Hi Kirk
We have the same problem on one of our pcb assy.
What we have done is put a circular keepout on 3 layers around the thru
hole component lead, and added several vias around the perimeter of the
pad ( on a 150 mil radius ). This ensures an easy solder. But we do not
have high current concerns. Just a thought to get you thinking in a new
direction.
Bob Fearon
Kirk Haderlie wrote:
> I should clarify the issue. The problem is that we are using two GND planes
> and GND polygon fills top and bottom. Soldering GND pads is very
> difficult(soldering iron stick to the pad), because you effectively have to
> heat four planes. Our thinking was that if we could reduce the thermal
> coupling on the polygon fills, soldering might be a little easier. I think
> our solution will be a design rule turning off all thermal relief to pads.
> Then we will use vias to stitch the polygon fills to the GND planes. This
> will reduce the thermal coupling on the pads making it easier to solder.
>
>
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
* This message sent by: PROTEL EDA USERS MAILING LIST
*
* Use the "reply" command in your email program to
* respond to this message.
*
* To unsubscribe from this mailing list use the form at
* the Association web site. You will need to give the same
* email address you originally used to subscribe (do not
* give an alias unless it was used to subscribe).
*
* Visit http://www.techservinc.com/protelusers/subscrib.html
* to unsubscribe or to subscribe a new email address.
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
________________________________________________________
To leave the EDAFORUM discussion list, send a email with
'leave edaforum' in the body to '[EMAIL PROTECTED]'
More Information : http://www.dolist.net
