Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-10-01 Thread Juha Pajunen

Here is link for device package itself...

http://www.altera.com/support/devices/packaging/specifications/pkg-pin/pdf/1
020-FBGA_Therm.pdf

here is link for the pin-out files...

http://www.altera.com/literature/lit-dp.html#stratix

here is link for the chip...

http://www.altera.com/literature/ds/ds_stx.pdf'

-Juha Pajunen

-Original Message-
From: JaMi Smith [mailto:[EMAIL PROTECTED]]
Sent: 1. lokakuuta 2002 5:19
To: Protel EDA Forum
Subject: Re: [PEDA] 1020-pin BGA out-routing question (some add)


Is there an actual datasheet for the specific device you are using?

Can you provide a Mfg and PN, and possibly a link?

It would help alot in seeing what you need.

Thanks, JaMi

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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-10-01 Thread Juha Pajunen

Hi,

There is a new version of 1020-pin BGA routing test for checking at :)
http://groups.yahoo.com/group/protel-users/files/junk/

please tell me that this is OK? ;)
or tell me how to manage this damn chip :)

Used layers are TOP, MID1, MID2 and BOT
(BOT layer is not routed yet...)

so I think it can be done with 4 signal layers
(maybe not all signal pads but many of them),
there will be 4 layers for power planes
2*GND and 2*POWER (planned 8 layer board)

-Juha Pajunen

-Original Message-
From: Juha Pajunen [mailto:[EMAIL PROTECTED]]
Sent: 1. lokakuuta 2002 9:43
To: Protel EDA Forum
Subject: Re: [PEDA] 1020-pin BGA out-routing question (some add)


Here is link for device package itself...

http://www.altera.com/support/devices/packaging/specifications/pkg-pin/pdf/1
020-FBGA_Therm.pdf

here is link for the pin-out files...

http://www.altera.com/literature/lit-dp.html#stratix

here is link for the chip...

http://www.altera.com/literature/ds/ds_stx.pdf'

-Juha Pajunen

-Original Message-
From: JaMi Smith [mailto:[EMAIL PROTECTED]]
Sent: 1. lokakuuta 2002 5:19
To: Protel EDA Forum
Subject: Re: [PEDA] 1020-pin BGA out-routing question (some add)


Is there an actual datasheet for the specific device you are using?

Can you provide a Mfg and PN, and possibly a link?

It would help alot in seeing what you need.

Thanks, JaMi

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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-30 Thread Juha Pajunen

Hi,

I changed the footprint, 40mil pitch with 20mil pads.
VIAs between SMD pad are 16mil pad and 8mil hole, we
want use this because there will be more room for
routing and SOLDERMASK is bigger between SMD pad
and VIA (I have 4mil opening for SMD pads and VIAs
are tentd or 0mil opening; which one is better).
Traces are 4mil and gap is also 4mil,
need to route two trace between SMD pads,
do not want make over 10 layer board...

Should I use two powerplanes for FPGA core voltage,
I/O voltage for FPGA (there is 8 bank, so we might need
8 different I/O voltages), VREF voltage for each
bank (8 bank), 3.3V for memory and other chips...
how to manage all those different voltages...???

How about making splitplanes on GNDplane for
different GNDs? (memory, I/O, of cource there will be
own GND splitplane for FPGA chip...???)

JaMi wrote...
This will keep your vias as far as
possible from the actual BGA pad, and you want as much here as you can get.
This wili also allow you to use a bigger via (see below).

Our VIAs are 16mil pad and 8mil hole, isn't this ok?

The board size could be x=8000mil y=4900mil (do not know yet...)

I am still intrestd in what kind of board stack up you GURUs recommend!

-Jupa

-Original Message-
From: JaMi Smith [mailto:[EMAIL PROTECTED]]
Sent: 27. syyskuuta 2002 22:03
To: Protel EDA Forum
Cc: JaMi Smith
Subject: Re: [PEDA] 1020-pin BGA out-routing question (some add)


Juha,

Just looked at your database.

First, your vias are misplaced, and need to be exactly in the center of the
opening between the pads, which appear to be on a 1mm grid, which means that
you vias should be on a .5mm grid. This will keep your vias as far as
possible from the actual BGA pad, and you want as much here as you can get.
This wili also allow you to use a bigger via (see below).

Secondly, you will possibly want a larger pad to drill ratio on your vias if
at all possible, to prevent massive breakouts, which while acceptable by
some standards. may be excessive with that current ratio.

One of routing numbers being batted around by some board houses is
somthing they call the five fours, which is three 4 mil gaps with two 4
mil traces, all between a 20 mil pad with 10 mil holes for 40 mil spacing on
a BGA. If your spacing on the BGA is actually 1mm, which is .03937 . . . ,
instead of 40 mil, then you have to slightly adjust the size of the pad, and
everything else will fit. Even here you are gonig to possibly see breakout,
which once again is allowable, providing that you are using teardrops for
all of your pad entries.

How big is your board anyway, overall size wise. The above numbers are based
on standard alignment of all features within 5 mil, and unless your board
is fairly large. everything seems to be very do-able with out too many
layers, or the need to go to micro vias, or ever to blind or burried vias.

JaMi

- Original Message -
From: Juha Pajunen [EMAIL PROTECTED]
To: Protel EDA Forum [EMAIL PROTECTED]
Sent: Friday, September 27, 2002 1:09 AM
Subject: [PEDA] 1020-pin BGA out-routing question (some add)


 Hi again,

  What is the best PCB layer stack for
 this type of BGA? 

 http://groups.yahoo.com/group/protel-users/files/junk/

 There is 1020-pin 1mm pitch BGA. It would be very
 pleasing to have some information and help how to
 route that huge BGA. What are trace width and cap
 between different tracks and so...

 It would be very nice if you couldedit that file
 (how to route it) and then send it to me to this
 addrss [EMAIL PROTECTED]

 I really need all useful information
 about routing this BGA! :)


 Sincerely,
 Juha Pajunen, Hw Engineer
 Bitboys Oy
 E-mail: [EMAIL PROTECTED]
 
 NOTE:  This message, and any attached files, may contain privileged or
 confidential information. It is intended for use only by the designated
 recipients. Any disclosure, copying or distribution of, or reliance upon,
 this message by anyone else is strictly prohibited.

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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-30 Thread JaMi Smith

Juha,

First, sorry about the delay in responding, but the different time zones
make it hard to keep up. Secondly, I an certainly no guru on the subject,
but can only offer you a few things to think about as you approach this
board, and hopefully if someone out there knows better than I, they will
step in and offer better advice.

I have read both of your responses, and will try to combine all of my
responses here.

Ok, to start, why don't you see below,''

JaMi


- Original Message -
From: Juha Pajunen [EMAIL PROTECTED]
To: Protel EDA Forum [EMAIL PROTECTED]
Sent: Monday, September 30, 2002 2:52 AM
Subject: Re: [PEDA] 1020-pin BGA out-routing question (some add)


 Hi,

 I changed the footprint, 40mil pitch with 20mil pads.
 VIAs between SMD pad are 16mil pad and 8mil hole, we
 want use this because there will be more room for
 routing and SOLDERMASK is bigger between SMD pad
 and VIA (I have 4mil opening for SMD pads and VIAs
 are tentd or 0mil opening; which one is better).
 Traces are 4mil and gap is also 4mil,
 need to route two trace between SMD pads,
 do not want make over 10 layer board...


Do not change your spacing to .040 unless that is the actual spacing of
your device. I only offered that because it was used in a presentation that
I attended on the subject, but if I actually understand correctly, your BGA
is 1.00mm spacing (actually .03937 and not .04000), and the cumulative
error would definitely cause a problem on a pattern this large. Stick with
what the databook calls for on the pitch, and adjust everything else to
match that.

If you are using an 8 mil hole in a 16 mil pad, that requires a 8 mil
overall feature registration (.004 true position), which is pretty tight
for an 8 by 5 inch board, and that would allow zero for annular ring, which
is acceptable (for certain manufacturing specs), but forces you to use
teardrops on all of your vias. I would think that you would be much better
off tightening up your solder mask, and it's registration, and using the
extra slop (as it were) in the rest of the design. Even if you stuck with
the 8 mil hole, and kicked your pad up to 18 mils, but kept the same feature
registration, you could at least avoid breakouts. Anyway, something to think
about. Remember that Protel does allow you to remove unused internal pads
when you generate gerbers, but I would not want to depend on this for any
clearances (I would prefer to make a special via for the specific occasion
and location in which I juggled the pad stack (s it were), if I had a
tight spot or two and needed a little extra space. I will try and locate
the number of the IPC Spec that discusses breakout in this specific
situation.

Also remember that when you consider overall feature registration and
breakout, you also have to consider the effect on plane clearance, and
remember that hole size is usually based on final hole size, after
plating, while the plane clearance itself has to take into account the max
drill size (including any etchback (if present)).

This brings up the related subject of thermals. The via farm under a BGA
usually has the effect of making swiss cheese out of any planes that run
under the BGA, and you have to be very careful about how you use thermals
here, because you can literally destroy any plane that is left after the
normal clearance for the tightly packed vias if you are not careful. Some
people demand the use of thermals under a BGA, regardless of the number of
perforations in the plane due to vias, in which case, I would say that you
need to be very very careful with the specific dimensions if the thermal
(make one specifically for use under the BGA if necessary) and make sure
that your final gerbers look OK before you ship them out and make the board.
My own opinion in this case, is to NOT use a thermal at all on the via, but
rather the connections to the plane direct, and then make sure that the
trace that goes between the via and the actual BGA pad, is small enough (say
8 mils) that it acts as a thermal relief itself (in just the same manner
as if you have a surface mount pad on an outer layer that you had to isolate
from a plane (just as the Polygon Plane fill does)). This is usually
enough thermal isolation from the plane itself, to not affect the
soldering of the BGA, but you had better check with your assembly house (it
might require some special profiling) and get their approval on this one,
before you go this route, since I am sure that many people out there would
disagree with me on this point. With the trace between the via and pad at
about 8 mil, it will provide thermal isolation that is required for the
soldering operation, but at the same time it is short enough so that it does
not become too much of an inductor for those power and ground connections.
You might want some other opinions on this one.

Two traces per routing channel is very do-able, and respecting the actual
number of layers you will need, I can't help you there, as it will take

Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-30 Thread JaMi Smith

Is there an actual datasheet for the specific device you are using?

Can you provide a Mfg and PN, and possibly a link?

It would help alot in seeing what you need.

Thanks, JaMi

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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-30 Thread JaMi Smith

Juha,

OK, I looked at the layout, and the part number device, EP1S30, and did a
search on the net, and came up with ALTERA STRATIX.

Yes, the LVDS is in fact controlled impedance, 100 ohm differential, or you
could probably route individual lines at 50 ohm. It does appear that some of
the Stratix devices have the required 100 ohm termination built in, but I am
not sure about yours, and this may be good providing that you are using the
Stradix device as the differential receiver, however if you are using it as
the LVDS driver / transmitter, then you will probably have to provide your
own termination at the other end of the line.

The first thing that you might want to do is look at the following ALTERA
links:

Ap Note for High Speed Board Design:

http://www.altera.com/literature/an/an075.pdf

Using High Speed Differential I/O Interfaces in Stratix Devices:

http://www.altera.com/literature/an/an202.pdf

These should give you some idea of just what you need to do in terms of
routing, at least in the LVDS area.

I looked around for some real life pinout diagrams, and only found some
fairly poor tables, which would take me forever to map out.

The mapping in your sample layout doesn't look quite right (although
possibly it is and I am just not looking at it correctly), but I don't have
the time to go over it. Can you point me to some ALTERA maps or pin out
pictorals if there are any?

JaMi

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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-27 Thread Emanuel Zimmermann

Hei Juha,

I currently don't have the time to work out a detailed routing strategy, but if 
I hear of such a biest I would consider blind/buried vias. If you choose to go 
to microvias you even can place them within the BGA pads! Depending the overall 
complexity I would recommend a 2+N+2 stack in microvia technology (if assembled 
double sided and dense). This means vias from Top to Mid1, Mid1 to Mid2, Bottom 
to Bottom-1, Bottom-1 to Bottom-2 and thru the whole stack (these are 
conventionally drilled). Depending your actual project you may be able to 
simplify this.

Hope this helps

Emanuel

Juha Pajunen wrote:

 Hi again,
 
  What is the best PCB layer stack for
 this type of BGA? 
 
 http://groups.yahoo.com/group/protel-users/files/junk/
 
 There is 1020-pin 1mm pitch BGA. It would be very
 pleasing to have some information and help how to
 route that huge BGA. What are trace width and cap
 between different tracks and so...
 
 It would be very nice if you couldedit that file
 (how to route it) and then send it to me to this
 addrss [EMAIL PROTECTED]
 
 I really need all useful information
 about routing this BGA! :)
 
 
 Sincerely,
 Juha Pajunen, Hw Engineer
 Bitboys Oy
 E-mail: [EMAIL PROTECTED]
 
 NOTE:  This message, and any attached files, may contain privileged or
 confidential information. It is intended for use only by the designated
 recipients. Any disclosure, copying or distribution of, or reliance upon,
 this message by anyone else is strictly prohibited.
 
 
 


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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-27 Thread Bevan Weiss

How would you even solder a 1020pin BGA (I assume that's 32x32 with the four
central balls missing?)
I say that you'd need to use blind vias, with a lot of layers (I've never
worked on BGA's but would imagine that you might get 4rows/columns per
layer).  My estimate would require around 8layers.  That's if you've got
signals on every layer.  Others would have a much better idea though...


- Original Message -
From: Juha Pajunen [EMAIL PROTECTED]
To: Protel EDA Forum [EMAIL PROTECTED]
Sent: Friday, September 27, 2002 8:09 PM
Subject: [PEDA] 1020-pin BGA out-routing question (some add)


 Hi again,

  What is the best PCB layer stack for
 this type of BGA? 

 http://groups.yahoo.com/group/protel-users/files/junk/

 There is 1020-pin 1mm pitch BGA. It would be very
 pleasing to have some information and help how to
 route that huge BGA. What are trace width and cap
 between different tracks and so...

 It would be very nice if you couldedit that file
 (how to route it) and then send it to me to this
 addrss [EMAIL PROTECTED]

 I really need all useful information
 about routing this BGA! :)


 Sincerely,
 Juha Pajunen, Hw Engineer
 Bitboys Oy
 E-mail: [EMAIL PROTECTED]
 
 NOTE:  This message, and any attached files, may contain privileged or
 confidential information. It is intended for use only by the designated
 recipients. Any disclosure, copying or distribution of, or reliance upon,
 this message by anyone else is strictly prohibited.


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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-27 Thread JaMi Smith

Juha,

It seems that everyone is missing the primary questions.

What is the speed of the device?

What type of routing are you doing, TTL / CMOS, ECL, LVDS, etc., etc., etc.?

How many of the actual I/O's are you actually using?

Where are all of your I?O's going to or comming from (do most of them have
to go the same direction on the board, or are they generally going to be
able to go in four different directions, etc., etc., etc.?

While implied in some of the above questions, specifically, do you need
controlled impedance?

How many supplies are involved, and how much decoupling does the specific
device require?

Are there more than one ground planes involved?

No reason to panic. Yet.

JaMi Smith


- Original Message -
From: Juha Pajunen [EMAIL PROTECTED]
To: Protel EDA Forum [EMAIL PROTECTED]
Sent: Friday, September 27, 2002 1:09 AM
Subject: [PEDA] 1020-pin BGA out-routing question (some add)


 Hi again,

  What is the best PCB layer stack for
 this type of BGA? 

 http://groups.yahoo.com/group/protel-users/files/junk/

 There is 1020-pin 1mm pitch BGA. It would be very
 pleasing to have some information and help how to
 route that huge BGA. What are trace width and cap
 between different tracks and so...

 It would be very nice if you couldedit that file
 (how to route it) and then send it to me to this
 addrss [EMAIL PROTECTED]

 I really need all useful information
 about routing this BGA! :)


 Sincerely,
 Juha Pajunen, Hw Engineer
 Bitboys Oy
 E-mail: [EMAIL PROTECTED]
 
 NOTE:  This message, and any attached files, may contain privileged or
 confidential information. It is intended for use only by the designated
 recipients. Any disclosure, copying or distribution of, or reliance upon,
 this message by anyone else is strictly prohibited.

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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-27 Thread JaMi Smith

Juha,

Just looked at your database.

First, your vias are misplaced, and need to be exactly in the center of the
opening between the pads, which appear to be on a 1mm grid, which means that
you vias should be on a .5mm grid. This will keep your vias as far as
possible from the actual BGA pad, and you want as much here as you can get.
This wili also allow you to use a bigger via (see below).

Secondly, you will possibly want a larger pad to drill ratio on your vias if
at all possible, to prevent massive breakouts, which while acceptable by
some standards. may be excessive with that current ratio.

One of routing numbers being batted around by some board houses is
somthing they call the five fours, which is three 4 mil gaps with two 4
mil traces, all between a 20 mil pad with 10 mil holes for 40 mil spacing on
a BGA. If your spacing on the BGA is actually 1mm, which is .03937 . . . ,
instead of 40 mil, then you have to slightly adjust the size of the pad, and
everything else will fit. Even here you are gonig to possibly see breakout,
which once again is allowable, providing that you are using teardrops for
all of your pad entries.

How big is your board anyway, overall size wise. The above numbers are based
on standard alignment of all features within 5 mil, and unless your board
is fairly large. everything seems to be very do-able with out too many
layers, or the need to go to micro vias, or ever to blind or burried vias.

JaMi

- Original Message -
From: Juha Pajunen [EMAIL PROTECTED]
To: Protel EDA Forum [EMAIL PROTECTED]
Sent: Friday, September 27, 2002 1:09 AM
Subject: [PEDA] 1020-pin BGA out-routing question (some add)


 Hi again,

  What is the best PCB layer stack for
 this type of BGA? 

 http://groups.yahoo.com/group/protel-users/files/junk/

 There is 1020-pin 1mm pitch BGA. It would be very
 pleasing to have some information and help how to
 route that huge BGA. What are trace width and cap
 between different tracks and so...

 It would be very nice if you couldedit that file
 (how to route it) and then send it to me to this
 addrss [EMAIL PROTECTED]

 I really need all useful information
 about routing this BGA! :)


 Sincerely,
 Juha Pajunen, Hw Engineer
 Bitboys Oy
 E-mail: [EMAIL PROTECTED]
 
 NOTE:  This message, and any attached files, may contain privileged or
 confidential information. It is intended for use only by the designated
 recipients. Any disclosure, copying or distribution of, or reliance upon,
 this message by anyone else is strictly prohibited.

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Re: [PEDA] 1020-pin BGA out-routing question (some add)

2002-09-27 Thread Simon Peacock


I would agree with his statements.. but there is other equally important
considerations.

First thing is use the component centre as the component origin. It will
save you headacks later, Place it on a metric (1mm) grid even if the rest of
the board is placed on an imperial grid.  (But move your board origin to
2000mil, 2000mil first).  Place the vias on a 0.5mm grid.

Increase the pad size slightly 20mil? .. unless you have a doc to say
otherwise and vias to 20mil with .3mm hole.. that's 8mil annular ring and
will be less likely to break out.

Also the tracks on the top 8mil. it fits ok.. except around the edge where
they will need to be 7 mil to keep 8mil track to track spacing (you may want
to neck down) this will give you less of a problem with under/over etch.

Then identify all the ground and power traces, they will dictate how you
layout the whole device.
I have used a XXX type arrangement for the grounds before, this seems to
work well (that is you join all the grounds with long diagonal traces and
place a via at the intersection of the traces).  This is a Motorola thing
not mine :-)  Power is usually after the GND and uses the free space created
by the GND XXX for its vias.. makes it easy to see on the bottom of the
board too. The you have to look at your signals as suggested, and determine
how many layers you will allow to route out on and how many of the signals
are high speed, matched impedances, time critical, slow speed, static etc.

Do the grid, via and traces and identify the power/GND and I will look again
:-) as will others I am sure

Simon


-Original Message-
From: JaMi Smith [mailto:[EMAIL PROTECTED]]
Sent: Saturday, 28 September 2002 7:03 a.m.
To: Protel EDA Forum
Cc: JaMi Smith
Subject: Re: [PEDA] 1020-pin BGA out-routing question (some add)


Juha,

Just looked at your database.

First, your vias are misplaced, and need to be exactly in the center of the
opening between the pads, which appear to be on a 1mm grid, which means that
you vias should be on a .5mm grid. This will keep your vias as far as
possible from the actual BGA pad, and you want as much here as you can get.
This wili also allow you to use a bigger via (see below).

Secondly, you will possibly want a larger pad to drill ratio on your vias if
at all possible, to prevent massive breakouts, which while acceptable by
some standards. may be excessive with that current ratio.

One of routing numbers being batted around by some board houses is
somthing they call the five fours, which is three 4 mil gaps with two 4
mil traces, all between a 20 mil pad with 10 mil holes for 40 mil spacing on
a BGA. If your spacing on the BGA is actually 1mm, which is .03937 . . . ,
instead of 40 mil, then you have to slightly adjust the size of the pad, and
everything else will fit. Even here you are gonig to possibly see breakout,
which once again is allowable, providing that you are using teardrops for
all of your pad entries.

How big is your board anyway, overall size wise. The above numbers are based
on standard alignment of all features within 5 mil, and unless your board
is fairly large. everything seems to be very do-able with out too many
layers, or the need to go to micro vias, or ever to blind or burried vias.

JaMi

- Original Message -
From: Juha Pajunen [EMAIL PROTECTED]
To: Protel EDA Forum [EMAIL PROTECTED]
Sent: Friday, September 27, 2002 1:09 AM
Subject: [PEDA] 1020-pin BGA out-routing question (some add)


 Hi again,

  What is the best PCB layer stack for
 this type of BGA? 

 http://groups.yahoo.com/group/protel-users/files/junk/

 There is 1020-pin 1mm pitch BGA. It would be very
 pleasing to have some information and help how to
 route that huge BGA. What are trace width and cap
 between different tracks and so...

 It would be very nice if you couldedit that file
 (how to route it) and then send it to me to this
 addrss [EMAIL PROTECTED]

 I really need all useful information
 about routing this BGA! :)


 Sincerely,
 Juha Pajunen, Hw Engineer
 Bitboys Oy
 E-mail: [EMAIL PROTECTED]
 
 NOTE:  This message, and any attached files, may contain privileged or
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