You're absolutely right, I started thinking about drilled holes and answered incorrectly. This info isn't easy to obtain with 99SE, but it's not bad with DXP. I loaded the same board into DXP and using a report generator, I told it to list: Designator, Footprint and Quantity. I then indicated to group by footprint, and it made a fairly short list. This was easy to view and ascertain the requested SMT vs. THROUGH HOLD count.
Footprint Quantity "0805" "188" "1210" "3" "CAPSMDB" "5" "CAPSMDC" "4" "CAPSMDF" "1" "QFP44" "1" "SO-8" "18" "SOT-23" "2" "SOT-23AK1" "4" "DO-41" "1" "IDC10" "1" "INDUCTOR0.4" "3" "JACK_VERT1A" "6" "LED_T-1" "3" "PANA1" "8" "POWER4_156" "1" "SIP9" "2" "TESTPOINT" "1" "TO-220" "1" "VR9" "8" "XTAL1" "1" I think from this list it's pretty easy to tell ( I did a manual sort in this email just to group the SMT footprints together so I could count them) there are 226 SMT parts and 36 through hole parts. Again, this was with DXP. I don't know how to generate something like this with 99SE. -----Original Message----- From: Dennis Saputelli [mailto:[EMAIL PROTECTED] Sent: Thursday, November 20, 2003 8:29 AM To: Protel EDA Forum Subject: Re: [PEDA] Utility to count SMD/Through-hole components this doesn't show component count of each type which is what started this thread and which is a cost driver for assembly rather than bare bd fab Dennis Saputelli Tony Karavidas wrote: > > I agree with you. It's just to get them close either with stuffing the > board, or making the PCB. > > Who cares if a surface mount part has a couple through hole alignment holes? > They are holes nevertheless and require drilling, so they need to be > counted as through holes. > > Here's a sample from one of my recent boards. I consider this to have > 6+(750-608)+190=338 "through holes" and 608 SMT pads. 6 of the through > 6+hole > pads are not plated. What's the big deal? > > Layer Pair Vias > ---------------------------------------- > Top Layer - Bottom Layer 190 > ---------------------------------------- > Total 190 > > Non-Plated Hole Size Pads Vias > ---------------------------------------- > 125mil (3.175mm) 6 0 > ---------------------------------------- > Total 6 0 > > Plated Hole Size Pads Vias > ---------------------------------------- > 0mil (0mm) 608 0 > 28mil (0.7112mm) 25 190 > 32mil (0.8128mm) 6 0 > 35mil (0.889mm) 24 0 > 40mil (1.016mm) 30 0 > 43mil (1.0922mm) 19 0 > 60mil (1.524mm) 4 0 > 80mil (2.032mm) 18 0 > 90mil (2.286mm) 16 0 > ---------------------------------------- > Total 750 190 > > -----Original Message----- > From: Steve Wiseman [mailto:[EMAIL PROTECTED] > Sent: Wednesday, November 19, 2003 3:08 PM > To: Protel EDA Forum > Subject: Re: [PEDA] Utility to count SMD/Through-hole components > > 19/11/2003 21:45:18, Abd ul-Rahman Lomax <[EMAIL PROTECTED]> wrote: > > >However, another, perhaps more practical and safer alternative > would be to > >generate three lists: SMT, through-hole, and possibly mixed. > The large > >majority of components would orginarily not be ambiguous. > > Since this is all to generate a highly suspect quote from a board- > stuffing shop, such care is almost certainly wasted. I can't believe > that a quote based on a QFP being costed the same as an 0805 is anything but budgetary... > > Sounds to me like sorting the BOM based on footprint will get the > answer as accurately as is needed for this... > > Steve -- Dennis Saputelli ========= send only plain text please! - no HTML ========== _______________________________________________________________________ Integrated Controls, Inc. www.integratedcontrolsinc.com 2851 21st Street tel: 415-647-0480 San Francisco, CA 94110 fax: 415-647-3003 * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[EMAIL PROTECTED] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
