Yes, but the power connections are made through the Vias are they not?
There are over 100 ground and 3.3V/2.5V balls that connect to internal
planes through Vias. At least for this particular BGA. Therefore, wouldn't
the thermal effects still be relevant in this case?


At 06:10 PM 4/02/2002 -0500, you wrote:
>At 08:34 AM 2/5/2002 +1100, Colin Weber wrote:
>
>>I was talking with another designer, Phil Dutton, and he aslo recommended 
>>the Power Connections Relieved.
>>"Make sure that your Power connections are relieved, or they will cool 
>>down faster than the rest of the device, inducing stresses."
>
>That is "Power Connections." We've been talking about vias. Different animal.
>
>[EMAIL PROTECTED]
>Abdulrahman Lomax
>Easthampton, Massachusetts USA


Regards,

Colin Weber

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