before pouring , switch off the online DRC , 'Pour over same net' and
'remove dead copper'
since you have only that on thse layers no need to have the pouring
algorithm look for this stuff.
that should speed it up somewhat
Michael Reagan (EDSI) wrote:
>Question to smartest of smartest designers out there:
>
>Here is the delima, we have a board appox 24 x 30 ( a very large
>backplane) , many thousands of connections, every layer controlled
>impedance. The boards are used for high speed tele comminications
>switching and data monitoring. ( No the the tele com industry is not dead).
>The designs are as many as 28 layers, some approching .250 inch in
>thickness, a very expensive baord to design and manufacture.
>
>On the outer layers we avoid placing traces, since we embed the entire
>design, The outer layer are copper pours tied to gnd to reduce EMI and to
>maintain controlled Z on the next inner layer. The copper is poured on both
>the top and bottom layers.
>
>Copper pours of this size are poured last because they are time consuming.
>The pours can take 4 hours, and even longer if they are not right the first
>time. Question to any of the best out there.....can we avoid a copper pour
>and merge a gnd layer to the top? Does anyone have a method or suggestion
>to merge copper to flood the top layer. Is there a quicker method? We
>are using 99SE on aa 1 gig cpu with 512 meg.
>
>Mike Reagan
>EDSI
>
>
>************************************************************************
>* Tracking #: C05FC4455FDD074E8E0D19C321C392CAC217810D
>*
>************************************************************************
>
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