have you looked at the padstack option in DXP ?
(not sure it applies to vias)
but the drop list drops down to the floor, looks like a lot of work

it sounds like maybe a smarter DRC option would handle this rather than
a padstack type setup

Dennis Saputelli


"Michael Reagan (EDSI)" wrote:
> 
> One feature I would like to see in "future" releases or service packs is
> removal of inner pads before processing gerber data.  In other terms inner
> pads would not be added to a via until a connection is made to that via.
> The reason for this is for high density connectors where I am trying to
> route between pad, I often get violations, when in fact the real gerber data
> will have no clearance  violations after gerbers are processed with removed
> inner pads.   This would allow proper routing in high density connectors.
> The padstack for a via would automatically represent the a via the way it
> really looks to the fabricator not to the designer.
> 
> An no ,I dont want to go the way Accel did with their complicated padstacks
> because then I have to spend time creating a complex stack library with
> silly names.  Editing vias in either PADS or Accel is time consuming,   I
> like being able to double click and everything about that object appears.
> 
> Anybody is welcome to add to this.
> 
> Mike Reagan
> EDSI
> Frederick MD
> 

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