On 12:05 PM 14/02/2003 -0500, Mike Reagan said:
Any chance of placing large rectangular fills to do the bulk of the "pours" and then adding smaller pours around the edges to fill in. This would definitely speed things up. Or place a big pour covering most of the area, or less dense areas, with a huge track size (and grid=0) and then use a finer pour on the more complex areas? What about using a internal plane and an signal layer as a pair and get a photo merge done? Oh yeah - you are using every single layer.Ivan, I had one design with those little itsy bitsy tiny logic chips amounted to 4500 chips. The Backplane it fit into was 24x 36 , only one fabricator in the country was able to make it. It used every layer both signal and planes that Protel had. Then on top of that, the backplane designer had poured copper on the outer layers. We are working with a board house now to allow them to do the copper pours on the exterior. The copper pours are killing us for time.
How thick is the board? 6mm?
Ian
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