Re: [PEDA] spacebar doesn't rotate components anymore

2003-06-03 Thread Leo Potjewijd
At 02/06/2003 10:19, I wrote:
Hi folks,
leave it to Leo to crash into weird stuff: the PCB editor refuses to 
rotate components when I press the spacebar.

snippety-snip

I am convinced I messed something up, but what?
To somewhat answer my own question: I renamed the AdvPCB99SE.INI and 
restarted Protel.
It works again!  Those INI files are magical files!!
I tried looking at the file in detail, but could not find obvious faults. 
Most of it is fairly straightforward though, that enabled me to recover 
some of the settings (colours mostly).
Oh well.

Leo Potjewijd
hardware designer
IE Keyprocessor bv.
[EMAIL PROTECTED]
+31 20 4620700


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Re: [PEDA] spacebar doesn't rotate components anymore

2003-06-03 Thread Leo Potjewijd
At 02/06/2003 11:00, Mattias wrote:

I believe that the component drag setting may influence this behavior too
if I remember correctly. Try to change that setting under preferences.
BINGO. That was the culprit. Thanks!

Leo Potjewijd
hardware designer
IE Keyprocessor bv.
[EMAIL PROTECTED]
+31 20 4620700


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Re: [PEDA] spacebar doesn't rotate components anymore

2003-06-03 Thread ajenkins
They are, and they aren't
They are, because a whole lot of inexplicable problems beyond the standard
plethora of inexplicable problems with Protel EDA can be traced
right back to the often inexplicable and all too common corruption of the
file(s)
They aren't because they are often corrupted and result in inexplicable
problems AND because they don't contain a host of elements which other
programs use to allow the user control over default program behaviors.

aj

- When in doubt, delete the ini files and then, iffn and after the app comes
back, just rebuild your entire customization scheme. Just like magic, with
only five timez the work!

 From: Leo Potjewijd [mailto:[EMAIL PROTECTED]
 
 At 02/06/2003 10:19, I wrote:
 Hi folks,
 leave it to Leo to crash into weird stuff: the PCB editor refuses to 
 rotate components when I press the spacebar.
 
 snippety-snip
 
 I am convinced I messed something up, but what?
 
 To somewhat answer my own question: I renamed the AdvPCB99SE.INI and 
 restarted Protel.
 It works again!  Those INI files are magical files!!
 I tried looking at the file in detail, but could not find 
 obvious faults. 
 Most of it is fairly straightforward though, that enabled me 
 to recover 
 some of the settings (colours mostly).
 Oh well.
 


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[PEDA] eight-layer stackup

2003-06-03 Thread Michael Biggs
 Anyone have a preferred method of stackup guidelines of web references to
layer stackups for 8 layers using four power planes and four signal layers?
I am torn between two methods being that I have two internal power planes.
Thanks for any help!
 Also I have a couple of BGA's on this layout and when I run (using
Protel99SE) my DRC everything is great other than the dogbones I had to
route to the via on all the unused pins of the BGA. Any way to create rules
for this so I do not get violations during DRC?
Thanks again!

MichaelB


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Re: [PEDA] eight-layer stackup

2003-06-03 Thread Michael Biggs
oops I mean four internal planes, two being power and two being ground
planes..
sorry

-Original Message-
From: Michael Biggs [mailto:[EMAIL PROTECTED]
Sent: Monday, June 02, 2003 3:21 PM
To: 'Protel EDA Forum'
Subject: [PEDA] eight-layer stackup


 Anyone have a preferred method of stackup guidelines of web references to
layer stackups for 8 layers using four power planes and four signal layers?
I am torn between two methods being that I have two internal power planes.
Thanks for any help!
 Also I have a couple of BGA's on this layout and when I run (using
Protel99SE) my DRC everything is great other than the dogbones I had to
route to the via on all the unused pins of the BGA. Any way to create rules
for this so I do not get violations during DRC?
Thanks again!

MichaelB



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Re: [PEDA] eight-layer stackup

2003-06-03 Thread Bagotronix Tech Support
I'd probably do it this way (top to bottom):

sig
gnd1
pwr1
sig
sig
gnd2
pwr2
sig

Assumptions:  your highest-speed parts are on the top side.  gnd1 and pwr1
are your main power rails for the highest-speed parts.

Whatever you do, keep each gnd plane and it's matching pwr plane adjacent to
each other - the distributed capacitance of this arrangement helps in
decoupling the supply rails.  This is in addition to your decoupling caps,
not to replace them.

I don't have anything to say about the dogbones.  I'm still using cat
treats...

Best regards,
Ivan Baggett
Bagotronix Inc.
website:  www.bagotronix.com


- Original Message -
From: Michael Biggs [EMAIL PROTECTED]
To: 'Protel EDA Forum' [EMAIL PROTECTED]
Sent: Monday, June 02, 2003 4:20 PM
Subject: [PEDA] eight-layer stackup


 Anyone have a preferred method of stackup guidelines of web references to
 layer stackups for 8 layers using four power planes and four signal
layers?
 I am torn between two methods being that I have two internal power planes.
 Thanks for any help!
  Also I have a couple of BGA's on this layout and when I run (using
 Protel99SE) my DRC everything is great other than the dogbones I had to
 route to the via on all the unused pins of the BGA. Any way to create
rules
 for this so I do not get violations during DRC?
 Thanks again!

 MichaelB




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Re: [PEDA] Mechanical symbol?

2003-06-03 Thread JaMi Smith
Natalie,

While some prefer to do something like that in another package, such as
AutoCad, there are those that like to do it here in Protel 99 SE

I know a number of people wo use one of the mechanical Layers as a PWB
Detail (Fab Dwg), by putting on a Border and Title Block and Standard Notes,
and just using that as the startup template for any new board.

When you use the PCB Wizard in Protel 99 SE to create a new job (after
creating a new file, rightclick on the background in your main window of
your new .ddb  and select New . . . and then select the Wizards Tab and then
doubleclick on Printed Circuit Board Wizard), the Wizard itself uses
templates to generate a new PCB document for you. These templates are stored
in a database called templates.ddb located in your Program Files\Design
Explorer 99 SE\System directory.

You can modify an existing template to suit your needs, or make a new one of
your own. I can't remember all of the details involved in setting up your
own template, but possibly others in the forum can help you there.

The only thing you I would say that you have to watch out for here is the
size of the negatives since your board shop might generate film the size of
your complete drawing and charge you for it if you have that layer turned on
when you generate your Gerbers.

Hope that this is of some help.

JaMi

* * * * * * * * *


- Original Message -
From: Natalie DeGennaro [EMAIL PROTECTED]
Cc: [EMAIL PROTECTED]
Sent: Thursday, May 29, 2003 10:16 AM
Subject: [PEDA] Mechanical symbol?


 Hi,

 I am a newbie to this group, having just started learning Protel DXP. But
 I am a senior designer having used other software.

 I would like to make my fabrication notes (and possibly my fab drawing
 title block) into a symbol I can call in on every board. Is this possible
 on this software? From what I read in the Help section, all components
 have to have a pin definition in them. I don't want pins, I just want
 dummy text and lines in the shape of a Titleblock and notes. Is this
 possible?

 I can make a DXF file to do this but I would rather have a symbol to call
 in.

 Thanks for all help,
 Natalie





 [EMAIL PROTECTED]
 04/22/03 06:36 AM


 To: [EMAIL PROTECTED]@Internet
 cc: (bcc: Natalie DeGennaro/Americas/NSC)
 Subject:Re: [PEDA] Import PCB

 Leo-

 May be that the Gerbers are RS274 rather than RS274X.

 For RS274, Protel needs to have the Aperture file loaded before importing
 the
 Gerbers themselvesotherwise, you get a black screen after the Gerber
 load.
 Aperture list must be in the bundle if Camtastic is finding it, tho the
 file
 extension may not be .apt.

 Brian








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Re: [PEDA] eight-layer stackup

2003-06-03 Thread JaMi Smith
MichaelB,

While there may be some way somewhere to make Protel ignore those dogbones
and vias, DRC wise, I don't think that there is a way to do it easily short
of putting them on the schematic, possibly as test points, so that each of
them actually becomes a real net it the netlist. You could turn off some
of your Design Rules, but that would really just be asking for more trouble.

Myself, I have had the very same problem with the identical requirements
(needing to take each BGA contact to the back of the board with a via), and
I just live with the errors. I have accepted the fact that even if I were to
do a perfect board in Protel 99 SE, that there would still be some little
DRC error somewhere. Protel DRC just doesn't map to reality in all cases, as
there is always some need for some special requirement that Protel just
can't handle, so you look at the DRC error, and accept it as is, and live
with the error in the report file and that little iridescent glow here and
there on the on the screen. I find that the trick for me is to reset the
errors once I have examined them, and that way they are not just sitting
there staring me in the face as I continue working on the design.

Respecting the layer stack up, I myself would prefer to go with 2 outer
routing layers, 2 planes under that on each side, and then another 2 routing
layers in the middle.

But before you even get that far, I think that you need to ask whether any
of the signals may have any special requirements, such as controlled
impedance, or matched lengths, or isolation, or the necessity to be routed
over a specific plane.

I would also suggest that you definitely look into using separate complete
layers for power and ground under your BGA as opposed to trying to juggle
split planes.

It may well be that due to the type of signals you are dealing with (LVDS /
high speed / controlled impedance / susceptible to crosstalk), you might
have to go with isolating the internal signal routing layers as layers 3 and
6 with the two power layers as 4 and 5.

What type and size of BGA are you dealing with? Any special routing
requirements?

JaMi

* * * * * * * * *

- Original Message -
From: Michael Biggs [EMAIL PROTECTED]
To: 'Protel EDA Forum' [EMAIL PROTECTED]
Sent: Monday, June 02, 2003 1:20 PM
Subject: [PEDA] eight-layer stackup


 Anyone have a preferred method of stackup guidelines of web references to
 layer stackups for 8 layers using four power planes and four signal
layers?
 I am torn between two methods being that I have two internal power planes.
 Thanks for any help!
  Also I have a couple of BGA's on this layout and when I run (using
 Protel99SE) my DRC everything is great other than the dogbones I had to
 route to the via on all the unused pins of the BGA. Any way to create
rules
 for this so I do not get violations during DRC?
 Thanks again!

 MichaelB




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Re: [PEDA] eight-layer stackup

2003-06-03 Thread Nathan Horsfield
Michael

The text book standard that  is

1signal
2gnd
3signal
4gnd
5pwr
6signal
7pwr
8signal
thou never actually using 8 layers this is all i can give you. Hope it 
helps.

Nathan

BTW  the reference is PCB design techniques for emc compliance by mark 
montrose. 2nd Edition

Michael Biggs wrote:

Anyone have a preferred method of stackup guidelines of web references to
layer stackups for 8 layers using four power planes and four signal layers?
I am torn between two methods being that I have two internal power planes.
Thanks for any help!
Also I have a couple of BGA's on this layout and when I run (using
Protel99SE) my DRC everything is great other than the dogbones I had to
route to the via on all the unused pins of the BGA. Any way to create rules
for this so I do not get violations during DRC?
Thanks again!
MichaelB

 

--
Nathan Horsfield 
Inspiration Technology P/L 
Ph:  +61 8 8211 9668
Fax: +61 8 8211 9658 
www.instech.com.au





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[PEDA] Earth to PEDA

2003-06-03 Thread JaMi Smith
Earth to PEDA . . .

Earth to PEDA . . .

What's the story on the lightning fast turnaround on the Forum distribution
. . .

JaMi



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Re: [PEDA] eight-layer stackup

2003-06-03 Thread Julian Higginson

 From: JaMi Smith [mailto:[EMAIL PROTECTED]

 While there may be some way somewhere to make Protel ignore 
 those dogbones
 and vias, DRC wise, I don't think that there is a way to do 
 it easily short
 of putting them on the schematic, possibly as test points, so 
 that each of
 them actually becomes a real net it the netlist. You could 
 turn off some
 of your Design Rules, but that would really just be asking 
 for more trouble.
 
yeah there is a way:

Don't use synchronisation in the ddb, use NETLIST GENERATION and NETLIST
LOADING. 

In the netlist generation in schematic, you can tell it to include unnamed
single pin nets. You will then get nets assigned to all your unused pins on
your BGA.

 I would also suggest that you definitely look into using separate 
 complete layers for power and ground under your BGA as opposed
 to trying to juggle split planes.

Jeez. How many layers does he have spare for power planes?? my BGA needed 3
of the buggers. Split planes are the only way to go. Just be really careful
not to bridge them with a through hole pin like I did... 



Julian
(who got his BGA board not reporting errors, and the BGA part of it is fine)



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Re: [PEDA] metric footprint

2003-06-03 Thread Rene Tschaggelar
Is there no footprint given in a manufacturers datasheet ?
It just a minute or two to make this footprint, much faster than
a websearch.

Rene

Tim Fifield wrote:
 
 Does anybody have a footprint for a SSOP24-P-300-1.00B?
 
 The part is a Toshiba TPD7203F gate driver IC. Pin pitch is 1mm and body
 with pin width is 8mm. IPC-SM-782 book doesn't have anything and I can't
 quickly find anything else on the web. I'm going to keep searching but I
 thought I'd ask here too.


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Re: [PEDA] six or eight-layer (or more?) stackups

2003-06-03 Thread Matt Polak
At 10:57 AM 6/3/2003 +0930, you wrote:
Michael

The text book standard that  is

1signal
2gnd
3signal
4gnd
5pwr
6signal
7pwr
8signal
thou never actually using 8 layers this is all i can give you. Hope it helps.
Out of curiosity, what is the typical textbook stackup for a 
six-layer board? Do you typically have two signal, two power, two ground 
planes, or can you have, say, three signals layers and two power and one 
ground plane? i.e.

1. signal
2. gnd
3. pwr
4. signal
5. pwr
6. signal
I would imagine this should be fine if there are no plane splits, 
save for possibly some on 3, since all signal layers would be directly 
adjacent to at least one unbroken plane... Or is my thinking flawed on 
this? Four layer is easy, and eight makes sense... But how do you typically 
work up the more oddball ones like six or ten or (shudder) even twenty two? 
I am looking at a design now that I think will probably require at least 
three signal layers to route, but I think an eight-layer board would be 
something of an overkill and would like to stick to six.

How do folks typically deal with distributing power to parts that 
require separate core and I/O, maybe different cores for different parts on 
the board? For instance, multiple FPGAs that require a 2.5v core and 3.3v 
IO, and a DSP which requires a 1.8v core and 3.3v IO? Obviously 3.3v should 
probably have it's own power plane across the board, but can you take an 
inner power layer (like #3 in the above example) and split it between 1.8v 
and 2.5v as needed to source the core voltages as and where needed?

I've done four layer boards fine this far; my approach (under QFP 
FPGAs that required 2.5v core and 3.3v IO) was to pour a polygon-plane on 
the top signal layer under the chip, and to connect this to all of the 
necessary pins, decouple the living daylights out of it, and then run a 
very fat trace on the back of the board over to the 2.5v regulator. It 
seems to have worked just fine on the latest run of boards - very clean 
power being supplied to all of the core pins - but I'm always interested in 
other's approaches that may be better suited to these kinds of situations.

Someone really needs to write a modern 'style guide' to multilayer 
PCB layout, y'know? Not just the math and theory covered in several of the 
better books out there, but one also covering component layout techniques, 
approaches to signal and bus routing, shapes and patterns of via layout for 
moving busses from one layer to the other nicely, how to route *special* 
signals (differential, controlled impedance, matched length, etc), how to 
efficiently break out BGAs, and so forth. Certainly would make life a 
little easier for us newbies! :D

Regards,
-- Matt


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Re: [PEDA] metric footprint

2003-06-03 Thread John Haddy
Try:

http://tsc.jeita.or.jp/eds/DATA/PACKAGE/ED731120.PDF

John Haddy



-Original Message-
From: Rene Tschaggelar [mailto:[EMAIL PROTECTED] 
Sent: Tuesday, 3 June 2003 6:51 PM
To: Protel EDA Forum
Subject: Re: [PEDA] metric footprint


Is there no footprint given in a manufacturers datasheet ?
It just a minute or two to make this footprint, much faster than a
websearch.

Rene

Tim Fifield wrote:
 
 Does anybody have a footprint for a SSOP24-P-300-1.00B?
 
 The part is a Toshiba TPD7203F gate driver IC. Pin pitch is 1mm and 
 body with pin width is 8mm. IPC-SM-782 book doesn't have anything and 
 I can't quickly find anything else on the web. I'm going to keep 
 searching but I thought I'd ask here too.




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Re: [PEDA] six or eight-layer (or more?) stackups

2003-06-03 Thread Jason Morgan
If you used the construction you suggest you'd encounter a problem with
copper balance.

It would appear either during board manufacture or reflow, or both. 

The mass of copper on 2/3 is different to 4/5 so the board will be badly
bent or twisted.
(The coefficient of expansion of copper is different to prepreg and FR4).
The forces generated
on a layer during heating depend on the density of copper in any given area.

If you want a guide to PCB lay-up, I suggest you talk to your board house.
Ours publishes a
really useful guide, see www.graphic.plc.uk  Each houses capabilities differ
depending
on their techniques and equipment, though there are general industry and
practical rules
too.


Jason.

-Original Message-
From: Matt Polak [mailto:[EMAIL PROTECTED]
Sent: 03 June 2003 10:12
To: Protel EDA Forum
Subject: Re: [PEDA] six or eight-layer (or more?) stackups


At 10:57 AM 6/3/2003 +0930, you wrote:
Michael

The text book standard that  is

1signal
2gnd
3signal
4gnd
5pwr
6signal
7pwr
8signal

thou never actually using 8 layers this is all i can give you. Hope it
helps.

 Out of curiosity, what is the typical textbook stackup for a 
six-layer board? Do you typically have two signal, two power, two ground 
planes, or can you have, say, three signals layers and two power and one 
ground plane? i.e.

1. signal
2. gnd
3. pwr
4. signal
5. pwr
6. signal

 I would imagine this should be fine if there are no plane splits, 
save for possibly some on 3, since all signal layers would be directly 
adjacent to at least one unbroken plane... Or is my thinking flawed on 
this? Four layer is easy, and eight makes sense... But how do you typically 
work up the more oddball ones like six or ten or (shudder) even twenty two? 
I am looking at a design now that I think will probably require at least 
three signal layers to route, but I think an eight-layer board would be 
something of an overkill and would like to stick to six.

 How do folks typically deal with distributing power to parts that 
require separate core and I/O, maybe different cores for different parts on 
the board? For instance, multiple FPGAs that require a 2.5v core and 3.3v 
IO, and a DSP which requires a 1.8v core and 3.3v IO? Obviously 3.3v should 
probably have it's own power plane across the board, but can you take an 
inner power layer (like #3 in the above example) and split it between 1.8v 
and 2.5v as needed to source the core voltages as and where needed?

 I've done four layer boards fine this far; my approach (under QFP 
FPGAs that required 2.5v core and 3.3v IO) was to pour a polygon-plane on 
the top signal layer under the chip, and to connect this to all of the 
necessary pins, decouple the living daylights out of it, and then run a 
very fat trace on the back of the board over to the 2.5v regulator. It 
seems to have worked just fine on the latest run of boards - very clean 
power being supplied to all of the core pins - but I'm always interested in 
other's approaches that may be better suited to these kinds of situations.

 Someone really needs to write a modern 'style guide' to multilayer 
PCB layout, y'know? Not just the math and theory covered in several of the 
better books out there, but one also covering component layout techniques, 
approaches to signal and bus routing, shapes and patterns of via layout for 
moving busses from one layer to the other nicely, how to route *special* 
signals (differential, controlled impedance, matched length, etc), how to 
efficiently break out BGAs, and so forth. Certainly would make life a 
little easier for us newbies! :D

Regards,
-- Matt




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Re: [PEDA] Mechanical symbol?

2003-06-03 Thread JaMi Smith
Natalie,

Wasn't till I got a copy of my own post back that I realized you were
talking about Protel DXP as opposed to Protel 99 SE.

I am asleep at the switch today, and assumed that because you posted to the
Protel List instead of the DXP List that you were talking about Protel 99
SE, and read the DXP in your post as DXF.

Sorry about that.

Notwithstanding my blunder, I believe that everything I said below is also
applicable to Protel DXP, with the exception that the templates.ddb file
will now be located in the \Program Files\Altium\System directory.

If you are not aware of the DXP Technical Forum, you can find it at:

 ==  http://forums.altium.com .

JaMi


- Original Message -
From: JaMi Smith [EMAIL PROTECTED]
To: Protel EDA Forum [EMAIL PROTECTED]
Cc: JaMi Smith [EMAIL PROTECTED]
Sent: Monday, June 02, 2003 5:58 PM
Subject: Re: [PEDA] Mechanical symbol?


 Natalie,

 While some prefer to do something like that in another package, such as
 AutoCad, there are those that like to do it here in Protel 99 SE

 I know a number of people wo use one of the mechanical Layers as a PWB
 Detail (Fab Dwg), by putting on a Border and Title Block and Standard
Notes,
 and just using that as the startup template for any new board.

 When you use the PCB Wizard in Protel 99 SE to create a new job (after
 creating a new file, rightclick on the background in your main window of
 your new .ddb  and select New . . . and then select the Wizards Tab and
then
 doubleclick on Printed Circuit Board Wizard), the Wizard itself uses
 templates to generate a new PCB document for you. These templates are
stored
 in a database called templates.ddb located in your Program Files\Design
 Explorer 99 SE\System directory.

 You can modify an existing template to suit your needs, or make a new one
of
 your own. I can't remember all of the details involved in setting up your
 own template, but possibly others in the forum can help you there.

 The only thing you I would say that you have to watch out for here is the
 size of the negatives since your board shop might generate film the size
of
 your complete drawing and charge you for it if you have that layer turned
on
 when you generate your Gerbers.

 Hope that this is of some help.

 JaMi

 * * * * * * * * *


 - Original Message -
 From: Natalie DeGennaro [EMAIL PROTECTED]
 Cc: [EMAIL PROTECTED]
 Sent: Thursday, May 29, 2003 10:16 AM
 Subject: [PEDA] Mechanical symbol?


  Hi,
 
  I am a newbie to this group, having just started learning Protel DXP.
But
  I am a senior designer having used other software.
 
  I would like to make my fabrication notes (and possibly my fab drawing
  title block) into a symbol I can call in on every board. Is this
possible
  on this software? From what I read in the Help section, all components
  have to have a pin definition in them. I don't want pins, I just want
  dummy text and lines in the shape of a Titleblock and notes. Is this
  possible?
 
  I can make a DXF file to do this but I would rather have a symbol to
call
  in.
 
  Thanks for all help,
  Natalie
 
 



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Re: [PEDA] six or eight-layer (or more?) stackups

2003-06-03 Thread Chris Lowe


Matt Polak wrote:

At 10:57 AM 6/3/2003 +0930, you wrote:

Michael

The text book standard that  is

1signal
2gnd
3signal
4gnd
5pwr
6signal
7pwr
8signal
thou never actually using 8 layers this is all i can give you. Hope 
it helps.


Out of curiosity, what is the typical textbook stackup for a 
six-layer board? Do you typically have two signal, two power, two 
ground planes, or can you have, say, three signals layers and two 
power and one ground plane? i.e.

1. signal
2. gnd
3. pwr
4. signal
5. pwr
6. signal
I would imagine this should be fine if there are no plane 
splits, save for possibly some on 3, since all signal layers would be 
directly adjacent to at least one unbroken plane... Or is my thinking 
flawed on this? Four layer is easy, and eight makes sense... But how 
do you typically work up the more oddball ones like six or ten or 
(shudder) even twenty two? I am looking at a design now that I think 
will probably require at least three signal layers to route, but I 
think an eight-layer board would be something of an overkill and would 
like to stick to six.

How do folks typically deal with distributing power to parts 
that require separate core and I/O, maybe different cores for 
different parts on the board? For instance, multiple FPGAs that 
require a 2.5v core and 3.3v IO, and a DSP which requires a 1.8v core 
and 3.3v IO? Obviously 3.3v should probably have it's own power plane 
across the board, but can you take an inner power layer (like #3 in 
the above example) and split it between 1.8v and 2.5v as needed to 
source the core voltages as and where needed?

I've done four layer boards fine this far; my approach (under 
QFP FPGAs that required 2.5v core and 3.3v IO) was to pour a 
polygon-plane on the top signal layer under the chip, and to connect 
this to all of the necessary pins, decouple the living daylights out 
of it, and then run a very fat trace on the back of the board over to 
the 2.5v regulator. It seems to have worked just fine on the latest 
run of boards - very clean power being supplied to all of the core 
pins - but I'm always interested in other's approaches that may be 
better suited to these kinds of situations.

Someone really needs to write a modern 'style guide' to 
multilayer PCB layout, y'know? Not just the math and theory covered in 
several of the better books out there, but one also covering component 
layout techniques, approaches to signal and bus routing, shapes and 
patterns of via layout for moving busses from one layer to the other 
nicely, how to route *special* signals (differential, controlled 
impedance, matched length, etc), how to efficiently break out BGAs, 
and so forth. Certainly would make life a little easier for us 
newbies! :D

Regards,
-- Matt
the main issue with an odd number of plane is the PCB becomes unbalenced 
and so is more likely to warp.  with the 6 layer setup suggested this 
should not be to bad but could cause issues, particularly if the middle 
sugnal layer is lightly used.  If you are using a layup where you have 
an od number of planes then it can often be worth adding some ground 
flods to the appropriate signal layer to help with the copper balence



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