On 06:43 AM 25/01/2002 -0600, Bryn Wolfe said: >Actually, though, Hot Air Leveling should not cause the burst unless there is >soldermask on both the top and bottom, or if it is a blind via. However, I >can't >think of a way in Protel to tell it to tent only the component side. You'd >probably >have to do some editing in the gerber file. > >This sounds like a feature that should be added to Protel, that is, >selecting which >side of the board tenting of through-hole vias occurs on: top, bottom, or >both.
A feature I have been asking for for quite a while - it is useful for testpoint access mainly during prototypes though - during production you can easily open up the mask on one side of selected vias by plonking down a surface test point pad the same size or larger than the va. Ian Wilson * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
