Hi Kirk
We have the same problem on one of our pcb assy.
What we have done is put a circular keepout on 3 layers around the thru
hole component lead, and added several vias around the perimeter of the
pad ( on a 150 mil radius ). This ensures an easy solder. But we do not
have
On 12:30 PM 21/02/2001 +1100, Michael Beavis said:
> >
> > Would you indulge my curiosity ? How is "thermal relief" better than
>direct
> > connect on your board ?
> >
> > --
> > David Cary
> >
>
>Jumping in
>Soldering pth vias on planes improves the reliability of the connection and
>to achieve
I should clarify the issue. The problem is that we are using two GND planes
and GND polygon fills top and bottom. Soldering GND pads is very
difficult(soldering iron stick to the pad), because you effectively have to
heat four planes. Our thinking was that if we could reduce the thermal
couplin
>
> Would you indulge my curiosity ? How is "thermal relief" better than
direct
> connect on your board ?
>
> --
> David Cary
>
Jumping in
Soldering pth vias on planes improves the reliability of the connection and
to achieve this, thermal relief is recommended (IPC-D-279).
Cyclic thermal excurs
> > I think that's just the way it is
> > you can do a convert to pads and rebuild
> > but why do you want it that way?
> >
> > Dennis Saputelli
>
> We are hand soldering the prototypes and having a hard time heating all
the
> copper attached to the GND vias. The reliefs on the polygon fill might
Kirk,
as has been mentioned several times in the replies you have gotten
so far, you can't get there from here. Not without converting the vias to
free pads Therefore after they will be stupid Free pads and they will be
replaced by Vias, but not deleted themselves, if you reroute. One or t
We are hand soldering the prototypes and having a hard time heating all the
copper attached to the GND vias. The reliefs on the polygon fill might make
it a little easier to solder.
-Original Message-
From: Dennis Saputelli [mailto:[EMAIL PROTECTED]]
Sent: Monday, February 19, 2001 7:06
At 18:22 19.02.01 -0800, you wrote:
>We do a ground polygon fill on the top and bottom of our boards. Has anyone
>been successful getting relief connections on vias?
No. As far as I know, Protel allways connects the vias direct to planes and
fills.
Convert the vias to free pads, there's a comma
I think that's just the way it is
you can do a convert to pads and rebuild
but why do you want it that way?
Dennis Saputelli
Kirk Haderlie wrote:
>
> We do a ground polygon fill on the top and bottom of our boards. Has anyone
> been successful getting relief connections on vias? I have tried a
Dear Kirk Haderlie,
If you really want a "thermal relief" on your vias, listen to Ian Wilson.
On the other hand, I don't want "thermal relief" on any of my vias. I always
want direct connect on my boards. (When I double-click my polygons, I make sure
"[Y] pour over same net" is enabled, and
On 06:22 PM 19/02/2001 -0800, Kirk Haderlie said:
>We do a ground polygon fill on the top and bottom of our boards. Has anyone
>been successful getting relief connections on vias? I have tried a polygon
>connect style design rule that applied only to vias on the GND net but this
>does not work.
11 matches
Mail list logo
