recently distributed at a
 TAPC 
  meeting.
  
  I hope this helps.
  
  Kind Regards
  
  Tony Reynolds
  Principal Compliance Engineer
  Pitney Bowes Ltd
  The Pinnacles
  Harlow
  Essex.  CM19 5BD
  UK
  
  Tel +44 (0) 1279 449479
  Fax +44 (0) 1279 449118
  e-mail: reyno...@pb.com
  
  
 

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FW: RTTE directive

2000-05-23 Thread WOODS


--
From:  Corinne SALINGRE [SMTP:corinne.salin...@cstelecom.com]
mailto:[SMTP:corinne.salin...@cstelecom.com] 
Sent:  Tuesday, May 23, 2000 1:25 PM
To:  wo...@sensormatic.com mailto:wo...@sensormatic.com 
Subject:  Re: RTTE directive

This is a very 'touchy' discussion matter now in Brussels...
Main points :
*   difference between 'a' declaration of conformity (writing indicating
that the product is in compliance with the essentail requirements of the
RTTE directive) and 'the' DoC (copy of the original) to be included in the
package : this makes a great difference ('a' DoC can be written in advance,
'the' DoC is often signed in the latest moment ...)
*   'a' DoC can be in the same language than the notice it is included
in, 'the' DoC will be in one (or 1+english) language (the language of the
manufacturer + eventually english). My boss will not signed a paper in 12
languages (and especially if he does not understand what he is signing !)
Even if a decision is made in Brussels, remember that only the local law is
applicable in one country. So some countries can require that 'a' or 'the'
DoC included in the package to be in their language.

Where is harmonization ?
Wait and see ...
Corinne Salingre
CS TELECOM,  France

wo...@sensormatic.com mailto:wo...@sensormatic.com  a écrit :
 I don't recall reading anything in the directive that indicates
the DoC must
 be in multiple languages. If you know otherwise, please specify
the section
 number.

 Richard Woods

 --
 From: jim_bac...@mail.monarch.com
mailto:jim_bac...@mail.monarch.com 
 [SMTP:jim_bac...@mail.monarch.com]
mailto:[SMTP:jim_bac...@mail.monarch.com] 
 Sent: Tuesday, May 23, 2000 8:04 AM
 To:   k...@i-data.com; mailto:k...@i-data.com;
emc-p...@majordomo.ieee.org mailto:emc-p...@majordomo.ieee.org 
 Subject:  Fwd:RTTE directive

 forwarded for Kim.

 Reply Separator
 Subject:  RTTE directive
 Author: k...@i-data.com mailto:k...@i-data.com 
 Date:   5/23/00 12:12 PM

 Dear all

 According to the new RTTE directive we will have to
supply our
 Declaration
 of Conformity in  all EU languages.

 Is RTTE accepted as a reference in all languages or do I
need to
 translate
 it ?

 If I need to translate do anyone know an easy way to do
this ?

 Best regards,

 Kim Boll Jensen
 i-data international
 Denmark

 P.S. The danish translation is: Rådets direktiv om Radio
og
 Teleterminaludstyr 1999/5/EF

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RE: Charge moving from decoupling capacitors

2000-05-23 Thread Barry Ma

George,

I am impressed by your attitude to pursue the correctness, and glad to discuss 
with you further on “How does a decoupling capacitor support an IC?”

Here is my two cents worth. The decap supplies necessary charge to the IC 
during Tr through a transmission line. As you mentioned before: “The current is 
an impulse function, although the voltage waveform is a step function.” This 
impulse function, actually a bell-like function on Tr, happens every time 
period T when the IC gate switches from low to high. The corresponding 
frequency spectrum contains lots of frequencies. There must be some frequencies 
making the transmission line a 1/4, 3/4, ... wavelength. It is hard for me to 
be convinced that currents of those frequencies cannot flow from the decap to 
the IC. ... Pleas correct me if misunderstood. Thanks.

Regards,
Barry Ma
b...@anritsu.com


On Mon, 22 May 2000, george_t...@dell.com wrote:

 
 Barry, 
 
 I need to make a correction.  I was rushing to lunch on Thursday, so I did
 not read over what I wrote.  Here is the correction for the 2nd comment
 below: 
 
 At 1/4 wavelength, the charges are 180 degrees out of phase, so they are
 working against the IC current draw.  1/8 wavelength (90 degrees out of
 phase) is what I consider to be acceptable.  
 
 Regards, 
 
 George Tang
 george_t...@dell.com


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RE: Hazardous Infrared radiation ?

2000-05-23 Thread Peter Tarver
IEC60825-1 contains requirements for noncoherent infrared radiation.
Likewise does EN60825-1, with Amendment A11.

Regards,

Peter L. Tarver, PE
ptar...@nortelnetworks.com



From: Israel Yeshurun [mailto:israel_yeshu...@creoscitex.com]

 Can some comment on this ?

  Can Infrared radiation (not Laser) be hazardous ? Obviously, high
enough IR intensity should be hazardous. As the eye may not blink under
exposure to IR (as the eye can not see it) the natural eye protection
mechanism may not function.

 Any standards, guidelines available for permissible exposure limits to
Infra red radiation ?


 Many thanks to every contribution !

 with  Best Regards,   Israel Yeshurun.  CreoScitex.   Israel


RE: Breakdown voltage between pcb layers

2000-05-23 Thread Mark Gill
David -

You should be able to get a ballpark figure from your PCB manufacturer (need
to consider the properties of the materials you may be using in the PCB).
You could also scan the various safety standards for values, but these are
upper limits, and therefore conservative.

Regards,

Mark Gill, P.E.
EMC/Safety/NEBS Design
Nortel Networks - RTP, NC, USA

 -Original Message-
 From: David Gelfand [SMTP:gelf...@memotec.com]
 Sent: Tuesday, May 23, 2000 11:33 AM
 To:   'EMC-PSTC Internet Forum'
 Subject:  Breakdown voltage between pcb layers
 
 
 Hello group,
 
 We have an emissions problem on a board and I would like to suggest a
 ground
 plane in the area of an RJ-45 jack (TNV-1).  But we have always asked our
 PCB
 designers to leave TNV traces free of ground and power planes to avoid
 arcing
 during surge and dialectric strength tests.
 
 Does anyone know where to find specs on breakdown voltages between PCB
 layers?
 Has anyone successfully used  ground planes above or below TNV traces?  We
 are
 testing to UL1950 and Part 68.
 
 Any input would be much appreciated.
 
 Thank you,
 
 David.
 
 David Gelfand
 Regulatory Approvals Group Leader
 Memotec Communications Inc.
 Montreal Canada
 
 
 
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Hazardous Infrared radiation - THANKS

2000-05-23 Thread Israel Yeshurun


  Richard Woods, John Juhasz, Geoff Lister  

   Thank you for your responses !

Best Regards, Israel Yeshurun.  

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Breakdown voltage between pcb layers

2000-05-23 Thread David Gelfand

Hello group,

We have an emissions problem on a board and I would like to suggest a ground
plane in the area of an RJ-45 jack (TNV-1).  But we have always asked our PCB
designers to leave TNV traces free of ground and power planes to avoid arcing
during surge and dialectric strength tests.

Does anyone know where to find specs on breakdown voltages between PCB layers?
Has anyone successfully used  ground planes above or below TNV traces?  We are
testing to UL1950 and Part 68.

Any input would be much appreciated.

Thank you,

David.

David Gelfand
Regulatory Approvals Group Leader
Memotec Communications Inc.
Montreal Canada



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RE: RTTE directive

2000-05-23 Thread WOODS

I don't recall reading anything in the directive that indicates the DoC must
be in multiple languages. If you know otherwise, please specify the section
number.

Richard Woods

--
From:  jim_bac...@mail.monarch.com
[SMTP:jim_bac...@mail.monarch.com]
Sent:  Tuesday, May 23, 2000 8:04 AM
To:  k...@i-data.com; emc-p...@majordomo.ieee.org
Subject:  Fwd:RTTE directive


forwarded for Kim.

Reply Separator
Subject:RTTE directive
Author: k...@i-data.com
Date:   5/23/00 12:12 PM

Dear all

According to the new RTTE directive we will have to supply our
Declaration
of Conformity in  all EU languages.

Is RTTE accepted as a reference in all languages or do I need to
translate
it ?

If I need to translate do anyone know an easy way to do this ?

Best regards,

Kim Boll Jensen
i-data international
Denmark

P.S. The danish translation is: Rådets direktiv om Radio og
Teleterminaludstyr 1999/5/EF



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RE: Evaluation Boards

2000-05-23 Thread jestuckey

I had forwarded this to Vic upon receiving his request last week, but
viewing some on the responses that I have seen, I feel it would be
appropriate to put it out for general viewing.

Look at 47 CFR 
§ 2.803 Marketing of radio frequency devices prior to equipment
authorization.
(a) Except as provided elsewhere in this section, no person shall sell or
lease, or offer for sale or lease (including advertising for sale or lease),
or import, ship, or distribute for the purpose of selling or leasing or
offering for sale or lease, any radio frequency device unless:
(1) In the case of a device subject to certification, such device has been
authorized by the Commission in accordance with the rules in this chapter
and is properly identified and labeled as required by § 2.925 and other
relevant sections in this chapter; or 
(2) In the case of a device that is not required to have a grant of
equipment authorization issued by the Commission, but which must comply with
the specified technical standards prior to use, such device also complies
with all applicable administrative (including verification of the equipment
or authorization under a Declaration of Conformity, where required),
technical, labeling and identification requirements specified in this
chapter. 
(b) The provisions of paragraph (a) of this section do not prohibit
conditional sales contracts between manufacturers and wholesalers or
retailers where de-livery is contingent upon compliance with the applicable
equipment authorization and technical requirements, nor do they prohibit
agreements between such parties to produce new products, manufactured in
accordance with designated specifications.
(c) Notwithstanding the provisions of paragraphs (a), (b), (d) and (f) of
this section, a radio frequency device may be advertised or displayed, e.g.,
at a trade show or exhibition, prior to equipment authorization or, for
devices not subject to the equipment authorization requirements, prior to a
determination of compliance with the applicable technical requirements
provided that the advertising contains, and the display is accompanied by, a
conspicuous notice worded as follows:

This device has not been authorized as required by the rules of the Federal
Communications Commission. This device is not, and may not be, offered for
sale or lease, or sold or leased, until authorization is obtained. 

(1) If the product being displayed is a prototype of a product that has been
properly authorized and the prototype, itself, is not authorized due to
differences between the prototype and the authorized product, the following
disclaimer notice may be used in lieu of the notice stated in paragraph (c)
introductory text of this section:

Prototype. Not for sale.

(2) Except as provided elsewhere in this chapter, devices displayed under
the provisions of paragraphs (c) introductory text, and (c)(1) of this
section may not be activated or operated. (d) Notwithstanding the provisions
of paragraph (a) of this section, the offer for sale solely to business,
commercial, industrial, scientific or medical users (but not an offer for
sale to other par-ties or to end users located in a residential environment)
of a radio frequency device that is in the conceptual, developmental, design
or pre-production stage is permitted prior to equipment authorization or,
for devices not subject to the equipment authorization requirements, prior
to a determination of compliance with the applicable technical requirements
provided that the prospective buyer is advised in writing at the time of the
offer for sale that the equipment is subject to the FCC rules and that the
equipment will comply with the appropriate rules be-fore delivery to the
buyer or to centers of distribution. If a product is marketed in compliance
with the provisions of this paragraph, the product does not need to be
labeled with the statement in paragraph (c) of this section. 
(e)(1) Notwithstanding the provisions of paragraph (a) of this section,
prior to equipment authorization or determination of compliance with the
applicable technical requirements any radio frequency device may be
operated, but not marketed, for the following purposes and under the
following conditions: (i) Compliance testing; (ii) Demonstrations at a trade
show provided the notice contained in paragraph (c) of this section is
displayed in a conspicuous location on, or immediately adjacent to, the
device;
(iii) Demonstrations at an exhibition conducted at a business, commercial,
industrial, scientific, or medical location, but excluding locations in a
residential environment, provided the notice contained in paragraphs (c) or
(d)

Furthermore it would be wise to include an engineering data gathering
request to be returned to you upon completion.

Best regards,

 JOHN E. STUCKEY
 EMC Engineer
 
 Micron Technology, Inc.
 Integrated Products Group 
 Micron Architectures Lab
 8455 West Emerald St.
 Boise, Idaho 83704
 PH: (208) 363-5313
 FX: (208) 363-5596
 

Re: Fwd:RTTE directive

2000-05-23 Thread Tony Reynolds

 Kim,
 
 According to the information I have on the RTTE Directive (99/5/EC) 
 the following applies to the Declaration of Conformity.
 
 'There is ONE Declaration of Conformity.  It is held by the 
 manufacturer with the technical file for the product.  The standard 
 EN45014 is an accepted model for the DoC, referred to in the Blue 
 Guide*, therefore manufacturers would seem to have no good reason not 
 to use this model.  The DoC is signed by the manufacturer, and is 
 expected to be in the language used by the manufacturer (and 
 understood by the signatory). A COPY of the DoC (in its original 
 language) must accompany every product.'
 
 *This is a guide to the implementation of Directives based on the New 
 Approach and Global Approach (EC Doc Certif 98/1) also known as the 
 'Blue Guide'.
 
 This information was on a DTI FAQ paper recently distributed at a TAPC 
 meeting.
 
 I hope this helps.
 
 Kind Regards
 
 Tony Reynolds
 Principal Compliance Engineer
 Pitney Bowes Ltd
 The Pinnacles
 Harlow
 Essex.  CM19 5BD
 UK
 
 Tel +44 (0) 1279 449479
 Fax +44 (0) 1279 449118
 e-mail: reyno...@pb.com
 
 


__ Reply Separator _
Subject: Fwd:RTTE directive
Author:  jim_bac...@mail.monarch.com at SMTPGWY
List-Post: emc-pstc@listserv.ieee.org
Date:23/05/00 13:04


 
forwarded for Kim.
 
Reply Separator 
Subject:RTTE directive
Author: k...@i-data.com
List-Post: emc-pstc@listserv.ieee.org
Date:   5/23/00 12:12 PM
 
Dear all
 
According to the new RTTE directive we will have to supply our Declaration 
of Conformity in  all EU languages.
 
Is RTTE accepted as a reference in all languages or do I need to translate 
it ?
 
If I need to translate do anyone know an easy way to do this ?
 
Best regards,
 
Kim Boll Jensen
i-data international
Denmark
 
P.S. The danish translation is: RÕdets direktiv om Radio og 
Teleterminaludstyr 1999/5/EF
 
 
 
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 Richard Nute:   ri...@ieee.org
 
 
 


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RE: Charge moving from decoupling capacitors

2000-05-23 Thread Roncone Paolo

George,
can you pls explain your correction ?
I supposed your first statement (At 1/4 wavelength, the charges are 90 
degrees out of phase) was the correct one ! 

Paolo Roncone
Compuprint s.p.a.

Reply Separator
Subject:RE: Charge moving from decoupling capacitors
Author: george_t...@dell.com
List-Post: emc-pstc@listserv.ieee.org
Date:   5/22/00 9:14 PM

Barry, 

I need to make a correction.  I was rushing to lunch on Thursday, so I
did
not read over what I wrote.  Here is the correction for the 2nd comment
below: 

At 1/4 wavelength, the charges are 180 degrees out of phase, so they are
working against the IC current draw.  1/8 wavelength (90 degrees out of
phase) is what I consider to be acceptable.  

Regards, 

George Tang
george_t...@dell.com



-Original Message-
From: Tang, George 
Sent: Thursday, May 18, 2000 12:31 PM
To: 'Barry Ma'; Tang, George
Cc: si-l...@silab.eng.sun.com; emc-p...@ieee.org
Subject: RE: Charge moving from decoupling capacitors


Barry, 

Thanks for the comments.  Here are my comments:  

Ok, you put caps at a certain distance away from the IC because you only
want them to work at 100 MHz.  But that distance turns out to be the 1/4
wave distance at 400 MHz, and you placed enough caps at the 1/4 wave
distance to cause board resonance.  Now what?  Do you tell the caps not
to
work at 400 MHz because it's not their frequency?  


For your 2nd comment:

I used the words loosely define for that reason.  If you are
interested in
high frequency decoupling and instantaneous current, you really want to
have
all your charges moving in phase.  At 1/4 wavelength, the charges are 90
degrees out of phase, so they will not do much for your instantaneous
current.  1/8 wavelength is what I consider to be acceptable.  You can
certainly pick a different number.  

Regards, 

George Tang
george_t...@dell.com



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Fwd:RE: Charge moving from decoupling capacitors

2000-05-23 Thread Jim Bacher

for George

Reply Separator
Subject:RE: Charge moving from decoupling capacitors
Author: george_t...@dell.com
List-Post: emc-pstc@listserv.ieee.org
Date:   5/22/00 9:14 PM

Barry, 

I need to make a correction.  I was rushing to lunch on Thursday, so I did
not read over what I wrote.  Here is the correction for the 2nd comment
below: 

At 1/4 wavelength, the charges are 180 degrees out of phase, so they are
working against the IC current draw.  1/8 wavelength (90 degrees out of
phase) is what I consider to be acceptable.  

Regards, 

George Tang
george_t...@dell.com



-Original Message-
From: Tang, George 
Sent: Thursday, May 18, 2000 12:31 PM
To: 'Barry Ma'; Tang, George
Cc: si-l...@silab.eng.sun.com; emc-p...@ieee.org
Subject: RE: Charge moving from decoupling capacitors


Barry, 

Thanks for the comments.  Here are my comments:  

Ok, you put caps at a certain distance away from the IC because you only
want them to work at 100 MHz.  But that distance turns out to be the 1/4
wave distance at 400 MHz, and you placed enough caps at the 1/4 wave
distance to cause board resonance.  Now what?  Do you tell the caps not to
work at 400 MHz because it's not their frequency?  


For your 2nd comment:

I used the words loosely define for that reason.  If you are interested in
high frequency decoupling and instantaneous current, you really want to have
all your charges moving in phase.  At 1/4 wavelength, the charges are 90
degrees out of phase, so they will not do much for your instantaneous
current.  1/8 wavelength is what I consider to be acceptable.  You can
certainly pick a different number.  

Regards, 

George Tang
george_t...@dell.com


-Original Message-
From: Barry Ma [mailto:barry...@altavista.com]
Sent: Thursday, May 18, 2000 10:50 AM
To: george_t...@exchange.dell.com
Cc: si-l...@silab.eng.sun.com; emc-p...@ieee.org
Subject: RE: Charge moving from decoupling capacitors


George,

Thanks for your long input. I'd like to make some comments below.
-
On Wed, 17 May 2000, george_t...@dell.com wrote:

 Large parallel plates behave as transmission lines.  A quarter wavelength
 transmission line with a short at the end has infinite impedance, so
 capacitors placed 1/4 wavelength away are bad.  

That's why decaps work on low frequency portion. Let's set 100 MHz and below
for decaps to cover. The wavelength at 100 MHz is 3 meters. A quarter of it
is 75 cm. It's long enough to ordinary PCB size. (The cap is directly
connected to pwr/gnd planes.)


 This means that we can loosely define the largest usable board area
capacitance as 1/8 
 wavelength radius of copper surrounding the IC power pin.  Charges stored
on the planes
 further than 1/8 wavelength away are not very usable due to the time
delay.
 At 500MHz in FR4, 1/8 wavelength is 1.5 inches.  Is such a board capacitor
 good enough for your IC?  

George, I beg for differentials. How did you jump from capacitors placed
1/4 wavelength away are bad to the largest usable board area capacitance
as 1/8 wavelength radius?

Can I use the same token to infer from caps placed one wavelength away are
good to the largest usable board area capacitance is within 1/2 wavelength
radius? And so, and so on.

Regards,
Barry Ma
b...@anritsu.com



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Fwd:RTTE directive

2000-05-23 Thread Jim Bacher

forwarded for Kim.

Reply Separator
Subject:RTTE directive
Author: k...@i-data.com
List-Post: emc-pstc@listserv.ieee.org
Date:   5/23/00 12:12 PM

Dear all

According to the new RTTE directive we will have to supply our Declaration
of Conformity in  all EU languages.

Is RTTE accepted as a reference in all languages or do I need to translate
it ?

If I need to translate do anyone know an easy way to do this ?

Best regards,

Kim Boll Jensen
i-data international
Denmark

P.S. The danish translation is: Rådets direktiv om Radio og
Teleterminaludstyr 1999/5/EF



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RE: Evaluation Boards

2000-05-23 Thread David_Sterner

 Vic,
 There is no US legal obligation for EMC/safety on development boards 
 so long as they are offered for sale.  If a system containing the 
 board is offered for sale, then the system must pass EMI requirements 
 any market-imposed safety requirements (e.g. UL1950).
 
 If the customer usually incorporates the development board circuitry 
 into a larger PWBA, app. notes will prevent frantic calls at the end 
 of the development cycle about not passing EMC and safety.
 
 EMC
 If the development board fails applicable requirements, you should 
 provide an app. note explaining how to meet the requirements.
 
 SAFETY
 Any special markings, warnings, telco restrictions, etc. should be 
 explained in an app. note.
 
 David


__ Reply Separator
_
Subject: Evaluation Boards
Author:  Vic Gibling SMTP:v...@virata.com at ADEMCONET
List-Post: emc-pstc@listserv.ieee.org
Date:5/22/2000 11:34 AM


Hi All
 
As a chip manufacturer we provide Evaluation Boards to licencees for product

development.
 
I would appreciate any advice, guidance or comments regarding safety and emc

issues with regard to these boards.
 
Thank you.
 
Vic Gibling
 
v...@virata.com
 
 
 

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RE: Safety: Hi-Pot Suppression for TNV lines

2000-05-23 Thread Jody Leber

Chris,

Have you considered spray-on conformal coating in the telco area?  Tech Spray 
SR is one option that is also UL Recognized.

Best Regards,

Jody Leber

jle...@ustech-lab.com
http://www.ustech-lab.com

U. S. Technologies
3505 Francis Circle
Alpharetta, GA 30004

770.740.0717
Fax:  770.740.1508


-Original Message-
From:   Maxwell, Chris [SMTP:chr...@gnlp.com]
Sent:   Monday, May 22, 2000 10:34 AM
To: 'EMC-PSTC Internet Forum'
Subject:Safety:  Hi-Pot Suppression for TNV lines


Group,

Is there an in-line adapter that we can install on a TNV line (in our case,
a typical RJ12 phone line) to our product that will provide a second layer
of hi-pot protection?  The whole explanation follows for those who think
they can help.  Others can press delete right now and get on with their day.

We produce a piece of fiber optic test equipment that is rack mounted and
operates from 48VDC.  Most of our typical equipment does not have TNV
connections, however this does.  We have designed a remote reset option.
The remote reset consists of an RJ12 jack on the back of the unit.  The user
can plug a phone line into this jack.  Once installed, the user can perform
a 5 second power down on the unit by dialing the unit's phone number and
letting the line ring 5 times.

This has proved valuable to customers because the units are designed for
remote installation.   If the unit hangs up, they don't have to drive, fly,
hike or swim out to where the unit is installed to perform a hard re-boot. 

This remote reset line only takes in the TIP and RING signals (the RJ12
only has pins 3 and 4 populated).  Both TIP and RING have MOV's going to
chassis ground.  We have had the unit safety tested.  During safety testing,
the MOV's were cut (creating a single fault condition).  When the MOV's were
cut, the hipot test caused an arc to ground on a circuitboard within the
unit.  This arc was considered a failure.  My guess is that the arc is
caused by the fact that the tip and ring signals run close to a piece of the
ground plane on the top layer of the board.  My first stab at fixing this
would be to clear out the ground plane so that it is furthur away from tip
and ring.

Now, even minor changes to circuitboards can cost thousands.  It can also
mean scrap.  This unit is a very low volume product (hundreds annually).  It
may be more cost effective for us to add some sort of in-line suppressor
external to the unit as opposed to revising the circuitboard.  Given that
the unit is rack mounted, I am assuming that there would be room in the rack
to mount such a device, if it existed.  Hence my question.

Anybody have any ideas?

Thank you for your time.

Chris Maxwell, Design Engineer
GN Nettest Optical Division
109 N. Genesee St.  
Utica, NY 13502
PH:  315-797-4449
FAX:  315-797-8024
EMAIL:  chr...@gnlp.com



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[SI-LIST] : RE: Charge moving from decoupling capacitors

2000-05-23 Thread George_Tang
Barry, 

I need to make a correction.  I was rushing to lunch on Thursday, so I did
not read over what I wrote.  Here is the correction for the 2nd comment
below: 

At 1/4 wavelength, the charges are 180 degrees out of phase, so they are
working against the IC current draw.  1/8 wavelength (90 degrees out of
phase) is what I consider to be acceptable.  

Regards, 

George Tang
george_t...@dell.com



-Original Message-
From: Tang, George 
Sent: Thursday, May 18, 2000 12:31 PM
To: 'Barry Ma'; Tang, George
Cc: si-l...@silab.eng.sun.com; emc-p...@ieee.org
Subject: RE: Charge moving from decoupling capacitors


Barry, 

Thanks for the comments.  Here are my comments:  

Ok, you put caps at a certain distance away from the IC because you only
want them to work at 100 MHz.  But that distance turns out to be the 1/4
wave distance at 400 MHz, and you placed enough caps at the 1/4 wave
distance to cause board resonance.  Now what?  Do you tell the caps not to
work at 400 MHz because it's not their frequency?  


For your 2nd comment:

I used the words loosely define for that reason.  If you are interested in
high frequency decoupling and instantaneous current, you really want to have
all your charges moving in phase.  At 1/4 wavelength, the charges are 90
degrees out of phase, so they will not do much for your instantaneous
current.  1/8 wavelength is what I consider to be acceptable.  You can
certainly pick a different number.  

Regards, 

George Tang
george_t...@dell.com


-Original Message-
From: Barry Ma [mailto:barry...@altavista.com]
Sent: Thursday, May 18, 2000 10:50 AM
To: george_t...@exchange.dell.com
Cc: si-l...@silab.eng.sun.com; emc-p...@ieee.org
Subject: RE: Charge moving from decoupling capacitors


George,

Thanks for your long input. I'd like to make some comments below.
-
On Wed, 17 May 2000, george_t...@dell.com wrote:

 Large parallel plates behave as transmission lines.  A quarter wavelength
 transmission line with a short at the end has infinite impedance, so
 capacitors placed 1/4 wavelength away are bad.  

That’s why decaps work on low frequency portion. Let’s set 100 MHz and below
for decaps to cover. The wavelength at 100 MHz is 3 meters. A quarter of it
is 75 cm. It’s long enough to ordinary PCB size. (The cap is directly
connected to pwr/gnd planes.)


 This means that we can loosely define the largest usable board area
capacitance as 1/8 
 wavelength radius of copper surrounding the IC power pin.  Charges stored
on the planes
 further than 1/8 wavelength away are not very usable due to the time
delay.
 At 500MHz in FR4, 1/8 wavelength is 1.5 inches.  Is such a board capacitor
 good enough for your IC?  

George, I beg for differentials. How did you jump from capacitors placed
1/4 wavelength away are bad to the largest usable board area capacitance
as 1/8 wavelength radius?

Can I use the same token to infer from caps placed one wavelength away are
good to the largest usable board area capacitance is within 1/2 wavelength
radius? And so, and so on.

Regards,
Barry Ma
b...@anritsu.com



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RE: Safety: Hi-Pot Suppression for TNV lines

2000-05-23 Thread David Spencer

Chris,
Clear away the ground plane to give you the proper clearance.  You need to
be able to pass the tests without an external protector.  You didn't mention
Part 68 in your message.  You do need that as well, plus an FCC Registration
Number (although what you have to do to file for it may be changing very
soon), manual verbiage, etc.

If all else fails, you could supply a remote modem switch that would
control power to your product.  There are a few manufacturers but they can
be a little pricey.

Dave Spencer
Oresis Communications  

-Original Message-
From: Eric Petitpierre [mailto:eric.petitpie...@pulse.com]
Sent: Monday, May 22, 2000 10:14 AM
To: emc-p...@majordomo.ieee.org; Maxwell; Chris
Subject: Re: Safety: Hi-Pot Suppression for TNV lines



 Chris,
 
 Usually the hi-pot tests done during the safety evaluation are meant 
 to verify spacings and insulation.  The hi-pot tests I have seen 
 usually allow intentional paths to ground to be disconnected.  It is 
 the trace separation,etc, you are interested in, not how well the MOV 
 conducts.  Both MOV's are considered intentional paths to ground.
 Both should  to be disconnected at the ground side during the test.
 If only one is disconnected, you may still have a path, whether it is 
 direct, or through the contacts (open or closed) of the hookswitch.
 
 Eric Petitpierre
 Pulsecom
 Herndon, VA
 eric.petitpie...@pulse.com
 
 


__ Reply Separator
_
Subject: Safety:  Hi-Pot Suppression for TNV lines
Author:  chr...@gnlp.com (Maxwell; Chris) at smtp
List-Post: emc-pstc@listserv.ieee.org
Date:5/22/00 10:33 AM


Group,
 
Is there an in-line adapter that we can install on a TNV line (in our case, 
a typical RJ12 phone line) to our product that will provide a second layer 
of hi-pot protection?  The whole explanation follows for those who think 
they can help.  Others can press delete right now and get on with their day.
 
We produce a piece of fiber optic test equipment that is rack mounted and 
operates from 48VDC.  Most of our typical equipment does not have TNV 
connections, however this does.  We have designed a remote reset option. 
The remote reset consists of an RJ12 jack on the back of the unit.  The user

can plug a phone line into this jack.  Once installed, the user can perform 
a 5 second power down on the unit by dialing the unit's phone number and 
letting the line ring 5 times.
 
This has proved valuable to customers because the units are designed for 
remote installation.   If the unit hangs up, they don't have to drive, fly, 
hike or swim out to where the unit is installed to perform a hard re-boot.
 
This remote reset line only takes in the TIP and RING signals (the RJ12 
only has pins 3 and 4 populated).  Both TIP and RING have MOV's going to 
chassis ground.  We have had the unit safety tested.  During safety testing,

the MOV's were cut (creating a single fault condition).  When the MOV's were

cut, the hipot test caused an arc to ground on a circuitboard within the 
unit.  This arc was considered a failure.  My guess is that the arc is 
caused by the fact that the tip and ring signals run close to a piece of the

ground plane on the top layer of the board.  My first stab at fixing this 
would be to clear out the ground plane so that it is furthur away from tip 
and ring.
 
Now, even minor changes to circuitboards can cost thousands.  It can also 
mean scrap.  This unit is a very low volume product (hundreds annually).  It

may be more cost effective for us to add some sort of in-line suppressor 
external to the unit as opposed to revising the circuitboard.  Given that
the 
unit is rack mounted, I am assuming that there would be room in the rack to 
mount such a device, if it existed.  Hence my question.
 
Anybody have any ideas?
 
Thank you for your time.
 
Chris Maxwell, Design Engineer
GN Nettest Optical Division
109 N. Genesee St.
Utica, NY 13502
PH:  315-797-4449
FAX:  315-797-8024
EMAIL:  chr...@gnlp.com
 
 
 
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