It also has impact on placement issues for fine pitch components like BGAs. Due to different surface tension / density of the Pb-free solder the components are no longer self-aligning. So placement has to be more accurate. I'm told that proces parameters are different for the different solder alloys types like SnCu / SnAgCu. Every manufacturer has to determine the process parameters by trail and error by lack of experience. Once under control Pb free joints should be more reliable than the lead containing alloy. Than there is a logistic problem. Some components are available Pb-free and with leaded leads during the component manufacturers transition to Pb free. How to identify and separate these components here in the house? We need temporarily up to 25% more shelf space. Well it's 9 o'clock in the morning over here and it seems like Pb-free causes me a real headache (again). Time for a cup of leaded coffee :)
Best regards, ------------------------ Ben Uijtenhaak Gatsometer BV Haarlem, the Netherlands phone +31 23 525 50 50 ------------------------ > -----Original Message----- > From: [EMAIL PROTECTED] > [mailto:[EMAIL PROTECTED] Behalf Of Dennis Saputelli > Sent: dinsdag 7 december 2004 2:00 > To: Protel EDA Discussion List > Subject: Re: [PEDA] Lead free re design > > > > this message (re pad sizes) > was the sort direction i was hoping when i started this thread > > so we are saying that maybe yes there is an impact on design ? > > very interesting ... > > ds > > ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[EMAIL PROTECTED] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
