Yes, but the power connections are made through the Vias are they not? There are over 100 ground and 3.3V/2.5V balls that connect to internal planes through Vias. At least for this particular BGA. Therefore, wouldn't the thermal effects still be relevant in this case?
At 06:10 PM 4/02/2002 -0500, you wrote: >At 08:34 AM 2/5/2002 +1100, Colin Weber wrote: > >>I was talking with another designer, Phil Dutton, and he aslo recommended >>the Power Connections Relieved. >>"Make sure that your Power connections are relieved, or they will cool >>down faster than the rest of the device, inducing stresses." > >That is "Power Connections." We've been talking about vias. Different animal. > >[EMAIL PROTECTED] >Abdulrahman Lomax >Easthampton, Massachusetts USA Regards, Colin Weber * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
