On 02:05 PM 8/10/2002 -0700, JaMi Smith said:

>what are you saying and meaning when you speak of "unbalanced copper".
>
>first - to my knowledge we are not talking about 1/2 oz on one side and 1 oz
>on the other side, which is does in fact cause uneven etching problems, but
>that was not stated in the original post that I responded to, nd as far as I
>know this is not the topic of this discussion.
>
>secondly - we are not talking about the "warpage" issue which I specifically
>excluded.
>
>all that taken into consideration, given the proper circulation of the
>etchant (which includes removal of the etched copper now in solution),
>copper is copper, and etchant is etchant, and a specific etchant will remove
>a specific thickness of copper in a given period of time, irrespective of
>whether we are talking about a 1/4 sqiare inch area or a 10 square inch
>area.

Jami,

Chemistry is not one dimensional.  It takes longer to etch a few microns 
off a large area of copper than it does a small area.  Balanced copper as 
being discussed is a general even density across the design.  It has been a 
standard desire by almost all board houses I have spoken to over the last 
20 years that I have been doing boards.

We have a company in this country that does very high end work.  The do 
their etch on 2 micron copper plated boards (plasma plating is one of their 
first steps).  This very fine layer means very tight edge control and under 
etch etc (they will do 2 mil tracks as a special and padsless-vias I think).

I refer you to their capability page:
http://www.lintek.com.au/boa.htm

Note the text "(Tolerance on track widths is +- 0.008mm or better depending 
on the design and uniformity of copper distribution.)"

If you want to continue the discussion I suggest you make contact with a 
number of PCB makers and speak to their process engineers first.

Ian Wilson

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