Hello, For the BGA packages soldering, we are requested to cover the vias UNDER the BGA with solder mask; the PCB manufacturer do this with a silk screen generated from our Gerber data, only for the concerned vias. For our purposes, this solution is working fine.
Regards, Rudolf Schaffer R&D Engineer Phone +41 32 754 38 33 Fax +41 32 754 38 36 Web www.livetools.tv ----- Original Message ----- From: "Waldemar Kulajew" <[EMAIL PROTECTED]> To: "Protel EDA Forum" <[EMAIL PROTECTED]> Sent: Friday, January 25, 2002 7:41 AM Subject: Re: [PEDA] Solder mask over via's > Afshin > > just one more informotion: my Fab-house told me I should not tent vias complete. > It couse problems because the soldermask will burst open during HotAirLeveling > or wavesoldering because of the Air inside the via. They told me to leave the > hole open and only put the cover the Copper. I did it in the way Ted Tontis > suggested. > > Regards, > > Waldemar > > Ted Tontis schrieb: > > > > Afshin, > > To use the design rule go in the design rules, select manufacturing, select > > solder mask expansion, click add, select object kind, check via's, give the > > expansion a negative value, and click ok. > > > > Regards, > > > > Ted > > > > -----Original Message----- > > < -- snipp --> > > Some of my via's are placed so close to pads > > after a route that I am afraid of bridging occurring when the PCB is > > soldered. > > < -- snipp --> * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
