At 18:22 19.02.01 -0800, you wrote:
>We do a ground polygon fill on the top and bottom of our boards.  Has anyone
>been successful getting relief connections on vias?

No. As far as I know, Protel allways connects the vias direct to planes and 
fills.
Convert the vias to free pads, there's a command t oto this somewhere. Then 
you can apply your rules to free pads.
Vias are supposed (by Protel) only to connect between layers, not to solder 
something in it. So they do not need a thermal relief.


Edi

>   I have tried a polygon
>connect style design rule that applied only to vias on the GND net but this
>does not work.
>
>Kirk Haderlie
>Design Engineer
>Vivid Image Technology
>[EMAIL PROTECTED]



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