At 06:43 AM 1/25/2002 -0600, Bryn Wolfe wrote:
Actually, though, Hot Air Leveling should not cause the burst unless there is
soldermask on both the top and bottom, or if it is a blind via. However, I
can't
think of a way in Protel to tell it to tent only the component side. You'd
probably
have
On 06:43 AM 25/01/2002 -0600, Bryn Wolfe said:
Actually, though, Hot Air Leveling should not cause the burst unless there is
soldermask on both the top and bottom, or if it is a blind via. However, I
can't
think of a way in Protel to tell it to tent only the component side. You'd
probably
have
Hello all,
I was wondering how I could have solder mask placed over all the via's on
my PCB. Is there a design rule for the via's that allow you to select
solder mask options? I saw a design rule for via size but not solder mask.
All of my via's should be a different size than any pads
On 01:29 PM 24/01/2002 -0800, Afshin Salehi said:
Hello all,
I was wondering how I could have solder mask placed over all the
via's on
my PCB. Is there a design rule for the via's that allow you to select
solder mask options? I saw a design rule for via size but not solder mask.
All
Afshin
just one more informotion: my Fab-house told me I should not tent vias complete.
It couse problems because the soldermask will burst open during HotAirLeveling
or wavesoldering because of the Air inside the via. They told me to leave the
hole open and only put the cover the Copper. I did
Engineer
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- Original Message -
From: Waldemar Kulajew [EMAIL PROTECTED]
To: Protel EDA Forum [EMAIL PROTECTED]
Sent: Friday, January 25, 2002 7:41 AM
Subject: Re: [PEDA] Solder mask over via's
Afshin
just one more
