On 06:43 AM 25/01/2002 -0600, Bryn Wolfe said:
>Actually, though, Hot Air Leveling should not cause the burst unless there is
>soldermask on both the top and bottom, or if it is a blind via. However, I 
>can't
>think of a way in Protel to tell it to tent only the component side. You'd 
>probably
>have to do some editing in the gerber file.
>
>This sounds like a feature that should be added to Protel, that is, 
>selecting which
>side of the board tenting of through-hole vias occurs on: top, bottom, or 
>both.

A feature I have been asking for for quite a while - it is useful for 
testpoint access mainly during prototypes though - during production you 
can easily open up the mask on one side of selected vias by plonking down a 
surface test point pad the same size or larger than the va.

Ian Wilson

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