The greatest difficulty is maintaining the 60 ohm impedance required for the SDRAM bus. To accomplish this we're finding it's necessary to use 4 mil micro vias in 11 mil BGA pads, and to get close to 60 ohms we need 3 mil traces on the outer layers of an RCC board.
Are there any good alternatives to RCC that will allow us to use thicker dielectric adjacent to the outer layers (thus wider traces) and still maintain the 4 mil holes? Can anyone recommend a good fab house for this kind of design?
Thanks,
JM
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