Jim,

We have done a couple of 0.8mm BGA designs with 4 mil laser drilled �Via 
and 4 mil tracks - it all depends the capabilities of your manufacturer! 
Regarding the RCC thikness; keep in mind that laser drilled Vias typically 
will have an aspect ratio 1, no more no less! Meaning no chance to play 
with dielectric thikness just with the dielectric constant of the material 
selected. Again here: talk to your manufacturer what his capabilities are.

Hope this helps,

Emanuel

---
MPL AG                                   www.mpl.ch
Emanuel Zimmermann       [EMAIL PROTECTED]
Manager R&D                       Phone: +41 56 483'34'34
Taefernstrasse 20               Fax:      +41 56 493'30'20

CH-5405 Daettwil
---

[EMAIL PROTECTED] wrote on 26.10.2004 09:32:05:

> Is anyone reliably designing and building boards using .5 mm pitch 
BGA's? 
> We're currently doing a layout using these little monsters!
> 
> The greatest difficulty is maintaining the 60 ohm impedance required for 

> the SDRAM bus. To accomplish this we're finding it's necessary to use 4 
mil 
> micro vias in 11 mil BGA pads, and to get close to 60 ohms we need 3 mil 

> traces on the outer layers of an RCC board.
> 
> Are there any good alternatives to RCC that will allow us to use thicker 

> dielectric adjacent to the outer layers (thus wider traces) and still 
> maintain the 4 mil holes? Can anyone recommend a good fab house for this 

> kind of design?
> 
> Thanks,
> 
> JM
> 
> 
> 
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