Have you asked Microchip what they think about the use? They have always
been very helpful when I have asked them about their ic's and the ratings.
/Martin
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yes i saw the ROC. my main reason for loosely interpreting the max ratings
and going with something within that range was to reduce components (for
level shifting and what not). I imagine the better way for me to interpret
is to think that the closer I get to the MAX ratings the more likely it
This was taken fron Absolute Maximum Ratings. There is a note right under
them:
"Notice: Stresses above those listed under “Absolute Maximum Ratings” may
cause permanent damage to the device. This is a stress rating only, and
functional operation of the device at those or any other conditions
This thread was from a few months ago but wanted to add something. First
those chips are pretty cool due to their size so i'll have to try soem at
some point.
Secondly people keep saying the HV5530 needs 12V logic. I've run these at
3.3V and all seems to be good. I based this on the data
I'm using one on a one-tube board I am making (a bit excessive for one
tube, but it is small, 5V and can sink a decent current). At the moment I
have one on a breadboard. They work as advertised! I picked up some
Adafruit QFN44 adapters from digikey and had a stencil made to do the
reflow
I’ve got the HV5623 chips, really small stuff. Currently I’m designing a
board, but I don’t have any experience with SMD components, so probably
this will never work. Anyway, the plan is to feed the board with 5V over a
micro-usb connector and to mount Yan’s new tiny PSU and a ESP32 on the
Having a thermal pad does wonders. A PLCC package, in socket or not, has to
dissipate heat mainly through its body, because heat transfers to other
parts of the board only via legs. In practice, almost all power is
dissipated through plastic. Thermal pad allows to mostly transfer the heat
to
I use the HV9808. 32 bits, hardware blanking, 5v control lines. Just set VPP
to, say, 75V using a zener. Easy Peasy to program using an Arduino and the SPI
library.
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My guess is that the usually known norms are only meant for AC Mains
Voltage where you have to expect 220V RMS, meaning the peak is around 350V
and you have to calculate with multiple kA short-circuit current in case of
a short circuit.
Since Microchip clearly does not target hobby
I'm a bit concerned about spacing between pads. The device states it is
able to switch voltages as high as 220V. The QFN package has spacing
between the pads is nominally 0,25mm. This is violating norms about PCB
spacing vs. voltage, the least strict norm I found states that 0,4mm
spacing is
Nick, note that the 3.4W are "absolute maximum" which usually means the part is
going to die if you go over that.
The part it self needs only 5V@25mA (when switching) plus the losses of the hv
switches.
In a nixie clock i guess there are always only 3 outputs on per chip.
I use the plcc
I was surprised that the data sheet didn't give more thermal information
relating to the pad - the chip, under load, dissipates up to 3.4W in a
very small package, so the pad is important.
It'd have to be reflow for it to work - that along with appropriate board
design to carry the heat
I've used a heat gun to remove surface mount parts, but never to install
one. I removed a device that looks like the aforementioned QFN, and the
metal die-paddle on the bottom took a lot of heat to remove the part. I
toasted the PCB because there was no heat-control; the PCB delaminated and
Very interesting, thanks! I will order some of these chips but I think I
will not be able to solder them correctly. There are some videos on youtube
showing how to solder QFN packages using tons of flux and hot air...
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