In a message dated 9/9/00 6:17:49 PM EST, [email protected] writes: << Subj: Re: CS>Re: Generating "Sputtered" HVAC CS Date: 9/9/00 6:17:49 PM EST From: [email protected] (Robert L. Berger) Reply-to: [email protected] To: [email protected] Roger; I was an engineering department chief for the manufacture of electron tubes at the Western Ecletric plant in Lee's Summit , Missouri. We also made semiconductors and sputtering is part of the operation. All of our sputters operated in vacuum. I just rechecked with one of my former senior engineers about sputtering, and he reaffirmed that it was done in vacuum. I have no voltage control only spacing of the arcing electrode, and whether I close that gap to almost nothing or open it to where it wont fire there is no change in the arc characteristics. When you send the sample please include a simple sketch of what you are doing do that I can set it up. I am curious. "Ole Bob" >>
"Ole Bob": I'll do better than that. I'll video tape the various arc formations and describe what I think is happening at the same time. One of the reasons I believe, under certain, but repeatable conditions, that I am achieving a very rapid mass transfer which I term "sputtering" is that I conducted preliminary experiments in which I collected product samples for various arc formations and known time increments. For the arc formation which I identify as "sputtering" the mass transfer was found to be an order of magnitude to 50X higher than other arc formations including the immersed electrode method. In order to achieve this formation one has to be very careful to balance a number of operating parameters such as power supply output capability, resistance of the aqueous phase, electrode spacing above the water, wire diameter and electrode design. Thanks to the type of power supply I have with its manually variable current and automatically adjustable voltage to match circuit resistance and given current set point, achieving this optimum mass transfer, which I identify as "sputtering", is rather easy to do AND is very repeatable. If my power supply had a greater range of voltage/amperage set and control points I would be able to achieve sputtering virtually 100% of the time. My guess is that I'm now around 50%. Roger -- The silver-list is a moderated forum for discussion of colloidal silver. To join or quit silver-list or silver-digest send an e-mail message to: [email protected] -or- [email protected] with the word subscribe or unsubscribe in the SUBJECT line. To post, address your message to: [email protected] Silver-list archive: http://escribe.com/health/thesilverlist/index.html List maintainer: Mike Devour <[email protected]>
