Re: ESD testing

2009-05-18 Thread emc-p...@ieee.org
The fun part of air discharges to insulating surfaces is that things are not
always what they appear to be.  The air discharge can find a way around lots
of apparent insulation to find the nearest conductor and insert all sorts of
havoc in the system.

- Bill
Indecision may or may not be the problem.

--- On Mon, 5/18/09, Gordon,Ian ian.gor...@edwardsvacuum.com wrote:



From: Gordon,Ian ian.gor...@edwardsvacuum.com
Subject: ESD testing
To: IEEE EMC  SAFETY PSTC emc-p...@ieee.org
Date: Monday, May 18, 2009, 7:09 AM


All
Is it necessary to apply both air  contact discharges to equipment
given the following?:

Looking at 61000-4-2 I believe the critical part is the first paragraph
of section 7 .Test set-up.

.application of discharges to the EUT in the following manner:
a) contact discharge to the conductive surfaces and coupling planes;
b) air discharge at insulating surfaces.

it does not say for air discharge at insulating AND conductive surfaces.
The table in section. 8.3.1 is just for conductors but is essentially a
restatement of the above.
I cannot see any other part of the spec that implies the opposite.


Ian Gordon  

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RE: ESD testing

2009-05-18 Thread emc-p...@ieee.org
Ian,
Have you checked the relevant product standard for your application?  61000
series is really only a description of test setup and methodology.  The
product standard would have the actual specifications.  For example, EN55024
for ITE

Contact discharge is usually the preferred method of discharge when available.
 My interpretation has always been that it's an either/or kind of scenario.

Adam Rudd


From: emc-p...@ieee.org [mailto:emc-p...@ieee.org] On Behalf Of Gordon,Ian
Sent: Monday, May 18, 2009 7:09 AM
To: IEEE EMC  SAFETY PSTC
Subject: ESD testing

All
Is it necessary to apply both air  contact discharges to equipment
given the following?:
 
Looking at 61000-4-2 I believe the critical part is the first paragraph
of section 7 .Test set-up.
 
.application of discharges to the EUT in the following manner:
a) contact discharge to the conductive surfaces and coupling planes;
b) air discharge at insulating surfaces.
 
it does not say for air discharge at insulating AND conductive surfaces.
The table in section. 8.3.1 is just for conductors but is essentially a
restatement of the above.
I cannot see any other part of the spec that implies the opposite.
 

Ian Gordon  




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Re: ESD testing

2009-05-18 Thread emc-p...@ieee.org
In message 
2AA8A4298DECF8469C66C8F3A2B9589201211031@GB02QEX01PEDV27.rmhost1.local, 
dated Mon, 18 May 2009, Gordon,Ian ian.gor...@edwardsvacuum.com 
writes:

Is it necessary to apply both air  contact discharges to equipment 
given the following?:

Looking at 61000-4-2 I believe the critical part is the first paragraph 
of section 7 .Test set-up.

.application of discharges to the EUT in the following manner:
a) contact discharge to the conductive surfaces and coupling planes;
b) air discharge at insulating surfaces.

it does not say for air discharge at insulating AND conductive 
surfaces. The table in section. 8.3.1 is just for conductors but is 
essentially a restatement of the above. I cannot see any other part of 
the spec that implies the opposite.


61000-4-2- is a Basic standard and doesn't (or shouldn't) specify 
exactly what is required for specific products. Those details are 
specified in the relevant Product or Product Family standard or, if they 
don't exist, in the applicable Generic standard.
-- 
OOO - Own Opinions Only. Try www.jmwa.demon.co.uk and www.isce.org.uk
Things can always get better. But that's not the only option.
John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK

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RE: ESD testing - automotive

2006-08-18 Thread emc-p...@ieee.org
Vic,

I wonder how realistic this type of test is. It does model a charged person
touching the floating device. But another ESD mode is when a person is
holding the device and touches the device to the car body. In this case it
is more like a CDM discharge with very high current for the time it takes
the energy to propagate to the end of the device and back - or not. The
person holding the phone does act as a fairly good termination as the device
characteristic impedance will be close to the characteristic impedance of
the persons arm - about 300 ohms. In this situation the high current will
exist for the time it takes the signal to propagate one way. For a cell
phone the high current will exist for a few hundred picoseconds. 

  Dave Cuthbert
  


  LINEAR TECHNOLOGY CORPORATION

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From: emc-p...@ieee.org [mailto:emc-p...@ieee.org] On Behalf Of Vic
Gibling-NonTRW
Sent: Friday, August 18, 2006 5:43 AM
To: emc-p...@ieee.org
Subject: ESD testing - automotive

Dear colleagues,

The unpowered product is required to be insulated from the ground
plane. The product is NOT grounded. 

It is subjected to a number of discharges at a rate of 1 - 10 seconds.
If the charge does not neutralise before the next discharge what happens
and why is this test done in this manner?

The same product (and arrangement) receives discharges to each
connector pin. To ease applying the discharge to small pins a short
single pin extender is used. The procedure is to remove the extender
after fulfilling the discharge requirements and use it for the next. It
is removed by hand. Any comments?

I would appreciate your views and comments.

Vic 

Vagabond EMC Engineer

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RE: ESD testing - automotive

2006-08-18 Thread emc-p...@ieee.org
Vic,
An unpowered product does not have the ground wire (green wire) in the power
cord as an AC powered system (such as a PC) does. So, the ESD current injected
into the unpowered prodcut does not have a direct conductive path to the
ground plane and back to the ESD generator. This is the reason why the
unpowered prodcut should not be grounded during ESD testing.
 
As there is no ground connection during the test, we need to remove the
charges off the system before the next zap. Otherwise due to the residual
charges on the system, the ESD generator can not fully discharge on the next
zap. There are different methods to remove the charges: use a conductive brush
and brush off the charges between zaps, make a momentary ground connection
thru a 1 MOhm resistor between zaps, etc.
 
If you are concerned about the possibility of discharges from the human body
into the pins, the person touching the pin extender could wear a ground strap.
This way, the pins will not receive any unwanted human ESD.
 
Thanks,
Ram Chundru
System Level ESD Engineer
Texas Instruments. 

  _  

From: emc-p...@ieee.org on behalf of Vic Gibling-NonTRW
Sent: Fri 8/18/2006 6:43 AM
To: emc-p...@ieee.org
Subject: ESD testing - automotive



Dear colleagues,

The unpowered product is required to be insulated from the ground
plane. The product is NOT grounded.

It is subjected to a number of discharges at a rate of 1 - 10 seconds.
If the charge does not neutralise before the next discharge what happens
and why is this test done in this manner?

The same product (and arrangement) receives discharges to each
connector pin. To ease applying the discharge to small pins a short
single pin extender is used. The procedure is to remove the extender
after fulfilling the discharge requirements and use it for the next. It
is removed by hand. Any comments?

I would appreciate your views and comments.

Vic

Vagabond EMC Engineer

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Re: ESD Testing Method

2002-12-04 Thread John Barnes

Alex,
Amendment 2:2001 to EN 61000-4-2:1995 (same as Amendment A2:2000 to IEC
61000-4-2:1995) calls for discharging ungrounded equipment, or
ungrounded part(s) of equipment between ESD zaps.  You use a bleeder
cable with 470k resistors at both ends, connected to the horizontal
coupling plane for tabletop equipment.  You may leave the bleeder cable
attached if it doesn't bother the equipment under test (EUT).  But the
definitive method is to briefly touch the bleeder cable to the EUT, zap
the EUT, briefly touch the bleeder cable to the EUT, etc.

This amendment also permits:
*  Long delays between ESD zaps.
*  Using a carbon-fiber brush with bleeder resistors.
*  Using an air ionizer (must be turned off for the air-discharge zaps).

John Barnes KS4GL, SM IEEE
dBi Corporation
http://www.dbicorporation.com/

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Re: ESD Testing Method

2002-12-04 Thread Jim . Hulbert


Amendment 2 to IEC 61000-4-2:1995 specifically addresses the test method
for ungrounded equipment.  Refer to section 7.1.3 of that standard.  To
answer your first question, yes the charge applied to the product should be
discharged before applying the next discharge.  Regarding your follow up
question, if you apply +8kV discharge followed by -8kV discharge, without
removing the charge from the EUT between the discharges, then the actual
potential voltage is 16kV which could very well overstress the product.

Jim Hulbert
Pitney Bowes




  
  Alex McNeil   
  
  alex.mcneil@ingenicoforTo:   
'emc-p...@majordomo.ieee.org' emc-p...@majordomo.ieee.org 
  tronic.com cc:   
  
  Sent by:Subject:  ESD Testing 
Method
  owner-emc-pstc@majordomo  
  
  .ieee.org 
  

  

  
  12/03/2002 11:15 AM   
  
  Please respond to Alex
  
  McNeil
  

  

  





Hi Guys,
1. For double insulated products (non-earthed) is it correct to state that
the ESD test point, for Contact Discharge (CD) tests, should be discharged
prior to applying the next discharge (I am sure I read this somewhere,
but)?
2. As a follow on from the first question, I have a product that will pass
+8KV Contact Discharge (CD) in +2KV steps. It will also pass -8KV CD in
-2KV
steps. However, if I test +XKV (50 zaps) followed by -XKV (1 zap) it will
fail. What is the correct procedure as the standard does not say if +CD
should follow -CD or vice versa or step up with the same polarity?

In my opinion it would be unlikely in a particular customer environment
that
the +XKV would be quickly followed by a -XKV (or vice versa).

I look forward, as per usual, to your kind and expert responses.

Kind Regards
Alex McNeil
Principal Engineer
Tel: +44 (0)131 479 8375
Fax:+44 (0)131 479 8321
email: alex.mcn...@ingenicofortronic.com


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RE: ESD Testing Method

2002-12-03 Thread Pommerenke, David

Dear Alex McNeil,

The intend of the standard is that each discharge is an individual
event. This means:

Electromagnetic consequence
===
All charges need to be drained before the next discharge is applied. You
may use an Ionizer, a conductive brush, a ground wire etc. to remove the
charge from the EUT. Be aware: An Ionizer may change the test results
for air discharges a lot. 


Software consequence

It is not the aim to apply an discharge while the EUT is still in some
error correcting algorithm. So one can apply discharges at a fast rate,
e.g., 20 pulses a sec to up the number of discharges (with 10 discharges
the ESD test result uncertainty may be dominated by the time dependence
of the susceptability function). Still, one needs to make sure that the
EUT is back to its original software status before the next ESD is
applied.

David Pommerenke




-Original Message-
From: Alex McNeil [mailto:alex.mcn...@ingenicofortronic.com] 
Sent: Tuesday, December 03, 2002 10:16 AM
To: 'emc-p...@majordomo.ieee.org'
Subject: ESD Testing Method


Hi Guys,
1. For double insulated products (non-earthed) is it correct to state
that
the ESD test point, for Contact Discharge (CD) tests, should be
discharged
prior to applying the next discharge (I am sure I read this somewhere,
but)?
2. As a follow on from the first question, I have a product that will
pass
+8KV Contact Discharge (CD) in +2KV steps. It will also pass -8KV CD in
-2KV
steps. However, if I test +XKV (50 zaps) followed by -XKV (1 zap) it
will
fail. What is the correct procedure as the standard does not say if +CD
should follow -CD or vice versa or step up with the same polarity? 

In my opinion it would be unlikely in a particular customer environment
that
the +XKV would be quickly followed by a -XKV (or vice versa).

I look forward, as per usual, to your kind and expert responses.

Kind Regards
Alex McNeil
Principal Engineer
Tel: +44 (0)131 479 8375
Fax:+44 (0)131 479 8321
email: alex.mcn...@ingenicofortronic.com


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RE: ESD Testing Method

2002-12-03 Thread Dan Kinney (A)

Alex,
The new A2 (Feb 2001) of EN61000-4-2:1995 is very clear on this point.
Paragraph 7.1.3  states  the charge on the EUT shall be removed prior to
each applied ESD pulse.  I think this would take care of the problem you are
seeing with the charge reversal that you talk about in question 2.
Dan Kinney
Horner APG


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RE: ESD Testing Method

2002-12-03 Thread Darrell Locke

Most labs I have ever worked with return the EUT to a neutral level prior
to applying opposite polarity discharges, which means use a wire attached to
reference ground to short out any accumulated charge.  However this has
usually been with air discharge to non-conductive surfaces such as an
overlay.  The reasoning is that an opposite polarity discharge is twice the
required level and does not relate to a real world event.

Darrell Locke
Advanced Input Devices

-Original Message-
From: Alex McNeil [mailto:alex.mcn...@ingenicofortronic.com]
Sent: Tuesday, December 03, 2002 8:16 AM
To: 'emc-p...@majordomo.ieee.org'
Subject: ESD Testing Method



Hi Guys,
1. For double insulated products (non-earthed) is it correct to state that
the ESD test point, for Contact Discharge (CD) tests, should be discharged
prior to applying the next discharge (I am sure I read this somewhere,
but)?
2. As a follow on from the first question, I have a product that will pass
+8KV Contact Discharge (CD) in +2KV steps. It will also pass -8KV CD in -2KV
steps. However, if I test +XKV (50 zaps) followed by -XKV (1 zap) it will
fail. What is the correct procedure as the standard does not say if +CD
should follow -CD or vice versa or step up with the same polarity? 

In my opinion it would be unlikely in a particular customer environment that
the +XKV would be quickly followed by a -XKV (or vice versa).

I look forward, as per usual, to your kind and expert responses.

Kind Regards
Alex McNeil
Principal Engineer
Tel: +44 (0)131 479 8375
Fax:+44 (0)131 479 8321
email: alex.mcn...@ingenicofortronic.com


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RE: ESD Testing

2001-09-12 Thread WOODS

We are getting off the track of my original question. Given that the test
procedures are identical (number of hits, location, air discharge, etc.)
will one gun (IEC 801-2 or EN 61000-4-2) yield worse results than the other?

The best information I have at this point is that the speed of approach is
the major contributor to differences between results, even with the same
gun.


--
From:  Michael Hopkins [SMTP:mhopk...@thermokeytek.com]
Sent:  Wednesday, September 12, 2001 7:13 AM
To:  Patrick Lawler; EMC-PSTC
Subject:  Re: ESD Testing


May be some confusion here::

There is NO published version of 61000-4-2 that specifies 50
discharges. It
may be in CISPR, but not in the IEC basic standard..

There are some amendments to IEC 61000-4-2, but these deal with use
of the
HCP, identification of operator accessable points, and testing of
double
insulated products.

Now, there IS an early draft version of a revision of IEC 61000-4-2,
which
at this stage is a working draft within SC77B WG9. (There was a CD
issued,
but there have been many, many significant changes to this document,
and is
far from a version that could be circulated to industry.) This draft
does
talk about 50 discharges per point; however, I emphisize: THIS IS A
WORKING
DRAFT --- it is NOT likely to be published as it now stands.
Additionally,
WG9 met Monday and yesterday (September 10/11) and made many changes
to the
document and I don't anticipate another CD for several months.

Hope this helps. It's always a problem when early drafts of
documents begin
to circulate.

Michael Hopkins
Thermo KeyTek
Member, SC77B WG9
Convenor, SC77B WG11


- Original Message -
From: Patrick Lawler plaw...@west.net
To: EMC-PSTC emc-p...@ieee.org
Sent: Tuesday, September 11, 2001 8:15 PM
Subject: Re: ESD Testing



 I don't have the IEC 61000-4-2 ammendment, but CISPR24:1997
 (Immunity for ITE) does have the phrases
 ... a minimum of 50 discharges at each point,
 and
 ... test points shall receive at least 50 direct contact
 discharges.

 Maybe this is what you were thinking about.
 ---
 Patrick Lawler
 plaw...@west.net


 On Mon, 10 Sep 2001 13:25:49 -0700, Doug McKean
 dmck...@corp.auspex.com wrote:
 Both are 8kV air discharge, both require performance criteria B,
 but I'd say the current version of 61000-4-2  is more severe.
 
 Doesn't the current IEC 61000-4-2:1995 + A1:1998 version
 require a minimum of 50 hits per test point whereas the 1984
 version didn't?  I don't remember the specifics of the 84 version
 and I don't have any reference to it.

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Re: ESD Testing

2001-09-12 Thread Patrick Lawler

I don't have the IEC 61000-4-2 ammendment, but CISPR24:1997
(Immunity for ITE) does have the phrases
... a minimum of 50 discharges at each point,
and
... test points shall receive at least 50 direct contact
discharges.

Maybe this is what you were thinking about.
---
Patrick Lawler
plaw...@west.net


On Mon, 10 Sep 2001 13:25:49 -0700, Doug McKean
dmck...@corp.auspex.com wrote:
Both are 8kV air discharge, both require performance criteria B, 
but I'd say the current version of 61000-4-2  is more severe. 

Doesn't the current IEC 61000-4-2:1995 + A1:1998 version 
require a minimum of 50 hits per test point whereas the 1984 
version didn't?  I don't remember the specifics of the 84 version 
and I don't have any reference to it.

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Re: ESD Testing

2001-09-10 Thread Doug McKean

Both are 8kV air discharge, both require performance criteria B, 
but I'd say the current version of 61000-4-2  is more severe. 

Doesn't the current IEC 61000-4-2:1995 + A1:1998 version 
require a minimum of 50 hits per test point whereas the 1984 
version didn't?  I don't remember the specifics of the 84 version 
and I don't have any reference to it. 

- Doug McKean 



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RE: ESD Testing

2001-08-19 Thread Pommerenke, David

Dear Richard,

Hewlett Packard tests to more than 15 kV.

But please be aware: The severeness of an ESD tests does not always increase
with the test voltage. Depending on the physical  failure mechanism (energy,
current, derivative, fields, E-field, H-field, etc.) it will go down with
voltage for air discharge. 

Testing  15 kV is done for the following reasons:

  - An environment with a LAREG likelyhood of  15 kV: 
  All mobile environments.
  Spacecrafts (special case)
 
  - Low likelyhood of  15 kV ESDs but an EUT which needs to be very
reliable:
  Medical
  Safety related

  - The company wants to ensure that the EUT will pass 8 kV after some years
of usage. Changes are:
  Contamination
  Cracks in plastic joints etc.
  Moisture
  The effect of these parameters on the sparking length are not easy to
predict.

  - The company wants to ensure that it will pass 10 kV at high altidue.
Note that the breakdown distance
is somewhat 1/proportional to air pressure. If you pass 15 kV in San
Diego, you probably pass no more
than 10 kV in Denver.
 
  - Customer requirement.

  - To impress the customer.

  - As a company tradition.

In most cases  15 kV testing is done in air discharge. If you are looking
not only for survival, but for error-free operation, you should use contact
mode testing whereever possible. If you look for error-free operation, it is
also very important to test at a lower voltage in contact mode (e.g., 6kV)
using a fast risetime simualtor (e.g., 100 ps). 

There are a larger set of simulators which can do  15 kV. E.g.,

  KeyTek 2000
  NoiseKen
  some Schaffner (not sure)
  some EM-Test   (not sure)
  
Failure criteria depends on the product. 

David Pommerenke
University Missouri-Rolla, 1870 Minor Circle,  118 EECH
Rolla, MO 65409-0040
ph:  573 341 4531
home: 573 341 5835
fax: 573 341 4532  
email: pommere...@ece.umr.edu



-Original Message-
From: wo...@sensormatic.com [mailto:wo...@sensormatic.com]
Sent: Tuesday, August 14, 2001 8:56 AM
To: emc-p...@majordomo.ieee.org
Subject: ESD Testing



Do any of you perform ESD testing at or above 15 kV to improve product
robustness? I have the following questions.

o   What types of products
o   What type of user environment
o   What is the rational for testing above 15 kV
o   What test equipment is used above 15 kV
o   What test procedure is used above 15kV
o   What is the pass/fail criteria above 15 kV

Thanks, Richard Woods

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Re: ESD Testing

2001-08-16 Thread amund

Richard


o  What types of products
card operated locking systems 

o  What type of user environment
for hotels
 
o  What is the rational for testing above 15 kV
The manufacturer test up to 20kV, wool carpet makes large ESD problems ..

o  What is the pass/fail criteria above 15 kV
Criteria A, no failure .


Best regards
Amund Westin, Oslo/Norway

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RE: ESD Testing

2001-08-16 Thread Chris Chileshe

Richard wrote ...

 Do any of you perform ESD testing at or above 15 kV to improve
 product robustness?

Yes. ISO TR 10605/SAE J1113. 25kV air discharge, 8kV contact

  What type of user environment

Automotive

  What types of products
  What is the rational for testing above 15 kV

Points accessible from *outside* the vehicle e.g. steering wheels.

  What test equipment is used above 15 kV

Schaffner NSG432, EM TEST ESD-30C

  What test procedure is used above 15kV

I've only tested upto 25kV. Same as for 15kV.  Air discharges
to body of product, to plane in vicinity of product and to wiring 
loom.

  What is the pass/fail criteria above 15 kV

We use the same as for 15kV. We aim for ISO Class A (no malfunction) 
for devices accessible during operation. We opt for Class A @ 15kV, 
Class B @ 15kV for devices not normally accessible in operation but 
could become accessible during maintenance.  

Hope this helps.

Best regards

- Chris Chileshe
- Ultronics Ltd
- http://www.ultronics.co.uk


-Original Message-
From:   wo...@sensormatic.com [SMTP:wo...@sensormatic.com]
Sent:   Tuesday, August 14, 2001 2:56 PM
To: emc-p...@majordomo.ieee.org
Subject:ESD Testing


Do any of you perform ESD testing at or above 15 kV to improve product
robustness? I have the following questions.

o   What types of products
o   What type of user environment
o   What is the rational for testing above 15 kV
o   What test equipment is used above 15 kV
o   What test procedure is used above 15kV
o   What is the pass/fail criteria above 15 kV

Thanks, Richard Woods

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Re: ESD Testing

2001-08-15 Thread Douglas C. Smith

Richard,

With today's faster circuits low voltage evernts may be more
likely a problem than high voltage ones. Low voltage air
discharges have much higher di/dt (and therefore
interference potential) than high voltage events. A device
that passes 15kV may easily fail at 1 kV because the di/di
at 1 kV is MUCH higher if it uses logic with sub-nanosecond
risetimes.

Doug

wo...@sensormatic.com wrote:
 
 Do any of you perform ESD testing at or above 15 kV to improve product
 robustness? I have the following questions.
 
 o   What types of products
 o   What type of user environment
 o   What is the rational for testing above 15 kV
 o   What test equipment is used above 15 kV
 o   What test procedure is used above 15kV
 o   What is the pass/fail criteria above 15 kV
 
 Thanks, Richard Woods
 
 ---
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RE: ESD Testing

2001-08-15 Thread Cameron O'phee

Gaming machines in Australia are tested to 25kV air discharge and 10kV
contact discharge.  Gaming regulators are more concerned about intentional
interference rather that accidental.  I use 61000-4-2 as the basis for my
test procedure even though the gaming machine requirements do not specify.
Since all software lockups are required to be manually reset by an
authorised person, we pretty much test for total immunity i.e., Criteria A.
About the only thing that I let through is screen flicker and short duration
drop outs in communications.

In the US some regulators actually use a high frequency generator, used for
testing the integrity of vacuum tubes, in lieu of a proper ESD simulator.
These are uncalibrated devices and can be anywhere from 40 to 60kV.
Therefore, after I have finished my precompliance testing with this device,
it is a matter of crossing my fingers and hope for the best!!

Cameron O'Phee.
EMC  Safety Precompliance.
Aristocrat Technologies Australia.

Telephone   : +61 2  9697 4420
Facsimile   : +61 2  9663 1412
Mobile   :  0418 464 016



-Original Message-
From: wo...@sensormatic.com [mailto:wo...@sensormatic.com]
Sent: 14 August, 2001 23:56
To: emc-p...@majordomo.ieee.org
Subject: ESD Testing



Do any of you perform ESD testing at or above 15 kV to improve product
robustness? I have the following questions.

o   What types of products
o   What type of user environment
o   What is the rational for testing above 15 kV
o   What test equipment is used above 15 kV
o   What test procedure is used above 15kV
o   What is the pass/fail criteria above 15 kV

Thanks, Richard Woods

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Re: ESD Testing

2001-08-14 Thread Doug McKean

This reminds when EMC immunity testing first came out while 
I worked at another company.  No one knew exactly what to 
expect.  So we made our own ESD tester with a TV flyback 
transformer connected to a variac connected to the AC mains 
line.  The thing could kill you. 

We could go above 15K easy.  The product was very robust 
anyway.  So, we'd keep raising the voltage until it finally cooked. 
The only time I saw an EMC problem solved by software was 
to fix a keyboard lockup problem with this tester.   A programmer 
was brought in to write a little subroutine to unlock the keyboard. 

Worked like a charm. 

The level of testing was a result of the environment in which the 
product would finally be used.  Very uncontrolled environment. 

- Doug McKean 



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RE: ESD Testing

2001-08-14 Thread Joshua Wiseman
Richard,

We have gone as high as 20kV. This was done on the control panel with
buttons similar to that of your common vcr remote. It was done as a customer
requirement. We used the same pass/fail criteria as if it were at 8kV.

We use a Schaffner NSG431.

Regards,
Josh



-Original Message-
From: wo...@sensormatic.com [mailto:wo...@sensormatic.com]
Sent: Tuesday, August 14, 2001 6:56 AM
To: emc-p...@majordomo.ieee.org
Subject: ESD Testing



Do any of you perform ESD testing at or above 15 kV to improve product
robustness? I have the following questions.

o   What types of products
o   What type of user environment
o   What is the rational for testing above 15 kV
o   What test equipment is used above 15 kV
o   What test procedure is used above 15kV
o   What is the pass/fail criteria above 15 kV

Thanks, Richard Woods

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Re: ESD Testing

2001-08-14 Thread Patrick Lawler

The following doesn't directly address the issue of product
robustness, but I'll pass it along anyway.
My company makes power supplies for use in medical equipment, and
some of our customers test to IEC60601-2-24 (safety  EMC for
medical infusion pumps).  This standard requires 15kV air
discharges.
Because I only have a few pages from IEC60601-2-24:1998, I don't
know the pass/fail criteria.

On Tue, 14 Aug 2001 09:55:55 -0400, wo...@sensormatic.com wrote:
Do any of you perform ESD testing at or above 15 kV to improve product
robustness? I have the following questions.

o  What types of products
o  What type of user environment
o  What is the rational for testing above 15 kV
o  What test equipment is used above 15 kV
o  What test procedure is used above 15kV
o  What is the pass/fail criteria above 15 kV

---
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Technical Committee emc-pstc discussion list.

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Re: ESD Testing in the Production Lines

1997-06-09 Thread Farnsworth,Heber
 Alessandro Agostini said:
 . . .Sometimes in fact the op. amps. connected to the output appeared
 to be damaged [by production line ESD tests] but only after some days.

I strongly recommend thorough ESD testing of designs and design changes.
I would never purposely apply ESD to a customer product.  ESD is
insidious. Some years ago in another life we suspected ESD damage to
components during product assembly, and went to great lengths to
eliminate the possibility. Later we found a significant decrease in
warranty costs; we were having failures SIX MONTHS into product life
from manufacturing ESD, and didn+t know it!


Re: ESD Testing in the Production Lines

1997-06-06 Thread Alessandro Agostini


I' m sure many people have experienced faults in ESD testing, so that they
are not a good habit in production lines.

I also experienced rare faults in testing some equipment to the EFT/B
(IEC 1000-4-4) at test levels of 500V to signal output lines.
Sometimes in fact the op. amps. connected to the ouput appeared to be damaged
but only after some days.
Did any of you experienced anything similar ?

-
All what above is only my opinion and thus probably wrong! :-)

Alessandro Agostini
Italponti
Firenze (Italy)


Re: ESD Testing in the Production Line

1997-05-15 Thread Eric Petitpierre
 Darrell,
 
 Maybe one of their competitors suggested it to them?
 
 
 Opinions are my own, not those of my employer..

Eric Petitpierre
Pulsecom
Herndon, VA
er...@pulse.com

__ Reply Separator _
Subject: ESD Testing in the Production Line
Author:  dlo...@advanced-input.com at SMTP
List-Post: emc-pstc@listserv.ieee.org
Date:5/14/97 6:43 PM



One of our customers routinely does system ESD testing (to the IEC 1000 test 
level) on their production line.  I have always considered ESD testing to be 
semi-destructive and would rather see type testing followed by strict 
control of the design.  Production line ESD testing seems like it could lead 
to latent failures.  Has anyone else had experience with this?  Is this a 
common practice?  Thanks in advance.

Darrell Locke
Advanced Input Devices


Re: ESD testing on exposed connector(2)

1996-04-25 Thread Mirko Matejic
And if you decide to design product to survive zapped connector 
pins Motorola's dual switching diode MMBD7000LT1, SMT 3-pin 
clamping device can reduce direct hits to the managable levels. 
This useful device has maximum surge impedance of only 0.5 Ohms 
and maximum capacitance of only 1.5 pF.   

Mirko Matejic email: mmatejic@foxboro
The Foxboro Company   tel:   (508) 549-3185
--
From: ron_well...@hp-paloalto-om4.om.hp.com
List-Post: emc-pstc@listserv.ieee.org
Date: Mon, 22 Apr 96 09:09:48 -0700
Subject: Re: ESD testing on exposed connector pins
To: owner-emc-p...@majordomo.ieee.org, SIM::@msim.co.uk
Cc: emc-p...@ieee.org

 Hello Alan,
 
 You assume two things:
 
 1) test houses will zap connectors, and
 
 2) all manufacturers use test houses for EMC Directive compliance
 
 In the United States most manufacturers self declare compliance to the 
 EMC Directive unless they take the TCF route and work with a competent 
 body. Do all manufacturers zap connectors? Your guess is as good as 
 mine. 
 
 Regards,
 Ron Wellman
 
 ++
 |Ronald R. Wellman  |Corporate Quality Department|
 |Hewlett-Packard Company|External Product Regulations|
 |Product Processes Organization |Voice : 415-857-6059|
 |1501 Page Mill Road, MS 5UL|FAX   : 415-857-6340|
 |Palo Alto, California 94304 USA|E-Mail: well...@corp.hp.com |
 ++
 | Common sense is the collection of prejudices acquired by  |
 |  age eighteen. - Albert Einstein  |
 ++

 Reply Separator 
Subject: Re: ESD testing on exposed connector pins
Author:  Non-HP-owner-emc-pstc (owner-emc-p...@majordomo.ieee.org) at 
HP-PaloAlto,shargw3
List-Post: emc-pstc@listserv.ieee.org
Date:4/19/96 10:05 AM


Recently Ron Wellman wrote:

 I believe that everyone contributing to this thread knows that zapping 
 pins of exposed connector pins is almost always a guaranteed failure. 
 Whether you fix it or not is a business decision, 
 

From a European point of view, I would have thought that if the test house
did such a test (zapped the pins) and it failed, then you didn't get your 
Certificate of Conformity (or whatever), which means no CE Mark, which means
no can sell, which is not much of a business decision !!!
 
Or am I being simplistic (or even dense !)?
 
Regards,

 
Alan Hudson
EMC/EW Specialist
Marconi Simulation (Scotland, UK)
email1   hud...@msim.co.uk
email2   100534@compuserve.com
 



Re: ESD testing on exposed connector pins

1996-04-22 Thread RON_WELLMAN
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Date: Fri, 19 Apr 96 17:05 GMT
From: HUDSON@glamis SIM::@msim.co.uk
To: EMC-PSTC emc-p...@ieee.org
Subject: Re: ESD testing on exposed connector pins
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...

 Hello Alan,
 
 You assume two things:
 
 1) test houses will zap connectors, and
 
 2) all manufacturers use test houses for EMC Directive compliance
 
 In the United States most manufacturers self declare compliance to the 
 EMC Directive unless they take the TCF route and work with a competent 
 body. Do all manufacturers zap connectors? Your guess is as good as 
 mine. 
 
 Regards,
 Ron Wellman
 
 ++
 |Ronald R. Wellman  |Corporate Quality Department|
 |Hewlett-Packard Company|External Product Regulations|
 |Product Processes Organization |Voice : 415-857-6059|
 |1501 Page Mill Road, MS 5UL|FAX   : 415-857-6340|
 |Palo Alto, California 94304 USA|E-Mail: well...@corp.hp.com |
 ++
 | Common sense is the collection of prejudices acquired by  |
 |  age eighteen. - Albert Einstein  |
 ++


__ Reply Separator _
Subject: Re: ESD testing on exposed connector pins
Author:  Non-HP-owner-emc-pstc (owner-emc-p...@majordomo.ieee.org) at 
HP-PaloAlto,shargw3
List-Post: emc-pstc@listserv.ieee.org
Date:4/19/96 10:05 AM


Recently Ron Wellman wrote:

 I believe that everyone contributing to this thread knows that zapping  pins 
of exposed connector pins is almost always a guaranteed failure.  Whether you 
fix it or not is a business decision, 

From a European point of view, I would have thought that if the test house did 
such a test (zapped the pins) and it failed, then you didn't get your 
Certificate of Conformity (or whatever), which means no CE Mark, which means no
can sell, which is not much of a business decision !!!
 
Or am I being simplistic (or even dense !)?
 
Regards,
 
 
Alan Hudson
EMC/EW Specialist
Marconi Simulation (Scotland, UK)
email1   hud...@msim.co.uk
email2   100534@compuserve.com



Re: ESD testing on exposed connector pins

1996-04-22 Thread Nick Rouse
Ron Wellman suggests that it is a truth universally
acknowledged that ESD applied to a connector pin
will almost always lead to failure. Without precautions
this may be so but for low frequency  connections
it is possible to protect not only against permanent 
damage but also against loss of data as required by
the EMC tests under the EMC directive. A combination
of filtering and clamping very close to the connector
can provide the required protection. The closeness
to the connector is however vital. The threat from the 
discharge comes not only from its amplitude but from
its very fast rise time (0.7ns). At this speed a path to
ground within the equipment of only a couple of inches 
presents an appreciable impedance and will constitute
a radiating antenna broadcasting to the rest of the 
equipment. Filters built in to the connector with feed 
through capacitors are best but they should not spread the
energy out over such a long period that it is sensed
as a valid signal. If you are fighting to keep the 
bandwith up while providing protection the best scheme
is to use a modest filter in the connector to slow the
edge of the waveform, closely followed by clamping diodes
and then a further filter to reduce the clamp level to
below the signal threshold. This can be expensive 
and bulky if you have a lot of signals but it can be done.
Nick Rouse 
 


Re: ESD testing on exposed connector pins

1996-04-22 Thread James Cunningham
Tony Fredriksson wrote:
Often times, ESD related failures can't be traced to the event because
they can stress semiconductor junctions without causing an immediate
failure.  Then a short time later--days, weeks, even months-the stressed
component fails prematurely for no apparent reason.  So even if a
specific case can't be named, it doesn't mean that I/O pin discharges
in real life don't cause failures.

I can add to this. I have encountered an example whereby testing of an RS
232 connector caused a latent failure in the driver circuit. This failure
was interesting in that the circuit still worked properly (albeit with
reduced output voltage) but the driver was now oscillating at a couple of
hundred MHz causing the apparatus to now fail radiated emissions.

James Cunningham
Radio Frequency Investigation Ltd
Ewhurst Park, Ramsdell
Basingstoke
Hampshire RG26 5RQ
England
Tel: (+44) 01256 851193, j...@rfi.co.uk



Re: ESD testing on exposed connector pins

1996-04-18 Thread rene


On Wed, 17 Apr 1996 ron_well...@hp-paloalto-om4.om.hp.com wrote:

  
  Has anyone ever attributed a real Customer failure of a product to an 
  ESD discharge at an exposed i/o connector? Also, putting a cover over 
  a connector gives us a warm fuzzy feeling that we have protected the 
  product from the Customer and met the requirements of the standard. 
  What is there to prevent a Customer from removing the cover? 
You might put an warning about static electricity on a label attached to 
the cover. Then, when the user removes the cover he is reminded that he 
should discharge himself to the ground frame of the equipment before 
installing cables to the equipment, thus preventing unadvertent 
discharge/damage

Rgds Rene


  
 Isn't this a case where the connector must either be tested directly or 
 protected somehow?
  
 For our products, we recommend that such connectors be tested  shipped with 
 some sort of protection.  I've found that simple plastic dust covers are 
 usually sufficient.   This is assuming, of course, that there is a real risk. 
 We have found, as has been noted by someone else, that typical 9, 15  25 
 female pin D-shell connectors are safe without additional protection as we've 
 never been able to arc directly to a pin during tests (air discharge, of 
 course).
  
 But perhaps we're being unnecessarily conservative.  I'd like to see more 
 opinions from others who've been through this.
  
 Jack Cook,
 EMC Competency Center
 Xerox Corporation
 jcook.el_segu...@xerox.com
 


Re: ESD testing on exposed connector pins

1996-04-16 Thread jcook . el_segundo

re:  ESD testing directly on the pins of a bare connector.

It seems reasonable to exclude testing into a bare connector which will
normally be populated with a cable.  In that case, testing should be conducted
with the cable in place.

I think where confusion exists is where there are optional connectors, one or
more of which may not be populated in a customer's installation.  As an
example, many of our laser printers normally have both standard serial (RS-32)
 parallel I/O connectors.  The customer will choose one and leave the other
vacant.  That unused connector is now vulnerable to ESD.

Isn't this a case where the connector must either be tested directly or
protected somehow?

For our products, we recommend that such connectors be tested  shipped with
some sort of protection.  I've found that simple plastic dust covers are
usually sufficient.   This is assuming, of course, that there is a real risk.
We have found, as has been noted by someone else, that typical 9, 15  25
female pin D-shell connectors are safe without additional protection as we've
never been able to arc directly to a pin during tests (air discharge, of
course).

But perhaps we're being unnecessarily conservative.  I'd like to see more
opinions from others who've been through this.

Jack Cook,
EMC Competency Center
Xerox Corporation
jcook.el_segu...@xerox.com


Re: ESD testing on exposed c

1996-04-16 Thread Tony Fredriksson

Hi,

I have never worked with a lab that has discharged to exposed pins
of a connector.  I think the basic rationale is that when one approaches
a connector with a charged finger, the discharge is most likely to arc
to the surface with the most inherent capacitance, which would be the
D-shell or grounding ring of the connector, the part connected to the
return reference or chassis refernece of the circuit.  Discharging to
pins under normal circumstances is much less likely.

Without knowing more of the detail of this product's construction, it is
difficult to determine if the lab is being overly enthusiastic or if it has
determined that this particular construction is so far out of the norm that
it is highly likely that, under normal use, the pins are the likely 
discharge
point from a charged person or object.

Regards,
tony_fredriks...@netpower.com

 --
From: Steve Chin
To: emc-pstc
Subject: Re: ESD testing on exposed c
List-Post: emc-pstc@listserv.ieee.org
Date: Tuesday, April 16, 1996 9:44AM

Moshe asked about ESD testing directly on the pins of a bare connector.

The lab I test with has told me that they do not discharge directly to =
the exposed pins of a connector to which no cable is connected. They =
quoted many reasons, including the ECMA spec Moshe quoted, as well as the =
fact that we usually do the radiated emissions tests with a fully =
populated system and the ESD and other immunity tests with a pretty bare =
system (which creates the assumption that the end-users will configure =
their systems similarly to the radiated emmissions test system, therefore =
making the possibility of an end-user discharge to the pins extremely =
remote).

They said that your argument against discharging directly to the pins =
could include the fact that your expected user configuration would =
include cables populating those connectors (assuming the vacant =
connectors are for peripheral support equipment, not vital connections =
for operations).

Ah, I ramble on (and I'm probably not intelligible).

Steve Chin
FWB, Inc.
Menlo Park, CA, USA
steve_c...@fwb.com



Re: ESD testing on exposed connectors

1996-04-16 Thread Nick Rouse
The rationale offered by Tom Cokenias is fine for 
equipment that is always configured with cables on
all connectors. The pins would then would not
come within the criteria that I suggested of 
the user being reasonably expected to touch
them. However many items of equipment are 
designed with connectors for optional attachments.
A PC manufacturer does not expect that every 
computer sold will used only with a device on 
every serial and parallel port. The test is intended 
to simulate a real risk. Where to apply the test
should surely be governed by where this risk is
real.
Nick Rouse 


Re: ESD testing on exposed connectors

1996-04-16 Thread Thomas N. Cokenias
Moshe,

The competent bodies I have dealt with (3) have required ESD testing to
metal shells of D connectors and have specifically excluded requirements to
test the pins.  The rationale has been that the mfr put the connector for a
cable to connect to it, meaning the pins will be somewhat protected.  The
mfr should not be penalized because the user does not choose to configure
the system in the way it was designed.

Connecting cables to all ports and then testing ports at the cable juntion
seems to me to satisfy both the spirit and the letter of the requirement.
The(exposed) pins would then not be accessible to the user, and the
vulnerability of the EUT can be still tested at locations where cable type
may not afford much protection, eg, where flat ribbon or unshielded cables
are employed.

Tom Cokenias.




Re: ESD testing on exposed connectors

1996-04-16 Thread Nick Rouse
I don't know of any official standard that gives a 
specific ruling on connector pins. The generic 
immunity standards refer without comment to the
basic standards and the basic standards refer to
points accessible to personnel during normal use
including customer's maintenance. The overview
of immunity tests, standard IEC1000-4-1 reiterates
this saying that the ESD shall be applied to all
normally accessible points on the EUT 
The opinion of the Competant body that we use is 
that if the user can reasonably reach a connector
and may do so at some time during  any operation 
that you might reasonably expect him or her to do,
the pins of the connector should be tested if there
is a fair chance that a finger or metal object 
approaching the connector would discharge to 
the contacts rather than the shell.  Thus large 
flat connectors with non-recessed contacts or
plastic shelled connectors should have the pins
tested but narrow metal shelled connectors with
the shell earthed and contacts recessed need 
only be tested to the shell. A few tests have 
shown that female BNC's discharge to the shell 
but male BNC's can discharge to the pin. Standard 
width D types with female contacts discharge to the
shell and those with male contacts nearly always
do. Wide shell 3 row D types can discharge to the
pins with both sexes.
Do not forget the indirect ESD test. I have found that
for plastic cased equipment with unscreened wires
running away from the connector internally an ESD
test to a coupling plane 100mm from a connector
face can have more effect than a direct discharge 
to the pin.
Nick Rouse