Re: [PEDA] Test point tenting on side opposite TP

2001-07-30 Thread Geoff Harland

> Joel,
>   Clicking Testpoint just marks it as a testpoint for output, but does not
> even
> automatically untent the via.  So it would allow you to have soldermask on
a
> test point.
> Hum, they might complain about that in the test department.
>Seems the only solution/work around is create separate components for
the
> top and bottom testpoints and then modify them as needed.  Protels
treatment
> of testpoints leaves something to be desired.
> Perhaps the next version will give us the control we need.  It would be
nice
> to have clearance checking for testpoint to testpoint spacing.  And also
> soldermask control for each side of the board, since you only need access
> from one side, not both.
> Carl

I was wondering why a (testpoint) component had to be designed for each side
of the PCB, as components can be moved from one side of the PCB to the
other. But having said that, the Testpoint properties of pads are *not*
updated whenever a pad is moved to the other side of a PCB, and regardless
of whether a pad is part of a component or otherwise.

Is there anyone who thinks that this behaviour is desirable? I.e. that pads'
Testpoint properties should *not* be updated whenever a pad is moved to the
other side of a PCB. (Maybe the user should be polled as to whether *none*
of the pads and vias being "flipped" have their Testpoint properties
updated, or *all* of these, or whether the user will be polled for *each* of
these.)

Vias are also problematic in this regard. (Although it is less likely for
vias to be incorporated within footprints, this is still possible though.)
And a related issue is what should happen to each via's LowLayer and
HighLayer properties when vias are moved from one side of the PCB to the
other. At present, these don't change, but a case could be made that the
outside layer of all "blind" vias should toggle (even though this could
result in vias using layer pairs which have not been defined by the user).
Comments from other users on this one?

I do not disagree with the concept of enhanced "padstacks" support
(supporting, among other things, through-hole pads and vias having a
soldermask opening on one side of the PCB but not on the other), and I have
advocated this to some extent in the past. But I am also of the view that
this is "can of worms" territory, because of issues as to whether the
desired outcome should be achieved by using Design Rules, or dialog box
entries, or by *either* of those methods. In some ways, the ideal would be
to support either method, but a proper implementation of that approach would
require dialog box entries to "auto-create" corresponding Design Rules, so
that settings for pads and vias can be determined/checked either by viewing
Design Rules or by viewing dialog box contents. But Design Rules could be
problematic when the pads and vias these are applied to are not fully
"identifiable"; if only *some* vias are to be masked on one side only (for
instance), how are these to be identifed (via Design Rule entities)?

Again, comments from others on this matter would be welcomed. (I have
previously suggested that perhaps vias could support a name/designator
property, so that Design Rules could be applied to vias on a selective
basis, the selection criteria being of course based on the name assigned to
each via.)

Regards,
Geoff Harland.
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Re: [PEDA] Test point tenting on side opposite TP

2001-07-30 Thread Schattke, Carl

Joel,
  Clicking Testpoint just marks it as a testpoint for output, but does not
even
automatically untent the via.  So it would allow you to have soldermask on a
test point.
Hum, they might complain about that in the test department.
   Seems the only solution/work around is create separate components for the
top and bottom testpoints and then modify them as needed.  Protels treatment
of testpoints leaves something to be desired.
Perhaps the next version will give us the control we need.  It would be nice
to have clearance checking for testpoint to testpoint spacing.  And also
soldermask control for each side of the board, since you only need access
from one side, not both.  
Carl

-Original Message-
From: Joel Hammer [mailto:[EMAIL PROTECTED]]
Sent: Friday, July 27, 2001 10:27 AM
To: 'Protel EDA Forum'
Subject: Re: [PEDA] Test point tenting on side opposite TP


carl,

have you clicked "top" or "bottom" test point in the pad/properties dialog
box? (double click on pad in component editor) i've not had any problems in
using that for a single-sided tp and not a th via.

hope this helps.

Joel L. Hammer
PCB Layout/Cad Specialist
E2 Enterprises Inc.
636.949.9101 Ext. 26
www.e2enterprises.com


> -Original Message-
> From: Schattke, Carl [mailto:[EMAIL PROTECTED]]
> Sent: Friday, July 27, 2001 11:36 AM
> To: Protel EDA Forum
> Subject: [PEDA] Test point tenting on side opposite TP
>
>
> Hello,
>Has anyone figured out a work around so test points will
> only be exposed
> on
> the tested side and tented on the untested side (like under
> fine pitch SMT
> components)?
>Editing the Gerber's is the only way I know to do this now.  :(
> I would prefer something that be reproducible after revisions
> are made.
>Any news about a new version coming?
>
> Sincerely,
> Carl Schattke, C.I.D.
> Intel Corporation,  ACT
> Sr. Hardware Engineer ( PCB Design)
> 122 Saratoga Ave. Suite 100
> Santa Clara, CA 95052
> Office 408-556-3122
> Fax 408-261-5869
> 24 Hr. Ph. 888-204-3704
> Email:  [EMAIL PROTECTED]
>
>
>

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Re: [PEDA] Test point tenting on side opposite TP

2001-07-28 Thread Joel Hammer

carl,

have you clicked "top" or "bottom" test point in the pad/properties dialog
box? (double click on pad in component editor) i've not had any problems in
using that for a single-sided tp and not a th via.

hope this helps.

Joel L. Hammer
PCB Layout/Cad Specialist
E2 Enterprises Inc.
636.949.9101 Ext. 26
www.e2enterprises.com


> -Original Message-
> From: Schattke, Carl [mailto:[EMAIL PROTECTED]]
> Sent: Friday, July 27, 2001 11:36 AM
> To: Protel EDA Forum
> Subject: [PEDA] Test point tenting on side opposite TP
>
>
> Hello,
>Has anyone figured out a work around so test points will
> only be exposed
> on
> the tested side and tented on the untested side (like under
> fine pitch SMT
> components)?
>Editing the Gerber's is the only way I know to do this now.  :(
> I would prefer something that be reproducible after revisions
> are made.
>Any news about a new version coming?
>
> Sincerely,
> Carl Schattke, C.I.D.
> Intel Corporation,  ACT
> Sr. Hardware Engineer ( PCB Design)
> 122 Saratoga Ave. Suite 100
> Santa Clara, CA 95052
> Office 408-556-3122
> Fax 408-261-5869
> 24 Hr. Ph. 888-204-3704
> Email:  [EMAIL PROTECTED]
>
>
>

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Re: [PEDA] Test point tenting on side opposite TP

2001-07-27 Thread Ian Wilson

On 03:39 PM 27/07/2001 -0700, Abd ul-Rahman Lomax said:

>Then make a solder mask expansion design rule to tent the pad for each 
>class as desired. Top and bottom masks can be subject to different design 
>rules by adding layer scope as the second term in the rule selection criteria.

Restricting with layer scope will work for surface pads only.  It is not 
possible to apply different mask expansions depending upon the layer, using 
design rules for multi-layer pads.  I have written on this subject quite a 
number for times in the past and believe it is a significant oversight in 
the behavior of the program.

There is no method in Protel of automatically tenting the top but not the 
bottom (or visa-versa) of a multi-layer pad/via using design rules.

I also do testpoints as single pin components.  They are 1mm round with a 5 
mil think arc radius 47.5 mil on a mech layer to allow easy determination 
of our desired 100 mil TP clearance (we also set up design rules to check 
for this).  The Protel TP finder does not allow you to specify minimum TP 
clearance so is not useful. As others have said the advantages of using a 
TP component are:
1) the TP is shown on the sch, which is a huge boon
2) full control of layer and tenting
3) testpoints can usually be located off vias (which one board stuffer has 
informed us is their preference where possible as it reduces the incidence 
of via barrels damaged by test probes).

Ian Wilson

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Re: [PEDA] Test point tenting on side opposite TP

2001-07-27 Thread Abd ul-Rahman Lomax

At 12:29 PM 7/27/01 -0700, Schattke, Carl wrote:

>I have test points on both sides due to the high density of the product.
>   I am using vias for test points in some locations, so if I give them a
>negative expansion
>then I will be covering my testpoints with mask.
>   Making parts for each testpoint may be my only way.  With several hundred
>points it is
>more than a minor chore, but it would give me consistent results.  But even
>through hole parts don't let us manipulate the top and bottom masks
>separately.
>   We really need Protel to give us access to the soldermask pads on the top
>and bottom.

I haven't done this, but here is how I would look to do it.

If using components for test points, make a component class for top access 
and a component class for bottom access. You may be able to use the class 
generator to make a class of all selected components.

Then make a solder mask expansion design rule to tent the pad for each 
class as desired. Top and bottom masks can be subject to different design 
rules by adding layer scope as the second term in the rule selection criteria.

You could also use separate footprints for the top and bottom parts. Tent 
them all, but on the top-test-point footprint place a "pad" on the top 
solder mask layer of the footprint of the appropriate size, and analogously 
on the bottom.


[EMAIL PROTECTED]
Abdulrahman Lomax
P.O. Box 690
El Verano, CA 95433

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Re: [PEDA] Test point tenting on side opposite TP

2001-07-27 Thread Reed Woltering

I have two different testpoint components in my library, one for topside,
one for bottom. This way you can just select them by pattern and edit
the mask expansion.

Reed

At 12:29 PM 7/27/01 -0700, you wrote:
>Reed,
>   Your solution would work if all the test points are on one side.
>I have test points on both sides due to the high density of the product.
>   I am using vias for test points in some locations, so if I give them a
>negative expansion
>then I will be covering my testpoints with mask.
>   Making parts for each testpoint may be my only way.  With several hundred
>points it is
>more than a minor chore, but it would give me consistent results.  But even
>through hole parts don't let us manipulate the top and bottom masks
>separately.
>   We really need Protel to give us access to the soldermask pads on the top
>and bottom.
>Carl
>
>
>-Original Message-
>From: Reed Woltering [mailto:[EMAIL PROTECTED]]
>Sent: Friday, July 27, 2001 11:34 AM
>To: Protel EDA Forum
>Subject: Re: [PEDA] Test point tenting on side opposite TP
>
>
>The way I do this is to simply plot the soldermask for the side with the
>testpoints
>normally, and then select the testpoints, and edit the soldermask expansion
>for
>them to be negative, (ex: 30 mil TP gets -15mil expansion) and plot the
>opposite
>side to bury them in the mask.
>
>Reed Woltering
>Cad Manager
>Ariel Corporation
>
>At 09:35 AM 7/27/01 -0700, you wrote:
> >Hello,
> >Has anyone figured out a work around so test points will only be
>exposed
> >on
> >the tested side and tented on the untested side (like under fine pitch SMT
> >components)?
> >Editing the Gerber's is the only way I know to do this now.  :(
> >I would prefer something that be reproducible after revisions are made.
> >Any news about a new version coming?
> >
> >Sincerely,
> >Carl Schattke, C.I.D.
> >Intel Corporation,  ACT
> >Sr. Hardware Engineer ( PCB Design)
> >122 Saratoga Ave. Suite 100
> >Santa Clara, CA 95052
> >Office 408-556-3122
> >Fax 408-261-5869
> >24 Hr. Ph. 888-204-3704
> >Email:  [EMAIL PROTECTED]
> >
> >

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Re: [PEDA] Test point tenting on side opposite TP

2001-07-27 Thread Schattke, Carl

Reed,
  Your solution would work if all the test points are on one side.
I have test points on both sides due to the high density of the product.
  I am using vias for test points in some locations, so if I give them a
negative expansion 
then I will be covering my testpoints with mask.   
  Making parts for each testpoint may be my only way.  With several hundred
points it is 
more than a minor chore, but it would give me consistent results.  But even
through hole parts don't let us manipulate the top and bottom masks
separately.  
  We really need Protel to give us access to the soldermask pads on the top
and bottom.
Carl


-Original Message-
From: Reed Woltering [mailto:[EMAIL PROTECTED]]
Sent: Friday, July 27, 2001 11:34 AM
To: Protel EDA Forum
Subject: Re: [PEDA] Test point tenting on side opposite TP


The way I do this is to simply plot the soldermask for the side with the 
testpoints
normally, and then select the testpoints, and edit the soldermask expansion 
for
them to be negative, (ex: 30 mil TP gets -15mil expansion) and plot the 
opposite
side to bury them in the mask.

Reed Woltering
Cad Manager
Ariel Corporation

At 09:35 AM 7/27/01 -0700, you wrote:
>Hello,
>Has anyone figured out a work around so test points will only be
exposed
>on
>the tested side and tented on the untested side (like under fine pitch SMT
>components)?
>Editing the Gerber's is the only way I know to do this now.  :(
>I would prefer something that be reproducible after revisions are made.
>Any news about a new version coming?
>
>Sincerely,
>Carl Schattke, C.I.D.
>Intel Corporation,  ACT
>Sr. Hardware Engineer ( PCB Design)
>122 Saratoga Ave. Suite 100
>Santa Clara, CA 95052
>Office 408-556-3122
>Fax 408-261-5869
>24 Hr. Ph. 888-204-3704
>Email:  [EMAIL PROTECTED]
>
>

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Re: [PEDA] Test point tenting on side opposite TP

2001-07-27 Thread Reed Woltering

The way I do this is to simply plot the soldermask for the side with the 
testpoints
normally, and then select the testpoints, and edit the soldermask expansion 
for
them to be negative, (ex: 30 mil TP gets -15mil expansion) and plot the 
opposite
side to bury them in the mask.

Reed Woltering
Cad Manager
Ariel Corporation

At 09:35 AM 7/27/01 -0700, you wrote:
>Hello,
>Has anyone figured out a work around so test points will only be exposed
>on
>the tested side and tented on the untested side (like under fine pitch SMT
>components)?
>Editing the Gerber's is the only way I know to do this now.  :(
>I would prefer something that be reproducible after revisions are made.
>Any news about a new version coming?
>
>Sincerely,
>Carl Schattke, C.I.D.
>Intel Corporation,  ACT
>Sr. Hardware Engineer ( PCB Design)
>122 Saratoga Ave. Suite 100
>Santa Clara, CA 95052
>Office 408-556-3122
>Fax 408-261-5869
>24 Hr. Ph. 888-204-3704
>Email:  [EMAIL PROTECTED]
>
>

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Re: [PEDA] Test point tenting on side opposite TP

2001-07-27 Thread Mike Reagan

Carl ,

What I have done in the past:   I have our engineer layout his design with a
TESTPOINT symbol on each net.  This can be done on each sheet or can be
attached as the last page(s) of the schematic. I create a surface mount pad
according to my  test requirements.  The pad will also include a keepout
circle drawn on one the mechanical layers so that I can observe the min
testpoint to testpoint spacing.
I design and route my board first without the TESTPOINTS. Then  I load the
netlist and now the testpoints points. I move  one testpoint at time an
locate them on existing vias. and pads  only on  the side that will be
tested.  This method has proved flawless for me because I can inspect every
testpoint as I am placing them for clearances, and it insures that every
testpoint is accessible and can be identified.
When you are done generate a Pick and place  report , extract the TP data
and presto you have every location for testing.   And hopefully you meet
your test requirements.  Feel free to email if you have any questions

Mike Reagan
EDSI
Frederick MD
[EMAIL PROTECTED]


- Original Message -
From: Schattke, Carl <[EMAIL PROTECTED]>
To: Protel EDA Forum <[EMAIL PROTECTED]>
Sent: Friday, July 27, 2001 12:35 PM
Subject: [PEDA] Test point tenting on side opposite TP


> Hello,
>Has anyone figured out a work around so test points will only be
exposed
> on
> the tested side and tented on the untested side (like under fine pitch SMT
> components)?
>Editing the Gerber's is the only way I know to do this now.  :(
> I would prefer something that be reproducible after revisions are made.
>Any news about a new version coming?
>
> Sincerely,
> Carl Schattke, C.I.D.
> Intel Corporation,  ACT
> Sr. Hardware Engineer ( PCB Design)
> 122 Saratoga Ave. Suite 100
> Santa Clara, CA 95052
> Office 408-556-3122
> Fax 408-261-5869
> 24 Hr. Ph. 888-204-3704
> Email:  [EMAIL PROTECTED]
>
>
>

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